Tan kok Chua

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Patents Grantslast 30 patents

Information Patent Grant
Method and apparatus for cutting semiconductor wafers
- Patent number 7,018,270
- Issue date Mar 28, 2006
- Micron Technology, Inc.
- Neo Chee Peng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for cutting semiconductor wafers
- Patent number 6,939,199
- Issue date Sep 6, 2005
- Micron Technology, Inc.
- Neo Chee Peng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for cutting semiconductor wafers
- Patent number 6,576,531
- Issue date Jun 10, 2003
- Micron Technology, Inc.
- Neo Chee Peng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Underfill applications using film technology
- Patent number 6,514,797
- Issue date Feb 4, 2003
- Micron Technology, Inc.
- Tay L. Chee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Stacked die packages
- Publication number 20070252260
- Publication date Nov 1, 2007
- Micron Technology, Inc.
- Tay Liang Chee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for cutting semiconductor wafers
- Publication number 20050268763
- Publication date Dec 8, 2005
- Neo Chee Peng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and apparatus for cutting semiconductor wafers
- Publication number 20030203538
- Publication date Oct 30, 2003
- Neo Chee Peng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR CUTTING SEMICONDUCTOR WAFERS
- Publication number 20030060022
- Publication date Mar 27, 2003
- Neo Chee Peng
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Underfill applications using film technology
- Publication number 20020130401
- Publication date Sep 19, 2002
- Tay L. Chee
- H01 - BASIC ELECTRIC ELEMENTS