Takeshi Miyakawa

Person

Isezaki-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Heat dissipation component and method for manufacturing same
- Patent number 11,682,604
- Issue date Jun 20, 2023
- DENKA COMPANY LIMITED
- Daisuke Goto
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Aluminum-silicon-carbide composite and method of manufacturing same
- Patent number 10,919,811
- Issue date Feb 16, 2021
- DENKA COMPANY LIMITED
- Akimasa Yuasa
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Heat-dissipating component and method for manufacturing same
- Patent number 10,869,413
- Issue date Dec 15, 2020
- DENKA COMPANY LIMITED
- Takeshi Miyakawa
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Aluminum-diamond-based composite and method for producing same
- Patent number 10,751,912
- Issue date Aug 25, 2020
- DENKA COMPANY LIMITED
- Hiroaki Ota
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Aluminum-diamond-based composite and heat dissipation component
- Patent number 10,640,853
- Issue date May 5, 2020
- DENKA COMPANY LIMITED
- Yosuke Ishihara
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Heat dissipation component and method for manufacturing same
- Patent number 10,636,723
- Issue date Apr 28, 2020
- DENKA COMPANY LIMITED
- Daisuke Goto
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Heat dissipation component for semiconductor element
- Patent number 10,539,379
- Issue date Jan 21, 2020
- DENKA COMPANY LIMITED
- Yosuke Ishihara
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Heat dissipation component for semiconductor element
- Patent number 10,541,189
- Issue date Jan 21, 2020
- DENKA COMPANY LIMITED
- Yosuke Ishihara
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for producing silicon carbide composite material
- Patent number 10,529,591
- Issue date Jan 7, 2020
- DENKA COMPANY LIMITED
- Takeshi Miyakawa
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Ceramic circuit board
- Patent number 10,424,529
- Issue date Sep 24, 2019
- DENKA COMPANY LIMITED
- Ryota Aono
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Composite body and method for manufacturing same
- Patent number 10,358,704
- Issue date Jul 23, 2019
- DENKA COMPANY LIMITED
- Yosuke Ishihara
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Aluminum-diamond composite, and heat dissipating component using same
- Patent number 10,302,375
- Issue date May 28, 2019
- DENKA COMPANY LIMITED
- Yosuke Ishihara
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Composite body and method for producing same
- Patent number 10,081,055
- Issue date Sep 25, 2018
- DENKA COMPANY LIMITED
- Takeshi Miyakawa
- B32 - LAYERED PRODUCTS
Information Patent Grant
Ceramic circuit board and method for producing same
- Patent number 9,872,380
- Issue date Jan 16, 2018
- DENKA COMPANY LIMITED
- Ryota Aono
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing metal-base substrate and method of manufact...
- Patent number 8,796,145
- Issue date Aug 5, 2014
- Denki Kagaku Kogyo Kabushiki Kaisha
- Taiki Nishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal base circuit board
- Patent number 8,449,143
- Issue date May 28, 2013
- Denki Kagaku Kogyo Kabushiki Kaisha
- Takeshi Miyakawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrically conductive sheet
- Patent number 8,440,305
- Issue date May 14, 2013
- Denki Kagaku Kogyo Kabushiki Kaisha
- Yutaka Aoki
- B32 - LAYERED PRODUCTS
Information Patent Grant
Metal base circuit board
- Patent number 8,426,740
- Issue date Apr 23, 2013
- Denki Kagaku Kogyo Kabushiki Kaisha
- Taiki Nishi
- F21 - LIGHTING
Information Patent Grant
Conductive resin composition and conductive sheets comprising the same
- Patent number 8,148,456
- Issue date Apr 3, 2012
- Denki Kagaku Kogyo Kabushiki Kaisha
- Yutaka Aoki
- B32 - LAYERED PRODUCTS
Information Patent Grant
Conductive composite sheeting
- Patent number 7,794,807
- Issue date Sep 14, 2010
- Denki Kagaku Kogyo Kabushiki Kaisha
- Takeshi Miyakawa
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Electronic component container
- Patent number 7,455,896
- Issue date Nov 25, 2008
- Denki Kagaku Kogyo Kabushiki Kaisha
- Tetsuo Fujimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Container for an electronic component
- Patent number 7,364,778
- Issue date Apr 29, 2008
- Denki Kagaku Kogyo Kabushiki Kaisha
- Takeshi Miyakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroconductive resin composition
- Patent number 7,261,840
- Issue date Aug 28, 2007
- Denki Kagaku Kogyo Kabushiki Kaisha
- Takeshi Miyakawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Sheet
- Patent number 7,199,187
- Issue date Apr 3, 2007
- Denki Kagaku Kogyo Kabushiki Kaisha
- Takeshi Miyakawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Sheet and electronic component packaging container
- Patent number 7,097,900
- Issue date Aug 29, 2006
- Denki Kagaku Kogyo Kabushiki Kaisha
- Minoru Oda
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Packaging container for electronic part
- Patent number 7,014,896
- Issue date Mar 21, 2006
- Denki Kagaku Kogyo Kabushiki Kaisha
- Takeshi Miyakawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Resin composition, molded product thereof and electroconductive sheet
- Patent number 6,960,390
- Issue date Nov 1, 2005
- Denki Kagaku Kogyo Kabushiki Kaisha
- Kazuhiro Kosugi
- B42 - BOOKBINDING ALBUMS FILES SPECIAL PRINTED MATTER
Information Patent Grant
Resin composition, molded product thereof and electroconductive sheet
- Patent number 6,759,130
- Issue date Jul 6, 2004
- Denki Kagaku Kogyo Kabushiki Kaisha
- Kazuhiro Kosugi
- B42 - BOOKBINDING ALBUMS FILES SPECIAL PRINTED MATTER
Information Patent Grant
Resin composition, molded product thereof and electroconductive sheet
- Patent number 6,485,832
- Issue date Nov 26, 2002
- Denki Kagaku Kogyo Kabushiki Kaisha
- Kazuhiro Kosugi
- B42 - BOOKBINDING ALBUMS FILES SPECIAL PRINTED MATTER
Information Patent Grant
Electroconductive resin composition, sheet, molded product and cont...
- Patent number 5,955,164
- Issue date Sep 21, 1999
- Denki Kagaku Kogyo Kabushiki Kaisha
- Takeshi Miyakawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
HEAT DISSIPATION COMPONENT AND METHOD FOR MANUFACTURING SAME
- Publication number 20200335415
- Publication date Oct 22, 2020
- DENKA COMPANY LIMITED
- Daisuke GOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION COMPONENT FOR SEMICONDUCTOR ELEMENT
- Publication number 20190341330
- Publication date Nov 7, 2019
- DENKA COMPANY LIMITED
- Yosuke ISHIHARA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ALUMINUM-DIAMOND-BASED COMPOSITE AND HEAT DISSIPATION COMPONENT
- Publication number 20190093201
- Publication date Mar 28, 2019
- DENKA COMPANY LIMITED
- Yosuke ISHIHARA
- B22 - CASTING POWDER METALLURGY
Information Patent Application
CARBON BLACK, ELECTRODE CATALYST AND FUEL CELL USING SAME, AND METH...
- Publication number 20190030514
- Publication date Jan 31, 2019
- UNIVERSITY OF YAMANASHI
- Makoto UCHIDA
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
ALUMINUM-DIAMOND-BASED COMPOSITE AND METHOD FOR PRODUCING SAME
- Publication number 20180281230
- Publication date Oct 4, 2018
- DENKA COMPANY LIMITED
- Hiroaki OTA
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
ALUMINUM-SILICON-CARBIDE COMPOSITE AND METHOD OF MANUFACTURING SAME
- Publication number 20180215668
- Publication date Aug 2, 2018
- Denka Company Limited
- Akimasa YUASA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
METHOD FOR PRODUCING SILICON CARBIDE COMPOSITE MATERIAL
- Publication number 20180025919
- Publication date Jan 25, 2018
- DENKA COMPANY LIMITED
- Takeshi MIYAKAWA
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
HEAT DISSIPATION COMPONENT AND METHOD FOR MANUFACTURING SAME
- Publication number 20170317007
- Publication date Nov 2, 2017
- DENKI KAGAKU KOGYO KABUSHIKI KAISHA
- Daisuke GOTO
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
HEAT DISSIPATION COMPONENT FOR SEMICONDUCTOR ELEMENT
- Publication number 20170268834
- Publication date Sep 21, 2017
- DENKA COMPANY LIMITED
- Yosuke ISHIHARA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
COMPOSITE BODY AND METHOD FOR PRODUCING SAME
- Publication number 20170239715
- Publication date Aug 24, 2017
- DENKA COMPANY LIMITED
- Takeshi MIYAKAWA
- B32 - LAYERED PRODUCTS
Information Patent Application
ALUMINUM-SILICON CARBIDE COMPOSITE AND PRODUCTION METHOD THEREFOR
- Publication number 20170236767
- Publication date Aug 17, 2017
- DENKA COMPANY LIMITED
- Takeshi MIYAKAWA
- B32 - LAYERED PRODUCTS
Information Patent Application
CERAMIC CIRCUIT BOARD AND METHOD FOR PRODUCING SAME
- Publication number 20170181272
- Publication date Jun 22, 2017
- Denka Company Limited
- Ryota AONO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SILICON CARBIDE COMPLEX, METHOD FOR MANUFACTURING SAME, AND HEAT DI...
- Publication number 20170162469
- Publication date Jun 8, 2017
- DENKA COMPANY LIMITED
- Motonori KINO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT-DISSIPATING COMPONENT AND METHOD FOR MANUFACTURING SAME
- Publication number 20170142859
- Publication date May 18, 2017
- DENKA COMPANY LIMITED
- Takeshi MIYAKAWA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
COMPOSITE BODY AND METHOD FOR MANUFACTURING SAME
- Publication number 20170130300
- Publication date May 11, 2017
- DENKA COMPANY LIMITED
- Yosuke ISHIHARA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SAME
- Publication number 20170092560
- Publication date Mar 30, 2017
- DENKA COMPANY LIMITED
- Takeshi MIYAKAWA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ALUMINUM-DIAMOND COMPOSITE, AND HEAT DISSIPATING COMPONENT USING SAME
- Publication number 20170045314
- Publication date Feb 16, 2017
- DENKA COMPANY LIMITED
- Yosuke ISHIHARA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
CERAMIC CIRCUIT BOARD
- Publication number 20160358840
- Publication date Dec 8, 2016
- DENKA COMPANY LIMITED
- Ryota AONO
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
METHOD OF MANUFACTURING METAL-BASE SUBSTRATE AND METHOD OF MANUFACT...
- Publication number 20130056439
- Publication date Mar 7, 2013
- DENKI KAGAKU KOGYO KABUSHIKI KAISHA
- Taiki Nishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL BASE CIRCUIT BOARD
- Publication number 20110132644
- Publication date Jun 9, 2011
- Taiki Nishi
- F21 - LIGHTING
Information Patent Application
CONDUCTIVE SHEET
- Publication number 20100196719
- Publication date Aug 5, 2010
- Denki Kagaku Kogyo Kabushiki Kaisha
- Yutaka Aoki
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
METAL BASE CIRCUIT BOARD
- Publication number 20100164362
- Publication date Jul 1, 2010
- DENKI KAGAKU KOGYO KABUSHIKI KAISHA
- Takeshi Miyakawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LED LIGHT SOURCE UNIT
- Publication number 20100027261
- Publication date Feb 4, 2010
- Denki Kagaku Kogyo Kabushiki Kaisha
- Katsunori Yashima
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CONDUCTIVE RESIN COMPOSITION AND CONDUCTIVE SHEETS COMPRISING THE SAME
- Publication number 20090280280
- Publication date Nov 12, 2009
- Denki Kagaku Kogyo Kabushiki Kaisha
- Yutaka Aoki
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Conductive Composite Sheeting
- Publication number 20070231549
- Publication date Oct 4, 2007
- Denki Kagaku Kogy Kabushiki Kaisha
- Takeshi Miyakawa
- B32 - LAYERED PRODUCTS
Information Patent Application
SHEET FOR EMBOSSED CARRIER TAPE
- Publication number 20070082178
- Publication date Apr 12, 2007
- DENKI KAGAKU KOGYO KABUSHIKI KAISHA
- Takeshi MIYAKAWA
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
Sheet and formed product thereof
- Publication number 20050124739
- Publication date Jun 9, 2005
- Denki Kagaku Kogyo Kabushiki Kaisha
- Minoru Oda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Electroconductive resin composition
- Publication number 20050004303
- Publication date Jan 6, 2005
- Takeshi Miyakawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Sheet
- Publication number 20040265610
- Publication date Dec 30, 2004
- Takeshi Miyakawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Resin composition, molded product thereof and electroconductive sheet
- Publication number 20040048071
- Publication date Mar 11, 2004
- DENKI KAGAKU KOGYO KABUSHIKI KAISHA
- Kazuhiro Kosugi
- B42 - BOOKBINDING ALBUMS FILES SPECIAL PRINTED MATTER

Takeshi Miyakawa

Person

Patents Grantslast 30 patents

Heat dissipation component and method for manufacturing same

Aluminum-silicon-carbide composite and method of manufacturing same

Heat-dissipating component and method for manufacturing same

Aluminum-diamond-based composite and method for producing same

Aluminum-diamond-based composite and heat dissipation component

Heat dissipation component and method for manufacturing same

Heat dissipation component for semiconductor element

Heat dissipation component for semiconductor element

Method for producing silicon carbide composite material

Ceramic circuit board

Composite body and method for manufacturing same

Aluminum-diamond composite, and heat dissipating component using same

Composite body and method for producing same

Ceramic circuit board and method for producing same

Method of manufacturing metal-base substrate and method of manufact...

Metal base circuit board

Electrically conductive sheet

Metal base circuit board

Conductive resin composition and conductive sheets comprising the same

Conductive composite sheeting

Electronic component container

Container for an electronic component

Electroconductive resin composition

Sheet

Sheet and electronic component packaging container

Packaging container for electronic part

Resin composition, molded product thereof and electroconductive sheet

Resin composition, molded product thereof and electroconductive sheet

Resin composition, molded product thereof and electroconductive sheet

Electroconductive resin composition, sheet, molded product and cont...

Patents Applicationslast 30 patents

HEAT DISSIPATION COMPONENT AND METHOD FOR MANUFACTURING SAME

HEAT DISSIPATION COMPONENT FOR SEMICONDUCTOR ELEMENT

ALUMINUM-DIAMOND-BASED COMPOSITE AND HEAT DISSIPATION COMPONENT

CARBON BLACK, ELECTRODE CATALYST AND FUEL CELL USING SAME, AND METH...

ALUMINUM-DIAMOND-BASED COMPOSITE AND METHOD FOR PRODUCING SAME

ALUMINUM-SILICON-CARBIDE COMPOSITE AND METHOD OF MANUFACTURING SAME

METHOD FOR PRODUCING SILICON CARBIDE COMPOSITE MATERIAL

HEAT DISSIPATION COMPONENT AND METHOD FOR MANUFACTURING SAME

HEAT DISSIPATION COMPONENT FOR SEMICONDUCTOR ELEMENT

COMPOSITE BODY AND METHOD FOR PRODUCING SAME

ALUMINUM-SILICON CARBIDE COMPOSITE AND PRODUCTION METHOD THEREFOR

CERAMIC CIRCUIT BOARD AND METHOD FOR PRODUCING SAME

SILICON CARBIDE COMPLEX, METHOD FOR MANUFACTURING SAME, AND HEAT DI...

HEAT-DISSIPATING COMPONENT AND METHOD FOR MANUFACTURING SAME

COMPOSITE BODY AND METHOD FOR MANUFACTURING SAME

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SAME

ALUMINUM-DIAMOND COMPOSITE, AND HEAT DISSIPATING COMPONENT USING SAME

CERAMIC CIRCUIT BOARD

METHOD OF MANUFACTURING METAL-BASE SUBSTRATE AND METHOD OF MANUFACT...

METAL BASE CIRCUIT BOARD

CONDUCTIVE SHEET

METAL BASE CIRCUIT BOARD

LED LIGHT SOURCE UNIT

CONDUCTIVE RESIN COMPOSITION AND CONDUCTIVE SHEETS COMPRISING THE SAME

Conductive Composite Sheeting

SHEET FOR EMBOSSED CARRIER TAPE

Sheet and formed product thereof

Electroconductive resin composition

Sheet

Resin composition, molded product thereof and electroconductive sheet