Takeshi Kubota

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Ichikawa-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method of making a semiconductor device having a multilayer metal f...
- Patent number 6,812,136
- Issue date Nov 2, 2004
- Kabushiki Kaisha Toshiba
- Mitsutoshi Koyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with pure copper wirings and method of manufac...
- Patent number 6,424,045
- Issue date Jul 23, 2002
- Kabushiki Kaisha Toshiba
- Mitsutoshi Koyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical mechanical polishing apparatus and method
- Patent number 6,015,754
- Issue date Jan 18, 2000
- Kabushiki Kaisha Toshiba
- Yasukazu Mase
- B24 - GRINDING POLISHING
Information Patent Grant
Semiconductor device with pure copper wirings and method of manufac...
- Patent number 5,990,008
- Issue date Nov 23, 1999
- Kabushiki Kaisha Toshiba
- Mitsutoshi Koyama
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE WITH PURE COPPER WIRINGS AND METHOD OF MANUFAC...
- Publication number 20010035583
- Publication date Nov 1, 2001
- MITSUTOSHI KOYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having a wiring layer of copper
- Publication number 20010010401
- Publication date Aug 2, 2001
- Kabushiki Kaisha Toshiba
- Mitsutoshi Koyama
- H01 - BASIC ELECTRIC ELEMENTS