Takuto Kazama

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Utsunomiya, JP

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Patents Grantslast 30 patents

Information Patent Grant
Methods of grinding semiconductor wafers having improved nanotopology
- Patent number 8,267,745
- Issue date Sep 18, 2012
- MEMC Electronic Materials, Inc.
- Milind S. Bhagavat
- B24 - GRINDING POLISHING
Information Patent Grant
Methods and systems for adjusting operation of a wafer grinder usin...
- Patent number 8,145,342
- Issue date Mar 27, 2012
- MEMC Electronic Materials, Inc.
- Sumeet S. Bhagavat
- B24 - GRINDING POLISHING
Information Patent Grant
Wafer clamping device for a double side grinder
- Patent number 8,066,553
- Issue date Nov 29, 2011
- MEMC Electronic Materials, Inc.
- Milind S. Bhagavat
- B24 - GRINDING POLISHING
Information Patent Grant
Nanotopography control and optimization using feedback from warp data
- Patent number 7,930,058
- Issue date Apr 19, 2011
- MEMC Electronic Materials, Inc.
- Sumeet S. Bhagavat
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
Methods of Grinding Semiconductor Wafers Having Improved Nanotopology
- Publication number 20110101504
- Publication date May 5, 2011
- MEMC Electronic Materials, Inc.
- Milind S. Bhagavat
- B24 - GRINDING POLISHING
Information Patent Application
Methods and Systems For Adjusting Operation Of A Wafer Grinder Usin...
- Publication number 20110045740
- Publication date Feb 24, 2011
- MEMC Electronic Materials, Inc.
- Sumeet S. Bhagavat
- B24 - GRINDING POLISHING
Information Patent Application
NANOTOPOGRAPHY CONTROL AND OPTIMIZATION USING FEEDBACK FROM WARP DATA
- Publication number 20080166948
- Publication date Jul 10, 2008
- MEMC Electronic Materials, Inc.
- Sumeet S. Bhagavat
- B24 - GRINDING POLISHING
Information Patent Application
Wafer Clamping Device For A Double Side Grinder
- Publication number 20080020684
- Publication date Jan 24, 2008
- MEMC ELECTRONIC MATERIALS, INCORPORATED
- Milind S. Bhagavat
- B24 - GRINDING POLISHING