Membership
Tour
Register
Log in
Takeshi Furusawa
Follow
Person
Yokohama, JP
People
Overview
Industries
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor chip with seal ring and sacrificial corner pattern
Patent number
9,368,459
Issue date
Jun 14, 2016
ACACIA RESEARCH GROUP LLC
Takeshi Furusawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor chip with seal ring and sacrificial corner pattern
Patent number
8,963,291
Issue date
Feb 24, 2015
Renesas Electronics Corporation
Takeshi Furusawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having trench-isolated element formation region
Patent number
8,513,808
Issue date
Aug 20, 2013
Renesas Electronics Corporation
Katsuhiko Hotta
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having metal contacts formed in an interlayer...
Patent number
8,203,210
Issue date
Jun 19, 2012
Renesas Electronics Corporation
Takeshi Furusawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and manufacturing method of semiconductor device
Patent number
8,097,948
Issue date
Jan 17, 2012
Renesas Electronics Corporation
Takeshi Furusawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor chip with seal ring and sacrificial corner pattern
Patent number
8,018,030
Issue date
Sep 13, 2011
Renesas Electronics Corporation
Takeshi Furusawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and manufacturing method therefor
Patent number
7,960,279
Issue date
Jun 14, 2011
Renesas Electronics Corporation
Takeshi Furusawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and manufacturing method of semiconductor device
Patent number
7,816,268
Issue date
Oct 19, 2010
Renesas Elecronics Corporation
Takeshi Furusawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and manufacturing method of semiconductor device
Patent number
7,700,487
Issue date
Apr 20, 2010
Renesas Technology Corp.
Takeshi Furusawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with seal ring
Patent number
7,605,448
Issue date
Oct 20, 2009
Renesas Technology Corp.
Takeshi Furusawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and manufacturing method therefor
Patent number
7,602,063
Issue date
Oct 13, 2009
Renesas Technology Corp.
Takeshi Furusawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Network routing apparatus
Patent number
7,379,456
Issue date
May 27, 2008
Hitachi, Ltd.
Takayuki Muranaka
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Grant
Semiconductor device having low-K insulating film
Patent number
6,903,445
Issue date
Jun 7, 2005
Renesas Technology Corp.
Daisuke Ryuzaki
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Semiconductor manufacturing method for low-k insulating film
Patent number
6,777,325
Issue date
Aug 17, 2004
Hitachi, Ltd.
Daisuke Ryuzaki
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Semiconductor device and process for producing the same
Patent number
6,680,541
Issue date
Jan 20, 2004
Hitachi, Ltd.
Takeshi Furusawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and manufacturing method thereof
Patent number
6,599,830
Issue date
Jul 29, 2003
Hitachi, Ltd.
Takeshi Furusawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and manufacturing method thereof
Patent number
6,479,380
Issue date
Nov 12, 2002
Hitachi, Ltd.
Takeshi Furusawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and process for producing the same
Patent number
6,358,838
Issue date
Mar 19, 2002
Hitachi, Ltd.
Takeshi Furusawa
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR CHIP WITH SEAL RING AND SACRIFICIAL CORNER PATTERN
Publication number
20150108613
Publication date
Apr 23, 2015
RENESAS ELECTRONICS CORPORATION
Takeshi FURUSAWA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
Publication number
20130241067
Publication date
Sep 19, 2013
RENESAS ELECTRONICS CORPORATION
Takeshi FURUSAWA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
Publication number
20120289032
Publication date
Nov 15, 2012
Renesas Electronics Corporation
Takeshi FURUSAWA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
Publication number
20110266679
Publication date
Nov 3, 2011
Renesas Electronics Corporation
Katsuhiko Hotta
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR CHIP WITH SEAL RING AND SACRIFICIAL CORNER PATTERN
Publication number
20110215447
Publication date
Sep 8, 2011
Renesas Electronics Corporation
Takeshi Furusawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
Publication number
20110001246
Publication date
Jan 6, 2011
Renesas Electronics Corporation
Takeshi FURUSAWA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
Publication number
20100327449
Publication date
Dec 30, 2010
RENESAS ELECTRONICS CORPORATION
Takeshi FURUSAWA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20100314620
Publication date
Dec 16, 2010
Renesas Electronics Corporation
Takeshi FURUSAWA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
Publication number
20100151673
Publication date
Jun 17, 2010
Renesas Technology Corp.
Takeshi FURUSAWA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
Publication number
20090263963
Publication date
Oct 22, 2009
Renesas Technology Corp.
Takeshi Furusawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH SEAL RING
Publication number
20090189245
Publication date
Jul 30, 2009
Renesas Technology Corporation
Takeshi FURUSAWA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
Publication number
20090184424
Publication date
Jul 23, 2009
RENESAS TECHNOLOGY CORP.
Takeshi Furusawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
Publication number
20080230847
Publication date
Sep 25, 2008
Takeshi Furusawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
Publication number
20070167010
Publication date
Jul 19, 2007
Renesas Technology Corp.
Takeshi FURUSAWA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20070114668
Publication date
May 24, 2007
Renesas Technology Corp.
Kinya Goto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor device including sealing ring
Publication number
20060103025
Publication date
May 18, 2006
Renesas Technology Corp.
Takeshi Furusawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor device
Publication number
20060055005
Publication date
Mar 16, 2006
Renesas Technology Corporation
Takeshi Furusawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor device and manufacturing method therefor
Publication number
20060006530
Publication date
Jan 12, 2006
Renesas Technology Corp.
Takeshi Furusawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor device and its manufacturing method
Publication number
20040256728
Publication date
Dec 23, 2004
Hitachi, Ltd.
Daisuke Ryuzaki
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
Network routing apparatus
Publication number
20040233920
Publication date
Nov 25, 2004
Hitachi, Ltd
Takayuki Muranaka
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Application
Method of manufacturing a semiconductor device for high speed opera...
Publication number
20040048203
Publication date
Mar 11, 2004
Hitachi, Ltd.
Takeshi Furusawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR MANUFACTURING METHOD FOR LOW-K INSULATING FILM
Publication number
20030201465
Publication date
Oct 30, 2003
Daisuke Ryuzaki
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
Semiconductor device and manufacturing method thereof
Publication number
20020164865
Publication date
Nov 7, 2002
Hitachi, Ltd.
Takeshi Furusawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor device and process for producing the same
Publication number
20020105085
Publication date
Aug 8, 2002
Hitachi, Ltd.
Takeshi Furusawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor device and manufacturing method thereof
Publication number
20010046783
Publication date
Nov 29, 2001
Takeshi Furusawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor device and process for producing the same
Publication number
20010009295
Publication date
Jul 26, 2001
Takeshi Furusawa
H01 - BASIC ELECTRIC ELEMENTS