Tan Kim Hwee

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Package design and method of manufacture for chip grid array
- Patent number 7,456,496
- Issue date Nov 25, 2008
- Advanpack Solutions PTE LTD
- Tan Kim Hwee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package design and method of manufacture for chip grid array
- Patent number 6,929,981
- Issue date Aug 16, 2005
- Advanpack Solutions PTE, Ltd.
- Tan Kim Hwee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of assembling a package with an exposed die backside with an...
- Patent number 6,750,082
- Issue date Jun 15, 2004
- Advanpack Solutions PTE LTD
- John Briar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip grid array package design and method of manufacture
- Patent number 6,734,039
- Issue date May 11, 2004
- Advanpack Solutions PTE LTD
- Tan Kim Hwee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming a flip chip semiconductor package
- Patent number 6,510,976
- Issue date Jan 28, 2003
- Advanpack Solutions PTE LTD
- Tan Kim Hwee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Package design and method of manufacture for chip grid array
- Publication number 20050205987
- Publication date Sep 22, 2005
- Advanpack Solutions Pte. Ltd.
- Tan Kim Hwee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip chip package using no-flow underfill and method of fabrication
- Publication number 20050087883
- Publication date Apr 28, 2005
- Advanpack Solutions Pte. Ltd.
- Tan Kim Hwee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of assembling a package with an exposed die backside with an...
- Publication number 20040053445
- Publication date Mar 18, 2004
- Advanpack Solutions Pte. Ltd.
- John Briar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor chip grid array package design and method of manufacture
- Publication number 20040046238
- Publication date Mar 11, 2004
- Advanpack Solutions Pte. Ltd.
- Tan Kim Hwee
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Package design and method of manufacture for chip grid array
- Publication number 20040046257
- Publication date Mar 11, 2004
- Advanpack Solutions Pte. Ltd.
- Tan Kim Hwee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A FLIP CHIP SEMICONDUCTOR PACKAGE
- Publication number 20020170942
- Publication date Nov 21, 2002
- Tan Kim Hwee
- H01 - BASIC ELECTRIC ELEMENTS