Takayuki Shirasaki

Person

Kokubu-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Lid, electronic component-housing package, and electronic device
- Patent number 12,136,598
- Issue date Nov 5, 2024
- Kyocera Corporation
- Takayuki Shirasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Functional element housing package, and semiconductor device and LN...
- Patent number 11,815,749
- Issue date Nov 14, 2023
- Kyocera Corporation
- Hiroyuki Nakamichi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device mounting board and semiconductor package
- Patent number 10,777,493
- Issue date Sep 15, 2020
- Kyocera Corporation
- Taito Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component mounting package and electronic device using t...
- Patent number 10,629,505
- Issue date Apr 21, 2020
- Kyocera Corporation
- Takayuki Shirasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component mounting package and electronic device
- Patent number 10,462,904
- Issue date Oct 29, 2019
- Kyocera Corporation
- Takayuki Shirasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component mounting package and electronic device
- Patent number 10,136,517
- Issue date Nov 20, 2018
- Kyocera Corporation
- Takayuki Shirasaki
- G02 - OPTICS
Information Patent Grant
Semiconductor package
- Patent number D822629
- Issue date Jul 10, 2018
- KYOCERA Corporation
- Taito Kimura
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Element housing package and mounting structure provided with same
- Patent number 9,596,779
- Issue date Mar 14, 2017
- Kyocera Corporation
- Takayuki Shirasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High frequency module comprising a transition between a wiring boar...
- Patent number 8,358,180
- Issue date Jan 22, 2013
- Kyocera Corporation
- Yoshimasa Sugimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-frequency wiring board
- Patent number 6,873,230
- Issue date Mar 29, 2005
- Kyocera Corporation
- Takayuki Shirasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-frequency wiring board
- Patent number 6,726,488
- Issue date Apr 27, 2004
- Kyocera Corporation
- Takayuki Shirasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-frequency wiring board
- Patent number 6,700,789
- Issue date Mar 2, 2004
- Kyocera Corporation
- Takayuki Shirasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting structure of high-frequency wiring board
- Patent number 6,664,874
- Issue date Dec 16, 2003
- Kyocera Corporation
- Takayuki Shirasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
WIRING BOARD, PACKAGE FOR CONTAINING ELECTRONIC COMPONENT, ELECTRON...
- Publication number 20240306302
- Publication date Sep 12, 2024
- KYOCERA CORPORATION
- Takayuki SHIRASAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC ELEMENT STORING PACKAGE AND ELECTRONIC DEVICE
- Publication number 20240258674
- Publication date Aug 1, 2024
- KYOCERA CORPORATION
- Takayuki SHIRASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE FOR ACCOMMODATING ELECTRONIC ELEMENT, AND ELECTRONIC DEVICE
- Publication number 20240195142
- Publication date Jun 13, 2024
- KYOCERA CORPORATION
- Takayuki Shirasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LID, ELECTRONIC COMPONENT-HOUSING PACKAGE, AND ELECTRONIC DEVICE
- Publication number 20220406727
- Publication date Dec 22, 2022
- KYOCERA CORPORATION
- Takayuki SHIRASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE FOR STORING FUNCTIONAL ELEMENT, SEMICONDUCTOR DEVICE AND LN...
- Publication number 20210208428
- Publication date Jul 8, 2021
- KYOCERA CORPORATION
- Hiroyuki NAKAMICHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT MOUNTING PACKAGE AND ELECTRONIC DEVICE
- Publication number 20190269014
- Publication date Aug 29, 2019
- Kyocera Corporation
- Takayuki SHIRASAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE MOUNTING BOARD AND SEMICONDUCTOR PACKAGE
- Publication number 20190221507
- Publication date Jul 18, 2019
- KYOCERA CORPORATION
- Taito KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT MOUNTING PACKAGE AND ELECTRONIC DEVICE
- Publication number 20180255641
- Publication date Sep 6, 2018
- KYOCERA CORPORATION
- Takayuki SHIRASAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT MOUNTING PACKAGE AND ELECTRONIC DEVICE USING T...
- Publication number 20180145003
- Publication date May 24, 2018
- KYOCERA CORPORATION
- Takayuki SHIRASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELEMENT HOUSING PACKAGE AND MOUNTING STRUCTURE PROVIDED WITH SAME
- Publication number 20160081216
- Publication date Mar 17, 2016
- KYOCERA CORPORATION
- Takayuki SHIRASAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
High Frequency Wiring Board, Package for Housing Electronic Compone...
- Publication number 20100308940
- Publication date Dec 9, 2010
- KYOCERA CORPORATION
- Takayuki Shirasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
High-Frequency Module and Wiring Board
- Publication number 20100231332
- Publication date Sep 16, 2010
- KYOCERA CORPORATION
- Yoshimasa Sugimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High-frequency wiring board
- Publication number 20040119565
- Publication date Jun 24, 2004
- KYOCERA CORPORATION
- Takayuki Shirasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
High-frequency wiring board
- Publication number 20030133279
- Publication date Jul 17, 2003
- KYOCERA CORPORATION
- Takayuki Shirasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
High-frequency wiring board
- Publication number 20030077924
- Publication date Apr 24, 2003
- KYOCERA CORPORATION
- Takayuki Shirasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Mounting structure of high-frequency wiring board
- Publication number 20030043558
- Publication date Mar 6, 2003
- Takayuki Shirasaki
- H01 - BASIC ELECTRIC ELEMENTS

Takayuki Shirasaki

Person

Patents Grantslast 30 patents

Lid, electronic component-housing package, and electronic device

Functional element housing package, and semiconductor device and LN...

Semiconductor device mounting board and semiconductor package

Electronic component mounting package and electronic device using t...

Electronic component mounting package and electronic device

Electronic component mounting package and electronic device

Semiconductor package

Element housing package and mounting structure provided with same

High frequency module comprising a transition between a wiring boar...

High-frequency wiring board

High-frequency wiring board

High-frequency wiring board

Mounting structure of high-frequency wiring board

Patents Applicationslast 30 patents

WIRING BOARD, PACKAGE FOR CONTAINING ELECTRONIC COMPONENT, ELECTRON...

ELECTRONIC ELEMENT STORING PACKAGE AND ELECTRONIC DEVICE

PACKAGE FOR ACCOMMODATING ELECTRONIC ELEMENT, AND ELECTRONIC DEVICE

LID, ELECTRONIC COMPONENT-HOUSING PACKAGE, AND ELECTRONIC DEVICE

PACKAGE FOR STORING FUNCTIONAL ELEMENT, SEMICONDUCTOR DEVICE AND LN...

ELECTRONIC COMPONENT MOUNTING PACKAGE AND ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE MOUNTING BOARD AND SEMICONDUCTOR PACKAGE

ELECTRONIC COMPONENT MOUNTING PACKAGE AND ELECTRONIC DEVICE

ELECTRONIC COMPONENT MOUNTING PACKAGE AND ELECTRONIC DEVICE USING T...

ELEMENT HOUSING PACKAGE AND MOUNTING STRUCTURE PROVIDED WITH SAME

High Frequency Wiring Board, Package for Housing Electronic Compone...

High-Frequency Module and Wiring Board

High-frequency wiring board

High-frequency wiring board

High-frequency wiring board

Mounting structure of high-frequency wiring board