Takasi Togasaki

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Yokohama, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with improved encapsulating resin
- Patent number 5,959,363
- Issue date Sep 28, 1999
- Kabushiki Kaisha Toshiba
- Hiroshi Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with improved encapsulating resin
- Patent number 5,864,178
- Issue date Jan 26, 1999
- Kabushiki Kaisha Toshiba
- Hiroshi Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic circuit device
- Patent number 5,821,627
- Issue date Oct 13, 1998
- Kabushiki Kaisha Toshiba
- Miki Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic circuit device
- Patent number 5,684,677
- Issue date Nov 4, 1997
- Kabushiki Kaisha Toshiba
- Tatsuro Uchida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor flipchip packaging having a perimeter wall
- Patent number 5,448,114
- Issue date Sep 5, 1995
- Kabushiki Kaisha Toshiba
- You Kondoh
- H01 - BASIC ELECTRIC ELEMENTS