Takayuki Matsuzaki

Person

Tsukuba-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Flap in an adhesive tape for semiconductor manufacturing
- Patent number D804435
- Issue date Dec 5, 2017
- Hitachi Chemical Company, Ltd.
- Kouhei Taniguchi
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Tape for processing wafer, method for manufacturing tape for proces...
- Patent number 9,190,309
- Issue date Nov 17, 2015
- Hitachi Chemical Company, Ltd.
- Kouhei Taniguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tape for processing wafer, method for manufacturing tape for proces...
- Patent number 9,076,833
- Issue date Jul 7, 2015
- Hitachi Chemical Company, Ltd.
- Kouhei Taniguchi
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Wafer processing tape, method of manufacturing wafer processing tap...
- Patent number 9,076,832
- Issue date Jul 7, 2015
- Hitachi Chemical Company, Ltd.
- Kouhei Taniguchi
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Dicing/die bonding integral film, dicing/die bonding integral film...
- Patent number 8,975,161
- Issue date Mar 10, 2015
- Hitachi Chemical Company, Ltd.
- Rie Katou
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive tape for semiconductor manufacturing
- Patent number D690278
- Issue date Sep 24, 2013
- Hitachi Chemical Company, Ltd.
- Kouhei Taniguchi
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Adhesive tape for semiconductor manufacturing
- Patent number D689831
- Issue date Sep 17, 2013
- Hitachi Chemical Company, Ltd.
- Kouhei Taniguchi
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Adhesive sheet and method for manufacturing the same, semiconductor...
- Patent number 8,470,115
- Issue date Jun 25, 2013
- Hitachi Chemical Company, Ltd.
- Maiko Tanaka
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive sheet and method for manufacturing the same, semiconductor...
- Patent number 8,465,615
- Issue date Jun 18, 2013
- Hitachi Chemical Company, Ltd.
- Maiko Tanaka
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive tape for semiconductor manufacturing
- Patent number D680505
- Issue date Apr 23, 2013
- Hitachi Chemical Company, Ltd.
- Kouhei Taniguchi
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Adhesive tape for semiconductor manufacturing
- Patent number D664511
- Issue date Jul 31, 2012
- Hitachi Chemical Company, Ltd.
- Kouhei Taniguchi
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Adhesive tape for semiconductor manufacturing
- Patent number D664512
- Issue date Jul 31, 2012
- Hitachi Chemical Comapany, Ltd.
- Kouhei Taniguchi
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Adhesive tape for semiconductor manufacturing
- Patent number D656909
- Issue date Apr 3, 2012
- Hitachi Chemical Company, Ltd.
- Kouhei Taniguchi
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Adhesive tape for semiconductor manufacturing
- Patent number D656910
- Issue date Apr 3, 2012
- Hitachi Chemical Company, Ltd.
- Kouhei Taniguchi
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Adhesive composition, process for producing the same, adhesive film...
- Patent number 8,119,737
- Issue date Feb 21, 2012
- Hitachi Chemical Company, Ltd.
- Teiichi Inada
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor device by adhering circuit substrate with adhesive fi...
- Patent number 7,947,779
- Issue date May 24, 2011
- Hitachi Chemical Company, Ltd.
- Teiichi Inada
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Dicing/die bonding sheet
- Patent number 7,517,724
- Issue date Apr 14, 2009
- Hitachi Chemical Company, Ltd.
- Keiichi Hatakeyama
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Adhesive composition, method for preparing the same, adhesive film...
- Patent number 7,070,670
- Issue date Jul 4, 2006
- Hitachi Chemical Co., Ltd.
- Takeo Tomiyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
LIQUID RESIN COMPOSITION FOR SEALING AND ELECTRONIC COMPONENT APPAR...
- Publication number 20200194325
- Publication date Jun 18, 2020
- Hitachi Chemical Company, Ltd.
- Hidetoshi INOUE
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
LIQUID RESIN COMPOSITION FOR COMPRESSION MOLDING AND ELECTRONIC COM...
- Publication number 20200181392
- Publication date Jun 11, 2020
- Hitachi Chemical Company, Ltd.
- Hidetoshi INOUE
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
TAPE FOR PROCESSING WAFER, METHOD FOR MANUFACTURING TAPE FOR PROCES...
- Publication number 20150279717
- Publication date Oct 1, 2015
- HITACHI CHEMICAL COMPANY, LTD.
- Kouhei Taniguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
- Publication number 20150179494
- Publication date Jun 25, 2015
- HITACHI CHEMICAL COMPANY, LTD.
- Takashi Kawamori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM...
- Publication number 20140332984
- Publication date Nov 13, 2014
- Teiichi Inada
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ADHESIVE SHEET AND METHOD FOR MANUFACTURING THE SAME, SEMICONDUCTOR...
- Publication number 20130302570
- Publication date Nov 14, 2013
- Maiko TANAKA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ADHESIVE SHEET AND METHOD FOR MANUFACTURING THE SAME, SEMICONDUCTOR...
- Publication number 20130295314
- Publication date Nov 7, 2013
- Maiko TANAKA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
TAPE FOR PROCESSING WAFER, METHOD FOR MANUFACTURING TAPE FOR PROCES...
- Publication number 20130273718
- Publication date Oct 17, 2013
- HITACHI CHEMICAL COMPANY, LTD.
- Kouhei TANIGUCHI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
DICING/DIE BONDING INTEGRAL FILM, DICING/DIE BONDING INTEGRAL FILM...
- Publication number 20130143390
- Publication date Jun 6, 2013
- Hitachi Chemical Company, Ltd.
- Rie Katou
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ADHESIVE SHEET AND METHOD FOR MANUFACTURING THE SAME, SEMICONDUCTOR...
- Publication number 20120135176
- Publication date May 31, 2012
- Maiko TANAKA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
WAFER PROCESSING TAPE, METHOD OF MANUFACTURING WAFER PROCESSING TAP...
- Publication number 20120094471
- Publication date Apr 19, 2012
- Hitachi Chemical Company, Ltd.
- Kouhei TANIGUCHI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM...
- Publication number 20120080808
- Publication date Apr 5, 2012
- Teiichi Inada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ADHESIVE SHEET AND METHOD FOR MANUFACTURING THE SAME, SEMICONDUCTOR...
- Publication number 20120073743
- Publication date Mar 29, 2012
- Maiko TANAKA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ADHESIVE SHEET AND METHOD FOR MANUFACTURING THE SAME, SEMICONDUCTOR...
- Publication number 20120068312
- Publication date Mar 22, 2012
- Maikoi TANAKA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM...
- Publication number 20110187006
- Publication date Aug 4, 2011
- Teiichi Inada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM...
- Publication number 20110021005
- Publication date Jan 27, 2011
- Teiichi Inada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM...
- Publication number 20090186955
- Publication date Jul 23, 2009
- Teiichi Inada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Adhesive Sheet and Method for Manufacturing the Same, Semiconductor...
- Publication number 20080261039
- Publication date Oct 23, 2008
- Maiko Tanaka
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Adhesive composition, process for producing the same, adhesive film...
- Publication number 20070036971
- Publication date Feb 15, 2007
- Teiichi Inada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Dicing/die bonding sheet
- Publication number 20070026572
- Publication date Feb 1, 2007
- Keiichi Hatakeyama
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Adhesive composition, process for producing the same, adhesive film...
- Publication number 20060106166
- Publication date May 18, 2006
- Teiichi Inada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Adhesive composition, process for producing the same, adhesive film...
- Publication number 20060100315
- Publication date May 11, 2006
- Teiichi Inada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Adhesive composition, method for preparing the same, adhesive film...
- Publication number 20030159773
- Publication date Aug 28, 2003
- Takeo Tomiyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Adhesive composition , process for producing the same, adhesive fil...
- Publication number 20030069331
- Publication date Apr 10, 2003
- Inada Teiichi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Takayuki Matsuzaki

Person

Patents Grantslast 30 patents

Flap in an adhesive tape for semiconductor manufacturing

Tape for processing wafer, method for manufacturing tape for proces...

Tape for processing wafer, method for manufacturing tape for proces...

Wafer processing tape, method of manufacturing wafer processing tap...

Dicing/die bonding integral film, dicing/die bonding integral film...

Adhesive tape for semiconductor manufacturing

Adhesive tape for semiconductor manufacturing

Adhesive sheet and method for manufacturing the same, semiconductor...

Adhesive sheet and method for manufacturing the same, semiconductor...

Adhesive tape for semiconductor manufacturing

Adhesive tape for semiconductor manufacturing

Adhesive tape for semiconductor manufacturing

Adhesive tape for semiconductor manufacturing

Adhesive tape for semiconductor manufacturing

Adhesive composition, process for producing the same, adhesive film...

Semiconductor device by adhering circuit substrate with adhesive fi...

Dicing/die bonding sheet

Adhesive composition, method for preparing the same, adhesive film...

Patents Applicationslast 30 patents

LIQUID RESIN COMPOSITION FOR SEALING AND ELECTRONIC COMPONENT APPAR...

LIQUID RESIN COMPOSITION FOR COMPRESSION MOLDING AND ELECTRONIC COM...

TAPE FOR PROCESSING WAFER, METHOD FOR MANUFACTURING TAPE FOR PROCES...

METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM...

ADHESIVE SHEET AND METHOD FOR MANUFACTURING THE SAME, SEMICONDUCTOR...

ADHESIVE SHEET AND METHOD FOR MANUFACTURING THE SAME, SEMICONDUCTOR...

TAPE FOR PROCESSING WAFER, METHOD FOR MANUFACTURING TAPE FOR PROCES...

DICING/DIE BONDING INTEGRAL FILM, DICING/DIE BONDING INTEGRAL FILM...

ADHESIVE SHEET AND METHOD FOR MANUFACTURING THE SAME, SEMICONDUCTOR...

WAFER PROCESSING TAPE, METHOD OF MANUFACTURING WAFER PROCESSING TAP...

ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM...

ADHESIVE SHEET AND METHOD FOR MANUFACTURING THE SAME, SEMICONDUCTOR...

ADHESIVE SHEET AND METHOD FOR MANUFACTURING THE SAME, SEMICONDUCTOR...

ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM...

ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM...

ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM...

Adhesive Sheet and Method for Manufacturing the Same, Semiconductor...

Adhesive composition, process for producing the same, adhesive film...

Dicing/die bonding sheet

Adhesive composition, process for producing the same, adhesive film...

Adhesive composition, process for producing the same, adhesive film...

Adhesive composition, method for preparing the same, adhesive film...

Adhesive composition , process for producing the same, adhesive fil...