Takashi Kuroki

Person

Yokohama, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Multilayer electronic part, its manufacturing method, two-dimension...
- Patent number 6,798,059
- Issue date Sep 28, 2004
- Hitachi, Ltd.
- Shosaku Ishihara
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Grant
Conductor paste containing high amounts of either molybdenum or tun...
- Patent number 5,236,630
- Issue date Aug 17, 1993
- Hitachi, Ltd.
- Hideo Arima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic substrates for microelectronic circuits and process for pro...
- Patent number 4,935,285
- Issue date Jun 19, 1990
- Hitachi, Ltd.
- Gyozo Toda
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Process for producing ceramic substrates for microelectronic circuits
- Patent number 4,817,276
- Issue date Apr 4, 1989
- Hitachi, Ltd.
- Gyozo Toda
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Ceramic wiring substrate and process for producing the same
- Patent number 4,734,233
- Issue date Mar 29, 1988
- Hitachi, Ltd.
- Gyozo Toda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic wiring board and process for producing the same
- Patent number 4,608,316
- Issue date Aug 26, 1986
- Hitachi, Ltd.
- Gyozo Toda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic multilayer wiring board
- Patent number 4,604,496
- Issue date Aug 5, 1986
- Hitachi, Ltd.
- Shosaku Ishihara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electroconductive molybdenum paste
- Patent number 4,576,735
- Issue date Mar 18, 1986
- Hitachi, Ltd.
- Takashi Kuroki
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Ceramic wiring boards
- Patent number 4,465,727
- Issue date Aug 14, 1984
- Hitachi, Ltd.
- Tsuyoshi Fujita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic multilayer circuit board and a process for manufacturing th...
- Patent number 4,464,420
- Issue date Aug 7, 1984
- Hitachi, Ltd.
- Noriyuki Taguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thick-film thermal printing head
- Patent number 4,203,025
- Issue date May 13, 1980
- Hitachi, Ltd.
- Mitsuo Nakatani
- H01 - BASIC ELECTRIC ELEMENTS

Takashi Kuroki

Person

Patents Grantslast 30 patents

Multilayer electronic part, its manufacturing method, two-dimension...

Conductor paste containing high amounts of either molybdenum or tun...

Ceramic substrates for microelectronic circuits and process for pro...

Process for producing ceramic substrates for microelectronic circuits

Ceramic wiring substrate and process for producing the same

Ceramic wiring board and process for producing the same

Ceramic multilayer wiring board

Electroconductive molybdenum paste

Ceramic wiring boards

Ceramic multilayer circuit board and a process for manufacturing th...

Thick-film thermal printing head