Takashi Nihonmatsu

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Nagano, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method for processing semiconductor wafer and semiconductor wafer
- Patent number 7,332,437
- Issue date Feb 19, 2008
- Shin-Etsu Handotai Co., Ltd.
- Takashi Nihonmatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer polishing method and wafer polishing device
- Patent number 6,764,392
- Issue date Jul 20, 2004
- Shin-Etsu Handotai Co., Ltd.
- Takashi Nihonmatsu
- B24 - GRINDING POLISHING
Information Patent Grant
Semiconductor wafer processing method and semiconductor wafers prod...
- Patent number 6,432,837
- Issue date Aug 13, 2002
- Shin-Etsu Handotai Co., Ltd.
- Takashi Nihonmatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer processing method and semiconductor wafers prod...
- Patent number 6,346,485
- Issue date Feb 12, 2002
- Shin-Etsu Handotai Co., Ltd.
- Takashi Nihonmatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafers processing method and semiconductor wafers pro...
- Patent number 6,239,039
- Issue date May 29, 2001
- Shin-Etsu Handotai Co., Ltd.
- Takashi Nihonmatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor wafer
- Patent number 6,080,641
- Issue date Jun 27, 2000
- Shin-Etsu Handotai Co., Ltd.
- Takashi Nihonmatsu
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
Production method for silicon wafer and silicon wafer and soi wafer
- Publication number 20040072437
- Publication date Apr 15, 2004
- Naoto Iizuka
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Method for processing semiconductor wafer and semiconductor wafer
- Publication number 20030171075
- Publication date Sep 11, 2003
- Takashi Nihonmatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer polishing method and wafer polishing device
- Publication number 20020160693
- Publication date Oct 31, 2002
- Takashi Nihonmatsu
- B24 - GRINDING POLISHING
Information Patent Application
Semiconductor wafer processing method and semiconductor wafers prod...
- Publication number 20010008807
- Publication date Jul 19, 2001
- SHIN-ETSU HANDOTAI CO., LTD.
- Takashi Nihonmatsu
- H01 - BASIC ELECTRIC ELEMENTS