Takayuki Uda

Person

Hadano-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Sealing structure for multi-chip module
- Patent number 7,518,233
- Issue date Apr 14, 2009
- Hitachi, Ltd.
- Kouichi Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector and an electronic apparatus having electronic parts conne...
- Patent number 7,004,760
- Issue date Feb 28, 2006
- Hitachi, Ltd.
- Katsuro Kawazoe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device for sealing and cooling multi-chip modules
- Patent number 6,890,799
- Issue date May 10, 2005
- Hitachi, Ltd.
- Takahiro Daikoku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device for sealing and cooling multi-chip modules
- Patent number 6,528,878
- Issue date Mar 4, 2003
- Hitachi, Ltd.
- Takahiro Daikoku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Input-output circuit cell and semiconductor integrated circuit appa...
- Patent number 6,355,984
- Issue date Mar 12, 2002
- Hitachi, Ltd.
- Kazuhisa Miyamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip module
- Patent number 6,281,575
- Issue date Aug 28, 2001
- Hitachi, Ltd.
- Toru Nishikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Input-output circuit cell and semiconductor integrated circuit appa...
- Patent number 6,222,278
- Issue date Apr 24, 2001
- Hitachi, Ltd.
- Kazuhisa Miyamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Input-output circuit cell and semiconductor integrated circuit appa...
- Patent number 6,121,687
- Issue date Sep 19, 2000
- Hitachi, Ltd.
- Kazuhisa Miyamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device bonding method and electronic circuit apparatus
- Patent number 5,973,406
- Issue date Oct 26, 1999
- Hitachi, Ltd.
- Masahide Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device and methods for production...
- Patent number 5,519,658
- Issue date May 21, 1996
- Hitachi, Ltd.
- Takayuki Uda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device and methods for production...
- Patent number 5,360,988
- Issue date Nov 1, 1994
- Hitachi, Ltd.
- Takayuki Uda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor integrated circuit device
- Patent number 5,223,454
- Issue date Jun 29, 1993
- Hitachi, Ltd.
- Takayuki Uda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor integrated circuit device
- Patent number 5,049,972
- Issue date Sep 17, 1991
- Hitachi, Ltd.
- Takayuki Uda
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Connector and an electronic apparatus having electronic parts conne...
- Publication number 20050020116
- Publication date Jan 27, 2005
- Katsuro Kawazoe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device for sealing and cooling multi-chip modules
- Publication number 20030103333
- Publication date Jun 5, 2003
- Hitachi, Ltd
- Takahiro Daikoku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Input-output circuit cell and semiconductor integrated circuit appa...
- Publication number 20010022402
- Publication date Sep 20, 2001
- Kazuhisa Miyamoto
- H01 - BASIC ELECTRIC ELEMENTS

Takayuki Uda

Person

Patents Grantslast 30 patents

Sealing structure for multi-chip module

Connector and an electronic apparatus having electronic parts conne...

Device for sealing and cooling multi-chip modules

Device for sealing and cooling multi-chip modules

Input-output circuit cell and semiconductor integrated circuit appa...

Multi-chip module

Input-output circuit cell and semiconductor integrated circuit appa...

Input-output circuit cell and semiconductor integrated circuit appa...

Electronic device bonding method and electronic circuit apparatus

Semiconductor integrated circuit device and methods for production...

Semiconductor integrated circuit device and methods for production...

Method of manufacturing semiconductor integrated circuit device

Method of manufacturing semiconductor integrated circuit device

Patents Applicationslast 30 patents

Connector and an electronic apparatus having electronic parts conne...

Device for sealing and cooling multi-chip modules

Input-output circuit cell and semiconductor integrated circuit appa...