Takashi MURAI

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Yokohama, JP

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Patents Grantslast 30 patents

Information Patent Grant
Apparatus and method for determining a format of a wireless communi...
- Patent number 9,210,620
- Issue date Dec 8, 2015
- Fujitsu Limited
- Takashi Murai
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR WAFER CONFIGURED FOR SINGLE TOUCH-DOWN TESTING
- Publication number 20250054818
- Publication date Feb 13, 2025
- SANDISK TECHNOLOGIES, INC.
- Akira Ogawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER CONFIGURED FOR SINGLE TOUCH-DOWN TESTING
- Publication number 20240125846
- Publication date Apr 18, 2024
- SANDISK TECHNOLOGIES LLC
- Toru Miwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER CONFIGURED FOR SINGLE TOUCH-DOWN TESTING
- Publication number 20240128132
- Publication date Apr 18, 2024
- SANDISK TECHNOLOGIES LLC
- Toru Miwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER CONFIGURED FOR SINGLE TOUCH-DOWN TESTING
- Publication number 20240128134
- Publication date Apr 18, 2024
- SANDISK TECHNOLOGIES LLC
- Toru Miwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR DETERMINING A FORMAT OF A WIRELESS COMMUNI...
- Publication number 20140036867
- Publication date Feb 6, 2014
- Takashi MURAI
- H04 - ELECTRIC COMMUNICATION TECHNIQUE