Takeshi Kujiraoka

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Palladium bonding wire for semiconductor device
- Patent number 5,538,685
- Issue date Jul 23, 1996
- Tanaka Denshi Kogyo Kabushiki Kaisha
- Katsuyuki Toyofuku
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Clad bonding wire for semiconductor device
- Patent number 5,364,706
- Issue date Nov 15, 1994
- Tanaka Denshi Kogyo Kabushiki Kaisha
- Katsuyuki Toyofuku
- B32 - LAYERED PRODUCTS
Information Patent Grant
High purity gold bonding wire for semiconductor device
- Patent number 5,298,219
- Issue date Mar 29, 1994
- Tanaka Denshi Kogyo Kabushiki Kaisha
- Katsuyuki Toyofuku
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Gold wire for the bonding of a semiconductor device
- Patent number 4,938,923
- Issue date Jul 3, 1990
- Takeshi Kujiraoka
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...