Takema ADACHI

Person

Ogaki-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Wiring substrate and method for manufacturing wiring substrate
- Patent number 11,996,357
- Issue date May 28, 2024
- Ibiden Co., Ltd.
- Takema Adachi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate and method for manufacturing wiring substrate
- Patent number 11,882,656
- Issue date Jan 23, 2024
- Ibiden Co., Ltd.
- Takema Adachi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and method for manufacturing wiring substrate
- Patent number 11,792,929
- Issue date Oct 17, 2023
- Ibiden Co., Ltd.
- Takema Adachi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and method for manufacturing wiring substrate
- Patent number 11,617,262
- Issue date Mar 28, 2023
- Ibiden Co., Ltd.
- Takema Adachi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 10,645,819
- Issue date May 5, 2020
- Ibiden Co., Ltd.
- Toshiki Furutani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing electronic component attached wiring board
- Patent number 10,477,699
- Issue date Nov 12, 2019
- Ibiden Co., Ltd.
- Takema Adachi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 10,440,823
- Issue date Oct 8, 2019
- Ibiden Co., Ltd.
- Takema Adachi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 10,405,426
- Issue date Sep 3, 2019
- Ibiden Co., Ltd.
- Takema Adachi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 10,375,828
- Issue date Aug 6, 2019
- Ibiden Co., Ltd.
- Takema Adachi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 10,368,440
- Issue date Jul 30, 2019
- Ibiden Co., Ltd.
- Takema Adachi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 10,314,168
- Issue date Jun 4, 2019
- Ibiden Co., Ltd.
- Takema Adachi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Shield cap and method for manufacturing the same
- Patent number 10,271,468
- Issue date Apr 23, 2019
- Ibiden Co., Ltd.
- Toshiki Furutani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board for mounting electronic component
- Patent number 10,231,336
- Issue date Mar 12, 2019
- Ibiden Co., Ltd.
- Toshiki Furutani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Shield cap and method for manufacturing the same
- Patent number 10,231,369
- Issue date Mar 12, 2019
- Ibiden Co., Ltd.
- Toshiki Furutani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing wiring board with conductive post
- Patent number 10,221,497
- Issue date Mar 5, 2019
- Ibiden Co., Ltd.
- Kota Noda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Printed wiring board and method for manufacturing the same
- Patent number 10,219,383
- Issue date Feb 26, 2019
- Ibiden Co., Ltd.
- Katsutoshi Kitagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shield cap and method for manufacturing the same
- Patent number 10,194,569
- Issue date Jan 29, 2019
- Ibiden Co., Ltd.
- Toshiki Furutani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Shield cap and method for manufacturing the same
- Patent number 10,182,518
- Issue date Jan 15, 2019
- Ibiden Co., Ltd.
- Toshiki Furutani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board with conductor post having multiple surface ro...
- Patent number 10,070,523
- Issue date Sep 4, 2018
- Ibiden Co., Ltd.
- Shunsuke Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 9,980,371
- Issue date May 22, 2018
- Ibiden Co., Ltd.
- Takayuki Katsuno
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interposer and circuit substrate
- Patent number 9,837,345
- Issue date Dec 5, 2017
- Ibiden Co., Ltd.
- Kota Noda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing multilayer printed wiring board
- Patent number 9,420,708
- Issue date Aug 16, 2016
- Ibiden Co., Ltd.
- Toshiaki Hibino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Combined substrate
- Patent number 9,401,320
- Issue date Jul 26, 2016
- Ibiden Co., Ltd.
- Tomoya Daizo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board
- Patent number 9,185,799
- Issue date Nov 10, 2015
- Ibiden Co., Ltd.
- Naoto Ishida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing the same
- Patent number 9,078,366
- Issue date Jul 7, 2015
- Ibiden Co., Ltd.
- Takema Adachi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 9,048,229
- Issue date Jun 2, 2015
- Ibiden Co., Ltd.
- Naoto Ishida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing multilayer printed wiring board
- Patent number 8,931,168
- Issue date Jan 13, 2015
- Ibiden Co., Ltd.
- Toshiaki Hibino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 8,772,646
- Issue date Jul 8, 2014
- Ibiden Co., Ltd.
- Kazuyuki Ueda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 8,742,553
- Issue date Jun 3, 2014
- Ibiden Co., Ltd.
- Naoto Ishida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package-substrate-mounting printed wiring board and method for manu...
- Patent number 8,692,129
- Issue date Apr 8, 2014
- Ibiden Co., Ltd.
- Toshiaki Kasai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20220338347
- Publication date Oct 20, 2022
- IBIDEN CO., LTD.
- Takema ADACHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20220248533
- Publication date Aug 4, 2022
- IBIDEN CO., LTD.
- Takema ADACHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20220248531
- Publication date Aug 4, 2022
- IBIDEN CO., LTD.
- Takema ADACHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20220077046
- Publication date Mar 10, 2022
- IBIDEN CO., LTD.
- Takema ADACHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20190215959
- Publication date Jul 11, 2019
- IBIDEN CO., LTD.
- Takema Adachi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20190200462
- Publication date Jun 27, 2019
- IBIDEN CO., LTD.
- Toshiki Furutani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20190124765
- Publication date Apr 25, 2019
- IBIDEN CO., LTD.
- Takema Adachi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20190124768
- Publication date Apr 25, 2019
- IBIDEN CO., LTD.
- Takema Adachi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20190124766
- Publication date Apr 25, 2019
- IBIDEN CO., LTD.
- Takema Adachi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20190124767
- Publication date Apr 25, 2019
- IBIDEN CO., LTD.
- Takema Adachi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20180270958
- Publication date Sep 20, 2018
- IBIDEN CO., LTD.
- Katsutoshi KITAGAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20180270951
- Publication date Sep 20, 2018
- IBIDEN CO., LTD.
- Toshiki Furutani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SHIELD CAP AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20180110163
- Publication date Apr 19, 2018
- IBIDEN CO., LTD.
- Toshiki FURUTANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SHIELD CAP AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20180110159
- Publication date Apr 19, 2018
- IBIDEN CO., LTD.
- Toshiki FURUTANI
- B32 - LAYERED PRODUCTS
Information Patent Application
SHIELD CAP AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20180110161
- Publication date Apr 19, 2018
- IBIDEN CO., LTD.
- Toshiki FURUTANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELD CAP AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20180110164
- Publication date Apr 19, 2018
- IBIDEN CO., LTD.
- Toshiki FURUTANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC COMPONENT ATTACHED WIRING BOARD
- Publication number 20170257952
- Publication date Sep 7, 2017
- IBIDEN CO., LTD.
- Takema ADACHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND SEMICONDUCTOR PACKAGE
- Publication number 20170053878
- Publication date Feb 23, 2017
- IBIDEN CO., LTD.
- Kazuki KAJIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE, AND METHOD FOR MANUFAC...
- Publication number 20170033036
- Publication date Feb 2, 2017
- IBIDEN CO., LTD.
- Kazuki KAJIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER AND CIRCUIT SUBSTRATE
- Publication number 20170018494
- Publication date Jan 19, 2017
- IBIDEN CO., LTD.
- Kota NODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20160316558
- Publication date Oct 27, 2016
- IBIDEN CO., LTD.
- Shunsuke SAKAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20160295692
- Publication date Oct 6, 2016
- IBIDEN CO., LTD.
- Koji ASANO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20160242285
- Publication date Aug 18, 2016
- IBIDEN CO., LTD.
- Takayuki Katsuno
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20160014898
- Publication date Jan 14, 2016
- IBIDEN CO., LTD.
- Takema Adachi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING WIRING BOARD WITH CONDUCTIVE POST
- Publication number 20150271929
- Publication date Sep 24, 2015
- IBIDEN CO., LTD.
- Kota NODA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COMBINED SUBSTRATE
- Publication number 20150255433
- Publication date Sep 10, 2015
- IBIDEN CO., LTD.
- Tomoya DAIZO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD WITH METAL POST AND METHOD FOR MANUFACTURING P...
- Publication number 20150077963
- Publication date Mar 19, 2015
- IBIDEN CO., LTD.
- Takema ADACHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20150062849
- Publication date Mar 5, 2015
- IBIDEN CO., LTD.
- Takema ADACHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20140246765
- Publication date Sep 4, 2014
- IBIDEN CO., LTD.
- Naoto ISHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140090878
- Publication date Apr 3, 2014
- IBIDEN CO., LTD.
- Takema ADACHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Takema ADACHI

Person

Patents Grantslast 30 patents

Wiring substrate and method for manufacturing wiring substrate

Wiring substrate and method for manufacturing wiring substrate

Wiring substrate and method for manufacturing wiring substrate

Wiring substrate and method for manufacturing wiring substrate

Printed wiring board

Method for manufacturing electronic component attached wiring board

Printed wiring board

Printed wiring board

Printed wiring board

Printed wiring board

Printed wiring board

Shield cap and method for manufacturing the same

Printed wiring board for mounting electronic component

Shield cap and method for manufacturing the same

Method for manufacturing wiring board with conductive post

Printed wiring board and method for manufacturing the same

Shield cap and method for manufacturing the same

Shield cap and method for manufacturing the same

Printed wiring board with conductor post having multiple surface ro...

Printed wiring board

Interposer and circuit substrate

Method for manufacturing multilayer printed wiring board

Combined substrate

Printed wiring board

Printed wiring board and method for manufacturing the same

Printed wiring board

Method for manufacturing multilayer printed wiring board

Printed wiring board and method for manufacturing printed wiring board

Printed wiring board

Package-substrate-mounting printed wiring board and method for manu...

Patents Applicationslast 30 patents

WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE

WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE

WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE

WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE

PRINTED WIRING BOARD

PRINTED WIRING BOARD

PRINTED WIRING BOARD

PRINTED WIRING BOARD

PRINTED WIRING BOARD

PRINTED WIRING BOARD

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

PRINTED WIRING BOARD

SHIELD CAP AND METHOD FOR MANUFACTURING THE SAME

SHIELD CAP AND METHOD FOR MANUFACTURING THE SAME

SHIELD CAP AND METHOD FOR MANUFACTURING THE SAME

SHIELD CAP AND METHOD FOR MANUFACTURING THE SAME

METHOD FOR MANUFACTURING ELECTRONIC COMPONENT ATTACHED WIRING BOARD

PRINTED WIRING BOARD AND SEMICONDUCTOR PACKAGE

PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE, AND METHOD FOR MANUFAC...

INTERPOSER AND CIRCUIT SUBSTRATE

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

PRINTED WIRING BOARD

PRINTED WIRING BOARD

METHOD FOR MANUFACTURING WIRING BOARD WITH CONDUCTIVE POST

COMBINED SUBSTRATE

PRINTED WIRING BOARD WITH METAL POST AND METHOD FOR MANUFACTURING P...

PRINTED WIRING BOARD

PRINTED WIRING BOARD

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME