BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a sectional view showing a semiconductor module in the prior art;
FIGS. 2A to 2E are sectional views showing a semiconductor module manufacturing method according to a first embodiment of the present invention;
FIG. 3 is a sectional view showing a semiconductor module according to the first embodiment of the present invention;
FIG. 4 is a sectional view showing a semiconductor module according to a variation of the first embodiment of the present invention;
FIGS. 5A to 5D are sectional views showing a semiconductor module manufacturing method according to a second embodiment of the present invention;
FIG. 6 is a sectional view showing a semiconductor module according to the second embodiment of the present invention; and
FIG. 7 is a sectional view showing a semiconductor module according to a variation of the second embodiment of the present invention.