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Takashi Ozawa

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  • Nagano-shi, JP
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20170287805
    • Publication date Oct 5, 2017
    • Shinko Electric Industries Co., Ltd.
    • TAKASHI OZAWA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Semiconductor Device
    • Publication number 20160133541
    • Publication date May 12, 2016
    • Shinko Electric Industries Co., Ltd.
    • Takashi OZAWA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    FINGERPRINT RECOGNITION SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
    • Publication number 20160099232
    • Publication date Apr 7, 2016
    • Shinko Electric Industries Co., LTD.
    • Yukinori Hatori
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20150200175
    • Publication date Jul 16, 2015
    • Shinko Electric Industries Co., LTD.
    • Yukinori Hatori
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE
    • Publication number 20120126423
    • Publication date May 24, 2012
    • Shinko Electric Industries Co., Ltd.
    • Yukinori Hatori
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SEMICONDUCTOR PA...
    • Publication number 20110316151
    • Publication date Dec 29, 2011
    • Shinko Electric Industries Co., Ltd.
    • Takashi Ozawa
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SEMICONDUCTOR PA...
    • Publication number 20110316150
    • Publication date Dec 29, 2011
    • Shinko Electric Industries Co., Ltd.
    • Takashi OZAWA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE
    • Publication number 20100295174
    • Publication date Nov 25, 2010
    • Shinko Electric Industries Co., Ltd.
    • Takashi Ozawa
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20100252938
    • Publication date Oct 7, 2010
    • Shinko Electric Industries Co., Ltd.
    • Takashi OZAWA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WIRING BOARD, SEMICONDUCTOR DEVICE AND SEMICONDUCTOR ELEMENT
    • Publication number 20100127370
    • Publication date May 27, 2010
    • Shinko Electric Industries Co., Ltd.
    • Takashi Ozawa
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING BOARD
    • Publication number 20090283317
    • Publication date Nov 19, 2009
    • Shinko Electric Industries Co., Ltd.
    • Takashi OZAWA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    FLIP-CHIP MOUNTING SUBSTRATE AND FLIP-CHIP MOUNTING METHOD
    • Publication number 20090250812
    • Publication date Oct 8, 2009
    • Shinko Electric Industries Co., Ltd.
    • Yasushi Araki
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME, AND SEMICOND...
    • Publication number 20090102062
    • Publication date Apr 23, 2009
    • Shinko Electric Industries Co., Ltd.
    • Seiji Sato
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
    • Publication number 20080188040
    • Publication date Aug 7, 2008
    • Shinko Electric Industries Co., Ltd.
    • Takashi Ozawa
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    FLIP-CHIP MOUNTING SUBSTRATE
    • Publication number 20080142993
    • Publication date Jun 19, 2008
    • Shinko Electric Industries Co., Ltd.
    • Takashi Ozawa
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    Semiconductor module and method of manufacturing the same
    • Publication number 20070194419
    • Publication date Aug 23, 2007
    • SHINKO ELECTRIC INDUSTRIES CO. LTD.
    • Takashi Ozawa
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    FLIP-CHIP MOUNTING SUBSTRATE AND FLIP-CHIP MOUNTING METHOD
    • Publication number 20070145553
    • Publication date Jun 28, 2007
    • Shinko Electric Industries Co., Ltd.
    • Yasushi Araki
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MOUNTING SUBSTRATE AND SEMICONDUCTOR DEVICE
    • Publication number 20070108628
    • Publication date May 17, 2007
    • Shinko Electric Industries Co., Ltd.
    • Takashi Ozawa
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    Mult-chip module
    • Publication number 20040130036
    • Publication date Jul 8, 2004
    • RENESAS TECHNOLOGY CORP.
    • Masanori Owaki
    • H01 - BASIC ELECTRIC ELEMENTS