Tamanari Yasuda

Follow

Person

Hamura-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Wire bonding method and wire bonding apparatus
- Patent number 11,901,329
- Issue date Feb 13, 2024
- Kaijo Corporation
- Mami Kushima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding method, method of forming bump and bump
- Patent number 6,715,666
- Issue date Apr 6, 2004
- Kaijo Corporation
- Rei Imai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
WIRE BONDING METHOD AND WIRE BONDING APPARATUS
- Publication number 20210351155
- Publication date Nov 11, 2021
- KAIJO CORPORATION
- Mami KUSHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING METHOD, METHOD OF FORMING BUMP AND BUMP
- Publication number 20040026480
- Publication date Feb 12, 2004
- KAIJO CORPORATION
- Rei Imai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR