Semiconductor module and method of manufacturing the same

Abstract

A semiconductor module of the present invention includes a wiring substrate having a wiring layer, a passive component mounted to be connected to the wiring layer in a center major portion of the wiring substrate, a resin portion formed selectively in an area except the wiring layer on a peripheral side of the wiring substrate to seal the passive component, and a semiconductor chip mounted on the resin portion and connected to the wiring layer on the peripheral side of the wiring substrate via a wire.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a sectional view showing a semiconductor module in the prior art;

FIGS. 2A to 2E are sectional views showing a semiconductor module manufacturing method according to a first embodiment of the present invention;

FIG. 3 is a sectional view showing a semiconductor module according to the first embodiment of the present invention;

FIG. 4 is a sectional view showing a semiconductor module according to a variation of the first embodiment of the present invention;

FIGS. 5A to 5D are sectional views showing a semiconductor module manufacturing method according to a second embodiment of the present invention;

FIG. 6 is a sectional view showing a semiconductor module according to the second embodiment of the present invention; and

FIG. 7 is a sectional view showing a semiconductor module according to a variation of the second embodiment of the present invention.

Claims

1. A semiconductor module, comprising: a wiring substrate having a wiring layer;a passive component mounted to be connected to the wiring layer in a center major portion of the wiring substrate;a resin portion formed selectively in an area except the wiring layer on a peripheral side of the wiring substrate to seal the passive component; anda semiconductor chip mounted on the resin portion and connected to the wiring layer on the peripheral side of the wiring substrate via a wire.

2. A semiconductor module according to claim 1, further comprising: a sealing resin for sealing the semiconductor chip, the wire, and the wiring layer to which the wire is connected.

3. A semiconductor module according to claim 1, wherein a cap having a cavity is provided to the wiring substrate, and the semiconductor chip is housed into the cavity of the cap and is hermetically sealed.

4. A semiconductor module according to claim 1, wherein an area of the resin portion for sealing the passive component corresponds to a size of the semiconductor chip.

5. A semiconductor module according to claim 1, wherein a lower semiconductor chip is mounted to be flip-chip connected to the wiring layer on a side of the passive component in the center major portion of the wiring substrate, and the passive component and the lower semiconductor chip are sealed with the resin portion.

6. A semiconductor module manufacturing method, comprising the steps of: connecting and mounting a passive component to a wiring layer in a center major portion of the wiring substrate;forming selectively a resin portion, which seals the passive component, in an area except the wiring layer on a peripheral side of the wiring substrate; andadhering a semiconductor chip onto the resin layer, and connecting and mounting the semiconductor chip onto the wiring layer exposed from the peripheral side of the wiring substrate via a wire.

7. A semiconductor module manufacturing method according to claim 6, further comprising the step of: forming a sealing resin to seal the semiconductor chip, the wire, and the wiring layer to which the wire is connected, after the step of mounting the semiconductor chip.

8. A semiconductor module manufacturing method according to claim 6, further comprising the step of: providing a cap having a cavity after the step of mounting the semiconductor chip, and housing the semiconductor chip in the cavity of the cap to hermetically seal the semiconductor chip.

9. A semiconductor module manufacturing method according to claim 6, wherein the step of mounting the passive component on the wiring substrate includes the step of flip-chip connecting a lower semiconductor chip to the wiring layer on a side of the passive component, and in the step of forming selectively the resin portion, the passive component and the lower semiconductor chip are sealed with the resin portion.

10. A semiconductor module manufacturing method according to claim 6, wherein, in the step of forming the resin portion, an area of the resin portion is formed to correspond to a size of the semiconductor chip.