Takayuki TAJIMA

Person

Sagamihara, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing semiconductor device having chip stacked a...
- Patent number 11,923,287
- Issue date Mar 5, 2024
- Kabushiki Kaisha Toshiba
- Takayuki Tajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching method
- Patent number 11,901,185
- Issue date Feb 13, 2024
- Kabushiki Kaisha Toshiba
- Mitsuo Sano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing same
- Patent number 11,270,934
- Issue date Mar 8, 2022
- Kabushiki Kaisha Toshiba
- Takayuki Tajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having chip stacked and molded
- Patent number 11,227,826
- Issue date Jan 18, 2022
- Kabushiki Kaisha Toshiba
- Takayuki Tajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a re-interconnection layer and metho...
- Patent number 10,658,338
- Issue date May 19, 2020
- TOSHIBA MEMORY CORPORATION
- Takayuki Tajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor device and the semiconductor...
- Patent number 10,128,153
- Issue date Nov 13, 2018
- Kabushiki Kaisha Toshiba
- Takayuki Tajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming wiring of a semiconductor device
- Patent number 8,859,415
- Issue date Oct 14, 2014
- Kabushiki Kaisha Toshiba
- Takayuki Tajima
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CAPACITOR AND METHOD OF MANUFACTURING CAPACITOR
- Publication number 20240395458
- Publication date Nov 28, 2024
- Kabushiki Kaisha Toshiba
- Susumu OBATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING STRUCTURE AND METHOD OF MANUFACTURING CAPAC...
- Publication number 20230298907
- Publication date Sep 21, 2023
- Kabushiki Kaisha Toshiba
- Mitsuo Sano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING APPARATUS AND ETCHING METHOD
- Publication number 20230091900
- Publication date Mar 23, 2023
- Kabushiki Kaisha Toshiba
- Takayuki TAJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING METHOD
- Publication number 20230077915
- Publication date Mar 16, 2023
- Kabushiki Kaisha Toshiba
- Mitsuo SANO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220310582
- Publication date Sep 29, 2022
- Kabushiki Kaisha Toshiba
- Susumu OBATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING METHOD
- Publication number 20220301877
- Publication date Sep 22, 2022
- Kabushiki Kaisha Toshiba
- Mitsuo SANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR CHIP, AND MET...
- Publication number 20220115238
- Publication date Apr 14, 2022
- Kabushiki Kaisha Toshiba
- Takayuki TAJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING CHIP STACKED AND MOLDED
- Publication number 20220102262
- Publication date Mar 31, 2022
- Kabushiki Kaisha Toshiba
- Takayuki TAJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND MANUFACTURING APP...
- Publication number 20210313194
- Publication date Oct 7, 2021
- Kabushiki Kaisha Toshiba
- Takayuki TAJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20200266089
- Publication date Aug 20, 2020
- KABUSHIKI KAISHA TOSHIBA
- Kazuo SHIMOKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURNG SAME
- Publication number 20200098678
- Publication date Mar 26, 2020
- KABUSHIKI KAISHA TOSHIBA
- Takayuki TAJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20190287895
- Publication date Sep 19, 2019
- KABUSHIKI KAISHA TOSHIBA
- Takayuki TAJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20190267350
- Publication date Aug 29, 2019
- Toshiba Memory Corporation
- Takayuki TAJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING A SEMICONDUCTOR DEVICE AND THE SEMICONDUCTOR...
- Publication number 20160365340
- Publication date Dec 15, 2016
- KABUSHIKI KAISHA TOSHIBA
- Takayuki TAJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20150270203
- Publication date Sep 24, 2015
- KABUSHIKI KAISHA TOSHIBA
- Hideo NISHIUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING WIRING OF A SEMICONDUCTOR DEVICE
- Publication number 20120231625
- Publication date Sep 13, 2012
- Takayuki TAJIMA
- H01 - BASIC ELECTRIC ELEMENTS

Takayuki TAJIMA

Person

Patents Grantslast 30 patents

Method for manufacturing semiconductor device having chip stacked a...

Etching method

Semiconductor device and method for manufacturing same

Semiconductor device having chip stacked and molded

Semiconductor device including a re-interconnection layer and metho...

Method of fabricating a semiconductor device and the semiconductor...

Method of forming wiring of a semiconductor device

Patents Applicationslast 30 patents

CAPACITOR AND METHOD OF MANUFACTURING CAPACITOR

METHOD OF MANUFACTURING STRUCTURE AND METHOD OF MANUFACTURING CAPAC...

ETCHING APPARATUS AND ETCHING METHOD

ETCHING METHOD

SEMICONDUCTOR DEVICE

ETCHING METHOD

ETCHING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR CHIP, AND MET...

SEMICONDUCTOR DEVICE HAVING CHIP STACKED AND MOLDED

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND MANUFACTURING APP...

CARRIER AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURNG SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

METHOD OF FABRICATING A SEMICONDUCTOR DEVICE AND THE SEMICONDUCTOR...

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

METHOD OF FORMING WIRING OF A SEMICONDUCTOR DEVICE