Takuya Oda

Person

Nagano-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic component case and electronic component device
- Patent number 9,933,822
- Issue date Apr 3, 2018
- Shinko Electric Industries Co., Ltd.
- Minshong Tan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of manufacturing metal composite material, metal composite m...
- Patent number 9,920,232
- Issue date Mar 20, 2018
- Shinko Electric Industries Co., Ltd.
- Syuzo Aoki
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Carbon nanotube sheet, semiconductor device, method of manufacturin...
- Patent number 9,873,825
- Issue date Jan 23, 2018
- Shinko Electric Industries Co., Ltd.
- Takuya Oda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component case and electronic component device
- Patent number 9,332,659
- Issue date May 3, 2016
- Shinko Electric Industries Co., Ltd.
- Minshong Tan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing metal composite material, metal composite m...
- Patent number 9,101,981
- Issue date Aug 11, 2015
- Shinko Electric Industries Co., Ltd.
- Syuzo Aoki
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Semiconductor package, method of evaluating same, and method of man...
- Patent number 8,350,263
- Issue date Jan 8, 2013
- Shinko Electric Industries Co., Ltd.
- Takuya Oda
- G01 - MEASURING TESTING
Information Patent Grant
Method of manufacturing electronic component device
- Patent number 8,127,439
- Issue date Mar 6, 2012
- Shinko Electric Industries Co., Ltd.
- Takuya Oda
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Thermal conductive member, manufacturing method of the thermal cond...
- Patent number 8,130,500
- Issue date Mar 6, 2012
- Shinko Electric Industries Co., Ltd.
- Takuya Oda
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor package
- Patent number 7,768,122
- Issue date Aug 3, 2010
- Shinko Electric Industries Co., Ltd.
- Takuya Oda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical semiconductor device
- Patent number 7,090,413
- Issue date Aug 15, 2006
- Shinko Electric Industries Co., Ltd.
- Takuya Oda
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
Electronic Component Case and Electronic Component Device
- Publication number 20160209888
- Publication date Jul 21, 2016
- Shinko Electric Industries Co., Ltd.
- Minshong TAN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD OF MANUFACTURING METAL COMPOSITE MATERIAL, METAL COMPOSITE M...
- Publication number 20150307765
- Publication date Oct 29, 2015
- Shinko Electric Industries Co., Ltd.
- Syuzo AOKI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CARBON NANOTUBE SHEET, SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURIN...
- Publication number 20150206822
- Publication date Jul 23, 2015
- Shinko Electric Industries Co., Ltd.
- Takuya ODA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ELECTRONIC COMPONENT CASE AND ELECTRONIC COMPONENT DEVICE
- Publication number 20150092337
- Publication date Apr 2, 2015
- Shinko Electric Industries Co., Ltd.
- Minshong TAN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD OF MANUFACTURING METAL COMPOSITE MATERIAL, METAL COMPOSITE M...
- Publication number 20120189839
- Publication date Jul 26, 2012
- NAGANO PREFECTURE
- Syuzo AOKI
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
SEMICONDUCTOR PACKAGE, METHOD OF EVALUATING SAME, AND METHOD OF MAN...
- Publication number 20110101349
- Publication date May 5, 2011
- Shinko Electric Industries Co., Ltd.
- Takuya ODA
- G01 - MEASURING TESTING
Information Patent Application
THERMAL CONDUCTIVE MEMBER, MANUFACTURING METHOD OF THE THERMAL COND...
- Publication number 20110090650
- Publication date Apr 21, 2011
- Shinko Electric Industries Co., Ltd.
- Takuya Oda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING ELECTRONIC COMPONENT DEVICE
- Publication number 20100299918
- Publication date Dec 2, 2010
- Shinko Electric Industries Co., Ltd.
- Takuya Oda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SINK COMPONENT AND A METHOD OF PRODUCING A HEAT SINK COMPONENT
- Publication number 20090195989
- Publication date Aug 6, 2009
- Shinko Electric Industries Co., Ltd.
- Takuya ODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING OPTICAL DEVICE
- Publication number 20080299303
- Publication date Dec 4, 2008
- Shinko Electric Industries Co., Ltd.
- Suguru Kobayashi
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20080150065
- Publication date Jun 26, 2008
- Shinko Electric Industries Co., Ltd.
- Takuya Oda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Optical element housing package
- Publication number 20060102923
- Publication date May 18, 2006
- Takuya Oda
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Optical semiconductor device
- Publication number 20050238296
- Publication date Oct 27, 2005
- Takuya Oda
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Person

Patents Grantslast 30 patents

Electronic component case and electronic component device

Method of manufacturing metal composite material, metal composite m...

Carbon nanotube sheet, semiconductor device, method of manufacturin...

Electronic component case and electronic component device

Method of manufacturing metal composite material, metal composite m...

Semiconductor package, method of evaluating same, and method of man...

Method of manufacturing electronic component device

Thermal conductive member, manufacturing method of the thermal cond...

Semiconductor package

Optical semiconductor device

Patents Applicationslast 30 patents

Electronic Component Case and Electronic Component Device

METHOD OF MANUFACTURING METAL COMPOSITE MATERIAL, METAL COMPOSITE M...

CARBON NANOTUBE SHEET, SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURIN...

ELECTRONIC COMPONENT CASE AND ELECTRONIC COMPONENT DEVICE

METHOD OF MANUFACTURING METAL COMPOSITE MATERIAL, METAL COMPOSITE M...

SEMICONDUCTOR PACKAGE, METHOD OF EVALUATING SAME, AND METHOD OF MAN...

THERMAL CONDUCTIVE MEMBER, MANUFACTURING METHOD OF THE THERMAL COND...

METHOD OF MANUFACTURING ELECTRONIC COMPONENT DEVICE

HEAT SINK COMPONENT AND A METHOD OF PRODUCING A HEAT SINK COMPONENT

METHOD OF MANUFACTURING OPTICAL DEVICE

SEMICONDUCTOR PACKAGE

Optical element housing package

Optical semiconductor device