Takeshi Tamura

Person

Kumamoto, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Substrate processing apparatus and substrate processing method
- Patent number 12,020,936
- Issue date Jun 25, 2024
- Tokyo Electron Limited
- Hirotoshi Mori
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Transfer device, substrate processing system, transfer method and s...
- Patent number 11,837,487
- Issue date Dec 5, 2023
- Tokyo Electron Limited
- Takeshi Tamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding systems
- Patent number 10,340,248
- Issue date Jul 2, 2019
- Tokyo Electron Limited
- Masataka Matsunaga
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Separation apparatus, separation system, and separation method
- Patent number 10,071,544
- Issue date Sep 11, 2018
- Tokyo Electron Limited
- Osamu Hirakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate conveyance apparatus and substrate peeling system
- Patent number 9,679,798
- Issue date Jun 13, 2017
- Tokyo Electron Limited
- Yasuharu Iwashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Peeling system
- Patent number 9,595,462
- Issue date Mar 14, 2017
- Tokyo Electron Limited
- Takeshi Tamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate holding apparatus and substrate holding method
- Patent number 9,343,349
- Issue date May 17, 2016
- Tokyo Electron Limited
- Yasuharu Iwashita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Inspection device, bonding system and inspection method
- Patent number 9,097,681
- Issue date Aug 4, 2015
- Tokyo Electron Limited
- Shinji Koga
- G01 - MEASURING TESTING
Information Patent Grant
Joint system, joint method, program and computer storage medium
- Patent number 8,795,463
- Issue date Aug 5, 2014
- Tokyo Electron Limited
- Takahiro Nishibayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus and method
- Patent number 7,867,926
- Issue date Jan 11, 2011
- Tokyo Electron Limited
- Naoyuki Satoh
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Substrate processing apparatus
- Patent number 6,524,389
- Issue date Feb 25, 2003
- Tokyo Electron Limited
- Kyoshige Katayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus and substrate processing method
- Patent number 6,354,832
- Issue date Mar 12, 2002
- Tokyo Electron Limited
- Yuta Yoshimura
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20250006525
- Publication date Jan 2, 2025
- TOKYO ELECTRON LIMITED
- Takeshi Tamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING METHOD
- Publication number 20240017375
- Publication date Jan 18, 2024
- TOKYO ELECTRON LIMITED
- Takeshi TAMURA
- B24 - GRINDING POLISHING
Information Patent Application
THICKNESS MEASURING DEVICE AND THICKNESS MEASURING METHOD
- Publication number 20230341224
- Publication date Oct 26, 2023
- TOKYO ELECTRON LIMITED
- Takeshi TAMURA
- G01 - MEASURING TESTING
Information Patent Application
SEPARATING SYSTEM AND SEPARATING METHOD
- Publication number 20230178392
- Publication date Jun 8, 2023
- TOKYO ELECTRON LIMITED
- Satoshi Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20220044935
- Publication date Feb 10, 2022
- TOKYO ELECTRON LIMITED
- Hirotoshi MORI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE PROCESSING METHOD
- Publication number 20200234961
- Publication date Jul 23, 2020
- TOKYO ELECTRON LIMITED
- Takeshi TAMURA
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
TRANSFER DEVICE, SUBSTRATE PROCESSING SYSTEM, TRANSFER METHOD AND S...
- Publication number 20200234990
- Publication date Jul 23, 2020
- TOKYO ELECTRON LIMITED
- Takeshi TAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRINDING APPARATUS, GRINDING METHOD AND COMPUTER-READABLE RECORDING...
- Publication number 20200130124
- Publication date Apr 30, 2020
- Tokyo Electron Limited
- Takeshi TAMURA
- B24 - GRINDING POLISHING
Information Patent Application
Bonding System
- Publication number 20180019225
- Publication date Jan 18, 2018
- TOKYO ELECTRON LIMITED
- Masataka MATSUNAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PEELING SYSTEM
- Publication number 20150136331
- Publication date May 21, 2015
- TOKYO ELECTRON LIMITED
- Takeshi Tamura
- B32 - LAYERED PRODUCTS
Information Patent Application
SEPARATION APPARATUS, SEPARATION SYSTEM, SEPARATION METHOD AND NON-...
- Publication number 20140284000
- Publication date Sep 25, 2014
- Yasutaka SOMA
- B32 - LAYERED PRODUCTS
Information Patent Application
SUBSTRATE CONVEYANCE APPARATUS AND SUBSTRATE PEELING SYSTEM
- Publication number 20140234033
- Publication date Aug 21, 2014
- TOKYO ELECTRON LIMITED
- Yasuharu IWASHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSPECTION DEVICE, BONDING SYSTEM AND INSPECTION METHOD
- Publication number 20140054463
- Publication date Feb 27, 2014
- TOKYO ELECTRON LIMITED
- Shinji KOGA
- G01 - MEASURING TESTING
Information Patent Application
INSPECTION DEVICE, BONDING SYSTEM AND INSPECTION METHOD
- Publication number 20140055599
- Publication date Feb 27, 2014
- TOKYO ELECTRON LIMITED
- Shinji KOGA
- G01 - MEASURING TESTING
Information Patent Application
SUBSTRATE HOLDING APPARATUS AND SUBSTRATE HOLDING METHOD
- Publication number 20130264780
- Publication date Oct 10, 2013
- TOKYO ELECTRON LIMITED
- Yasuharu IWASHITA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEPARATION APPARATUS, SEPARATION SYSTEM, AND SEPARATION METHOD
- Publication number 20130146228
- Publication date Jun 13, 2013
- TOKYO ELECTRON LIMITED
- Osamu HIRAKAWA
- B32 - LAYERED PRODUCTS
Information Patent Application
CLEANING METHOD AND CLEANING APPARATUS
- Publication number 20130000684
- Publication date Jan 3, 2013
- TOKYO ELECTRON LIMITED
- Yasutaka SOMA
- B32 - LAYERED PRODUCTS
Information Patent Application
JOINT SYSTEM, JOINT METHOD, PROGRAM AND COMPUTER STORAGE MEDIUM
- Publication number 20120318432
- Publication date Dec 20, 2012
- TOKYO ELECTRON LIMITED
- Takahiro Nishibayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate processing apparatus and method
- Publication number 20090156019
- Publication date Jun 18, 2009
- Naoyuki Satoh
- H01 - BASIC ELECTRIC ELEMENTS

Takeshi Tamura

Person

Patents Grantslast 30 patents

Substrate processing apparatus and substrate processing method

Transfer device, substrate processing system, transfer method and s...

Bonding systems

Separation apparatus, separation system, and separation method

Substrate conveyance apparatus and substrate peeling system

Peeling system

Substrate holding apparatus and substrate holding method

Inspection device, bonding system and inspection method

Joint system, joint method, program and computer storage medium

Substrate processing apparatus and method

Substrate processing apparatus

Substrate processing apparatus and substrate processing method

Patents Applicationslast 30 patents

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING METHOD

THICKNESS MEASURING DEVICE AND THICKNESS MEASURING METHOD

SEPARATING SYSTEM AND SEPARATING METHOD

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

SUBSTRATE PROCESSING METHOD

TRANSFER DEVICE, SUBSTRATE PROCESSING SYSTEM, TRANSFER METHOD AND S...

GRINDING APPARATUS, GRINDING METHOD AND COMPUTER-READABLE RECORDING...

Bonding System

PEELING SYSTEM

SEPARATION APPARATUS, SEPARATION SYSTEM, SEPARATION METHOD AND NON-...

SUBSTRATE CONVEYANCE APPARATUS AND SUBSTRATE PEELING SYSTEM

INSPECTION DEVICE, BONDING SYSTEM AND INSPECTION METHOD

INSPECTION DEVICE, BONDING SYSTEM AND INSPECTION METHOD

SUBSTRATE HOLDING APPARATUS AND SUBSTRATE HOLDING METHOD

SEPARATION APPARATUS, SEPARATION SYSTEM, AND SEPARATION METHOD

CLEANING METHOD AND CLEANING APPARATUS

JOINT SYSTEM, JOINT METHOD, PROGRAM AND COMPUTER STORAGE MEDIUM

Substrate processing apparatus and method