Takuji SUKEKAWA

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Obu-city, JP

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Patents Grantslast 30 patents

Information Patent Grant
Flux and solder paste
- Patent number 10,099,321
- Issue date Oct 16, 2018
- Harima Chemicals, Inc.
- Kosuke Inoue
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reflow soldering system
- Patent number 8,807,416
- Issue date Aug 19, 2014
- Denso Corporation
- Takuji Sukekawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
FLUX AND SOLDER PASTE
- Publication number 20180339371
- Publication date Nov 29, 2018
- HARIMA CHEMICALS, INC.
- Kosuke INOUE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLUX AND SOLDER PASTE
- Publication number 20150343571
- Publication date Dec 3, 2015
- HARIMA CHEMICALS, INC.
- Kosuke INOUE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
REFLOW SOLDERING SYSTEM
- Publication number 20130119112
- Publication date May 16, 2013
- DENSO CORPORATION
- Takuji SUKEKAWA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLUX FOR SOLDER PASTE, AND SOLDER PASTE
- Publication number 20120291921
- Publication date Nov 22, 2012
- ARAKAWA CHEMICAL INDUSTRIES, LTD.
- Eiji Iwamura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER PASTE
- Publication number 20120291922
- Publication date Nov 22, 2012
- ARAKAWA CHEMICAL INDUSTRIES, LTD.
- Eiji Iwamura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR