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Electroless plating process
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Patent number 5,206,052
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Issue date Apr 27, 1993
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Hitachi Chemical Company, Ltd.
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Akishi Nakaso
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C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Electroless copper plating solution
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Patent number 5,076,840
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Issue date Dec 31, 1991
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Hitachi Chemical Co. Ltd.
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Takao Takita
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C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Catalyst for electroless plating
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Patent number 4,986,848
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Issue date Jan 22, 1991
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Hitachi Chemical Company, Ltd.
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Hiroshi Yamamoto
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C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Method of bonding copper and resin
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Patent number 4,642,161
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Issue date Feb 10, 1987
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Hitachi, Ltd.
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Haruo Akahoshi
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C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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