Takehiko KAI

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Wireless module and method for manufacturing the same
- Patent number 10,868,364
- Issue date Dec 15, 2020
- Taiyo Yuden Co., Ltd.
- Takehiko Kai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component module and method of manufacturing the same
- Patent number 10,756,024
- Issue date Aug 25, 2020
- Taiyo Yuden Co., Ltd.
- Kenzo Kitazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wireless module and method for manufacturing wireless module
- Patent number 10,714,822
- Issue date Jul 14, 2020
- Taiyo Yuden Co., Ltd.
- Jin Mikata
- B32 - LAYERED PRODUCTS
Information Patent Grant
Wireless module and method for manufacturing wireless module
- Patent number 10,665,936
- Issue date May 26, 2020
- Taiyo Yuden Co., Ltd.
- Jin Mikata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing electronic component module
- Patent number 10,529,668
- Issue date Jan 7, 2020
- Taiyo Yuden Co., Ltd.
- Kenzo Kitazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making plural electronic component modules
- Patent number 10,490,512
- Issue date Nov 26, 2019
- Taiyo Yuden Co., Ltd.
- Kenzo Kitazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit module and method of producing the same
- Patent number 9,807,916
- Issue date Oct 31, 2017
- Taiyo Yuden Co., Ltd.
- Kenzo Kitazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit module and method of producing circuit module
- Patent number 9,456,488
- Issue date Sep 27, 2016
- Taiyo Yuden Co., Ltd.
- Masaya Shimamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit module and production method therefor
- Patent number 9,455,209
- Issue date Sep 27, 2016
- Taiyo Yuden Co., Ltd.
- Eiji Mugiya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit module and method of producing circuit module
- Patent number 9,018,039
- Issue date Apr 28, 2015
- Taiyo Yuden Co., Ltd.
- Eiji Mugiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit module and method of producing circuit module
- Patent number 8,890,309
- Issue date Nov 18, 2014
- Taiyo Yuden Co., Ltd.
- Eiji Mugiya
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MAKING PLURAL ELECTRONIC COMPONENT MODULES
- Publication number 20190237409
- Publication date Aug 1, 2019
- Taiyo Yuden Co., Ltd.
- Kenzo Kitazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT MODULE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180286796
- Publication date Oct 4, 2018
- Taiyo Yuden Co., Ltd.
- Kenzo Kitazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT MODULE
- Publication number 20180286816
- Publication date Oct 4, 2018
- Taiyo Yuden Co., Ltd.
- Kenzo Kitazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING ELECTRONIC COMPONENT MODULE
- Publication number 20180286817
- Publication date Oct 4, 2018
- Taiyo Yuden Co., Ltd.
- Kenzo Kitazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRELESS MODULE AND METHOD FOR MANUFACTURING WIRELESS MODULE
- Publication number 20180159209
- Publication date Jun 7, 2018
- Taiyo Yuden Co., Ltd.
- Jin MIKATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRELESS MODULE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20180159216
- Publication date Jun 7, 2018
- Taiyo Yuden Co., Ltd.
- Takehiko KAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRELESS MODULE AND METHOD FOR MANUFACTURING WIRELESS MODULE
- Publication number 20180159217
- Publication date Jun 7, 2018
- Taiyo Yuden Co., Ltd.
- Jin MIKATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT MODULE AND METHOD OF PRODUCING CIRCUIT MODULE
- Publication number 20150070849
- Publication date Mar 12, 2015
- Taiyo Yuden Co., Ltd.
- Masaya SHIMAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT MODULE AND METHOD OF PRODUCING THE SAME
- Publication number 20150070851
- Publication date Mar 12, 2015
- Taiyo Yuden Co., Ltd.
- Kenzo KITAZAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT MODULE
- Publication number 20150062835
- Publication date Mar 5, 2015
- Taiyo Yuden Co., Ltd.
- Takehiko KAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT MODULE AND METHOD OF PRODUCING CIRCUIT MODULE
- Publication number 20150044822
- Publication date Feb 12, 2015
- Taiyo Yuden Co., Ltd.
- Eiji MUGIYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT MODULE AND METHOD OF PRODUCING THE SAME
- Publication number 20150043189
- Publication date Feb 12, 2015
- Taiyo Yuden Co., Ltd.
- Kenzo KITAZAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT MODULE AND METHOD OF PRODUCING THE SAME
- Publication number 20150016066
- Publication date Jan 15, 2015
- Taiyo Yuden Co., Ltd.
- Masaya SHIMAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT MODULE AND PRODUCTION METHOD THEREFOR
- Publication number 20140293550
- Publication date Oct 2, 2014
- Taiyo Yuden Co., Ltd.
- Eiji MUGIYA
- H01 - BASIC ELECTRIC ELEMENTS

Takehiko KAI

Person

Patents Grantslast 30 patents

Wireless module and method for manufacturing the same

Electronic component module and method of manufacturing the same

Wireless module and method for manufacturing wireless module

Wireless module and method for manufacturing wireless module

Method of manufacturing electronic component module

Method of making plural electronic component modules

Circuit module and method of producing the same

Circuit module and method of producing circuit module

Circuit module and production method therefor

Circuit module and method of producing circuit module

Circuit module and method of producing circuit module

Patents Applicationslast 30 patents

METHOD OF MAKING PLURAL ELECTRONIC COMPONENT MODULES

ELECTRONIC COMPONENT MODULE AND METHOD OF MANUFACTURING THE SAME

ELECTRONIC COMPONENT MODULE

METHOD OF MANUFACTURING ELECTRONIC COMPONENT MODULE

WIRELESS MODULE AND METHOD FOR MANUFACTURING WIRELESS MODULE

WIRELESS MODULE AND METHOD FOR MANUFACTURING THE SAME

WIRELESS MODULE AND METHOD FOR MANUFACTURING WIRELESS MODULE

CIRCUIT MODULE AND METHOD OF PRODUCING CIRCUIT MODULE

CIRCUIT MODULE AND METHOD OF PRODUCING THE SAME

CIRCUIT MODULE

CIRCUIT MODULE AND METHOD OF PRODUCING CIRCUIT MODULE

CIRCUIT MODULE AND METHOD OF PRODUCING THE SAME

CIRCUIT MODULE AND METHOD OF PRODUCING THE SAME

CIRCUIT MODULE AND PRODUCTION METHOD THEREFOR