Takeshi HARADA

Person

Toyama, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of manufacturing the device
- Patent number 11,257,918
- Issue date Feb 22, 2022
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yusuke Kanda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor including electrode and dielectric layer each containing...
- Patent number 10,923,560
- Issue date Feb 16, 2021
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Takahiro Koyanagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with p-type AlxInyGal-x-yN and ohmic electrode...
- Patent number 10,607,840
- Issue date Mar 31, 2020
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Takeshi Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,927,416
- Issue date Jan 6, 2015
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Takeshi Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device
- Patent number 8,895,431
- Issue date Nov 25, 2014
- Panasonic Corporation
- Takeshi Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having via connecting between interconnects
- Patent number 8,334,597
- Issue date Dec 18, 2012
- Panasonic Corporation
- Takeshi Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 8,084,352
- Issue date Dec 27, 2011
- Panasonic Corporation
- Takeshi Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device
- Patent number 8,034,693
- Issue date Oct 11, 2011
- Panasonic Corporation
- Junichi Shibata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including interconnects, vias connecting the i...
- Patent number 8,035,232
- Issue date Oct 11, 2011
- Panasonic Corporation
- Takeshi Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having via connecting between interconnects
- Patent number 7,964,969
- Issue date Jun 21, 2011
- Panasonic Corporation
- Takeshi Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device
- Patent number 7,741,228
- Issue date Jun 22, 2010
- Panasonic Corporation
- Akira Ueki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having via connecting between interconnects
- Patent number 7,632,751
- Issue date Dec 15, 2009
- Panasonic Corporation
- Takeshi Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having via connecting between interconnects
- Patent number 7,439,623
- Issue date Oct 21, 2008
- Matsushita Electric Industrial Co., Ltd.
- Takeshi Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Production method of semiconductor device
- Patent number 7,001,841
- Issue date Feb 21, 2006
- Matsushita Electric Industrial Co., Ltd.
- Shuji Hirao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a layer having a β-crystal structure
- Patent number 6,963,139
- Issue date Nov 8, 2005
- Matsushita Electric Industrial Co., Ltd.
- Takenobu Kishida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming wiring structure which includes annealing conduc...
- Patent number 6,946,383
- Issue date Sep 20, 2005
- Matsushita Electric Industrial Co., Ltd.
- Takeshi Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming wiring structure
- Patent number 6,919,267
- Issue date Jul 19, 2005
- Matsushita Electric Industrial Co., Ltd.
- Tetsuya Ueda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,906,420
- Issue date Jun 14, 2005
- Matsushita Electric Industrial Co., Ltd.
- Takeshi Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming wiring structure
- Patent number 6,881,660
- Issue date Apr 19, 2005
- Matsushita Electric Industrial Co., Ltd.
- Takeshi Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming wiring structure
- Patent number 6,858,549
- Issue date Feb 22, 2005
- Matsushita Electric Industrial Co., Ltd.
- Masashi Hamanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming wiring structure
- Patent number 6,777,332
- Issue date Aug 17, 2004
- Matsushita Electric Industrial Co., Ltd.
- Takeshi Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and its fabrication method
- Patent number 6,777,811
- Issue date Aug 17, 2004
- Matsushita Electric Industrial Co., Ltd.
- Takeshi Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 6,770,977
- Issue date Aug 3, 2004
- Matsushita Electric Industrial Co., Ltd.
- Takenobu Kishida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming wiring structure
- Patent number 6,759,322
- Issue date Jul 6, 2004
- Matsushita Electric Industrial Co., Ltd.
- Hideaki Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a semi-conductor device having a tungsten fi...
- Patent number 6,746,962
- Issue date Jun 8, 2004
- Matsushita Electric Industrial Co., Ltd.
- Takenobu Kishida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a copper interconnect layer
- Patent number 6,683,381
- Issue date Jan 27, 2004
- Matsushita Electric Industrsial Co., Ltd.
- Takeshi Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method and apparatus for fabricating the s...
- Patent number 6,475,912
- Issue date Nov 5, 2002
- Matsushita Electric Industrial Co., Ltd.
- Takeshi Harada
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
VEHICULAR CAMERA
- Publication number 20240276083
- Publication date Aug 15, 2024
- Panasonic Automotive Systems Co., Ltd.
- Ken NAKAMURA
- B60 - VEHICLES IN GENERAL
Information Patent Application
VEHICULAR CAMERA
- Publication number 20240171834
- Publication date May 23, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- Yoshiki USUI
- B60 - VEHICLES IN GENERAL
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE DEVICE
- Publication number 20200144386
- Publication date May 7, 2020
- Yusuke Kanda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR INCLUDING ELECTRODE AND DIELECTRIC LAYER EACH CONTAINING...
- Publication number 20190252488
- Publication date Aug 15, 2019
- Panasonic Intellectual Property Management Co., Ltd.
- TAKAHIRO KOYANAGI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180218910
- Publication date Aug 2, 2018
- Panasonic Intellectual Property Management Co., Ltd.
- Takeshi HARADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NITRIDE SEMICONDUCTOR DEVICE
- Publication number 20170133500
- Publication date May 11, 2017
- Panasonic Intellectual Property Management Co., Ltd.
- Ryuuji ETOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
- Publication number 20130095652
- Publication date Apr 18, 2013
- PANASONIC CORPORATION
- Takeshi HARADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120032333
- Publication date Feb 9, 2012
- PANASONIC CORPORATION
- Takeshi Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING VIA CONNECTING BETWEEN INTERCONNECTS
- Publication number 20110210445
- Publication date Sep 1, 2011
- PANASONIC CORPORATION
- Takeshi HARADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING VIA CONNECTING BETWEEN INTERCONNECTS
- Publication number 20100044866
- Publication date Feb 25, 2010
- PANASONIC CORPORATION
- Takeshi HARADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20090302475
- Publication date Dec 10, 2009
- Hayato Korogi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20090302473
- Publication date Dec 10, 2009
- PANASONIC CORPORATION
- Junichi SHIBATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20090278261
- Publication date Nov 12, 2009
- Takeshi HARADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
- Publication number 20090263951
- Publication date Oct 22, 2009
- PANASONIC CORPORATION
- Junichi Shibata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING VIA CONNECTING BETWEEN INTERCONNECTS
- Publication number 20090045522
- Publication date Feb 19, 2009
- Matsushita Electric Industrial Co., Ltd.
- Takeshi Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20080299758
- Publication date Dec 4, 2008
- Matsushita Electric Industrial Co., Ltd.
- Takeshi Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
- Publication number 20080299763
- Publication date Dec 4, 2008
- Akira Ueki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnection structure and method for forming the same
- Publication number 20050121792
- Publication date Jun 9, 2005
- MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Takeshi Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device including a layer having a beta-crystal structure
- Publication number 20050035454
- Publication date Feb 17, 2005
- Matsushita Electric Industrial Co., Ltd.
- Takenobu Kishida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Production method of semiconductor device
- Publication number 20040175936
- Publication date Sep 9, 2004
- MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Shuji Hirao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method and apparatus for fabricating the same
- Publication number 20040124532
- Publication date Jul 1, 2004
- Matsushita Electric Industrial Co., Ltd.
- Takeshi Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming wiring structure
- Publication number 20040009653
- Publication date Jan 15, 2004
- Matsushita Electric Industrial Co., Ltd.
- Tetsuya Ueda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming wiring structure
- Publication number 20030232498
- Publication date Dec 18, 2003
- MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Takeshi Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming wiring structure
- Publication number 20030224592
- Publication date Dec 4, 2003
- MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Takeshi Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming wiring structure
- Publication number 20030224594
- Publication date Dec 4, 2003
- Matsushita Electric Industrial Co., Ltd.
- Hideaki Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming wiring structure
- Publication number 20030216033
- Publication date Nov 20, 2003
- Matsushita Electric Industrial Co., Ltd.
- Takeshi Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming wiring structure
- Publication number 20030216019
- Publication date Nov 20, 2003
- Matsushita Electric Industrial Co., Ltd.
- Masashi Hamanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and its fabrication method
- Publication number 20030025207
- Publication date Feb 6, 2003
- Matsushita Electric Industrial Co., Ltd.
- Takeshi Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for fabricating the same
- Publication number 20020050648
- Publication date May 2, 2002
- Takenobu Kishida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for fabricating the same
- Publication number 20020036309
- Publication date Mar 28, 2002
- Mitsuru Sekiguchi
- H01 - BASIC ELECTRIC ELEMENTS

Takeshi HARADA

Person

Patents Grantslast 30 patents

Semiconductor device and method of manufacturing the device

Capacitor including electrode and dielectric layer each containing...

Semiconductor device with p-type AlxInyGal-x-yN and ohmic electrode...

Semiconductor device and method of manufacturing the same

Method for fabricating semiconductor device

Semiconductor device having via connecting between interconnects

Method of manufacturing semiconductor device

Method for fabricating semiconductor device

Semiconductor device including interconnects, vias connecting the i...

Semiconductor device having via connecting between interconnects

Method for fabricating semiconductor device

Semiconductor device having via connecting between interconnects

Semiconductor device having via connecting between interconnects

Production method of semiconductor device

Semiconductor device including a layer having a β-crystal structure

Method for forming wiring structure which includes annealing conduc...

Method for forming wiring structure

Semiconductor device

Method for forming wiring structure

Method for forming wiring structure

Method for forming wiring structure

Semiconductor device and its fabrication method

Semiconductor device and method for fabricating the same

Method for forming wiring structure

Method for fabricating a semi-conductor device having a tungsten fi...

Semiconductor device having a copper interconnect layer

Semiconductor device and method and apparatus for fabricating the s...

Patents Applicationslast 30 patents

VEHICULAR CAMERA

VEHICULAR CAMERA

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE DEVICE

CAPACITOR INCLUDING ELECTRODE AND DIELECTRIC LAYER EACH CONTAINING...

SEMICONDUCTOR DEVICE

NITRIDE SEMICONDUCTOR DEVICE

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE HAVING VIA CONNECTING BETWEEN INTERCONNECTS

SEMICONDUCTOR DEVICE HAVING VIA CONNECTING BETWEEN INTERCONNECTS

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE HAVING VIA CONNECTING BETWEEN INTERCONNECTS

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE

Interconnection structure and method for forming the same

Semiconductor device including a layer having a beta-crystal structure

Production method of semiconductor device

Semiconductor device and method and apparatus for fabricating the same

Method for forming wiring structure

Method for forming wiring structure

Method for forming wiring structure

Method for forming wiring structure

Method for forming wiring structure

Method for forming wiring structure

Semiconductor device and its fabrication method

Semiconductor device and method for fabricating the same

Semiconductor device and method for fabricating the same