Claims
- 1. A ceramic substrate which comprises a sintered body composed substantially of 70 to 85% by weight of mullite crystals and 30 to 15% by weight of a noncrystalline binder; said binder comprising 60 to 95% by weight of SiO.sub.2, 4 to 30% by weight of Al.sub.2 O.sub.3, and 1 to 10% by weight of MgO.
- 2. The ceramic substrate according to claim 1, on which a wiring conductor of high-melting metal is provided.
- 3. The ceramic substrate according to claim 2 through which holes are formed and filled with the same conductor as said wiring conductor.
- 4. The ceramic substrate according to claim 2, wherein said high-melting metal is tungsten or molybdenum.
Priority Claims (1)
Number |
Date |
Country |
Kind |
60-70864 |
Apr 1985 |
JPX |
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BACKGROUND OF THE INVENTION
This is a division of application Ser. No 847,302, filed Apr. 2, 1986.
US Referenced Citations (3)
Number |
Name |
Date |
Kind |
4272500 |
Eggerding et al. |
Jun 1981 |
|
4736276 |
Ushifusa et al. |
Apr 1988 |
|
4817276 |
Toda et al. |
Apr 1989 |
|
Foreign Referenced Citations (2)
Number |
Date |
Country |
0172382 |
Jul 1984 |
EPX |
0196670 |
Apr 1985 |
EPX |
Non-Patent Literature Citations (1)
Entry |
Amer. Cer. Soc. Bull., May 1984, Preparation and Properties of Mullite Cordierite Composites, Mussler et al., pp. 705-710. |
Divisions (1)
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Number |
Date |
Country |
Parent |
847302 |
Apr 1986 |
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