Takeshi Onogami

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Beppu, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package with multilayer mold
- Patent number 10,879,144
- Issue date Dec 29, 2020
- Texas Instruments Incorporated
- Kengo Aoya
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE WITH MULTILAYER MOLD
- Publication number 20200058570
- Publication date Feb 20, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Kengo Aoya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL SIDED EMBEDDED DIE AND FABRICATION OF SAME BACKGROUND
- Publication number 20160240392
- Publication date Aug 18, 2016
- TEXAS INSTRUMENTS INCORPORATED
- Anindya Poddar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL SIDED EMBEDDED DIE AND FABRICATION OF SAME BACKGROUND
- Publication number 20150147845
- Publication date May 28, 2015
- TEXAS INSTRUMENTS INCORPORATED
- Anindya Poddar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE OF PANELIZED PACKAGING OF SEMICONDUCTOR DEVICES
- Publication number 20150008566
- Publication date Jan 8, 2015
- TEXAS INSTRUMENTS INCORPORATED
- Mark A. Gerber
- H01 - BASIC ELECTRIC ELEMENTS