Takeshi Miura

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Ohmiya, JP

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Patents Grantslast 30 patents

Information Patent Grant
Acidic tin-plating bath and additive therefor
- Patent number 5,871,631
- Issue date Feb 16, 1999
- NKK Corporation
- Mikiyuki Ichiba
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrolytic copper plating using a reducing agent
- Patent number 5,454,930
- Issue date Oct 3, 1995
- LeaRonal Japan Inc.
- Takeshi Miura
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Immersion tin/lead alloy plating bath
- Patent number 5,302,256
- Issue date Apr 12, 1994
- LeaRonal Japan Inc.
- Takeshi Miura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
Process for electroplating silicon wafers
- Publication number 20030155247
- Publication date Aug 21, 2003
- Shipley Company, L.L.C.
- Takeshi Miura
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR