Tao Wu

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method and system for cryptocurrency mining center
- Patent number 12,086,879
- Issue date Sep 10, 2024
- BITMAINTECH PTE. LTD.
- Tao Wu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
System and methods for system operation for narrowband-LTE for cell...
- Patent number 11,533,675
- Issue date Dec 20, 2022
- Apple Inc.
- Debdeep Chatterjee
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Reduced capacitance land pad
- Patent number 11,516,915
- Issue date Nov 29, 2022
- Intel Corporation
- Zhichao Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of forming a package substrate
- Patent number 11,443,970
- Issue date Sep 13, 2022
- Intel Corporation
- Manohar S. Konchady
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vehicle density over the air update scheduling
- Patent number 11,206,513
- Issue date Dec 21, 2021
- Ford Global Technologies, LLC
- Jerry John
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Synchronization signals and channel structure for narrowband LTE de...
- Patent number 10,863,459
- Issue date Dec 8, 2020
- Apple Inc.
- Tao Wu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Transmitting system information change notifications to MTC devices
- Patent number 10,743,237
- Issue date Aug 11, 2020
- Apple Inc.
- Satish Jha
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Solder resist layers for coreless packages and methods of fabrication
- Patent number 10,629,469
- Issue date Apr 21, 2020
- Intel Corporation
- Manohar S. Konchady
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vehicle platooning management and power control with LTE/5G V2X com...
- Patent number 10,440,668
- Issue date Oct 8, 2019
- Ford Global Technologies, LLC
- Tao Wu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Reduced capacitance land pad
- Patent number 10,433,421
- Issue date Oct 1, 2019
- Intel Corporation
- Zhichao Zhang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Narrowband-physical random access channel techniques
- Patent number 10,383,151
- Issue date Aug 13, 2019
- Intel IP Corporation
- Depdeep Chatterjee
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Evolved Node-B, user equipment, and methods for paging using a bitm...
- Patent number 9,955,453
- Issue date Apr 24, 2018
- Intel Corporation
- Mohammad Mamunur Rashid
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Non-uniform substrate stackup
- Patent number 9,806,011
- Issue date Oct 31, 2017
- Intel Corporation
- Zhichao Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual side solder resist layers for coreless packages and packages w...
- Patent number 9,704,735
- Issue date Jul 11, 2017
- Intel Corporation
- Manohar S. Konchady
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pin grid interposer
- Patent number 9,607,937
- Issue date Mar 28, 2017
- Intel Corporation
- Nicholas R. Watts
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Crosstalk polarity reversal and cancellation through substrate mate...
- Patent number 9,564,407
- Issue date Feb 7, 2017
- Intel Corporation
- Zhichao Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Crosstalk polarity reversal and cancellation through substrate mate...
- Patent number 9,391,018
- Issue date Jul 12, 2016
- Intel Corporation
- Zhichao Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device packaging with substrates having embedded lines and metal de...
- Patent number 9,355,952
- Issue date May 31, 2016
- Intel Corporation
- Mark S Hlad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip package incorporating interfacial adhesion through conductor s...
- Patent number 9,331,017
- Issue date May 3, 2016
- Intel Corporation
- Tao Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enabling package-on-package (PoP) pad surface finishes on bumpless...
- Patent number 9,299,602
- Issue date Mar 29, 2016
- Intel Corporation
- Qinglei Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Non-uniform substrate stackup
- Patent number 9,232,639
- Issue date Jan 5, 2016
- Intel Corporation
- Zhichao Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Enabling package-on-package (PoP) pad surface finishes on bumpless...
- Patent number 9,190,315
- Issue date Nov 17, 2015
- Intel Corporation
- Qinglei Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device packaging with substrates having embedded lines and metal de...
- Patent number 9,093,313
- Issue date Jul 28, 2015
- Intel Corporation
- Mark S Hlad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip package incorporating interfacial adhesion through conductor s...
- Patent number 8,871,634
- Issue date Oct 28, 2014
- Intel Corporation
- Tao Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device packaging with substrates having embedded lines and metal de...
- Patent number 8,835,217
- Issue date Sep 16, 2014
- Intel Corporation
- Mark S Hlad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Crosstalk polarity reversal and cancellation through substrate mate...
- Patent number 8,643,184
- Issue date Feb 4, 2014
- Intel Corporation
- Zhichao Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple surface finishes for microelectronic package substrates
- Patent number 8,461,036
- Issue date Jun 11, 2013
- Intel Corporation
- Tao Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrolytic depositon and via filling in coreless substrate proces...
- Patent number 8,127,979
- Issue date Mar 6, 2012
- Intel Corporation
- Tao Wu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND SYSTEM FOR CRYPTOCURRENCY MINING CENTER
- Publication number 20210192619
- Publication date Jun 24, 2021
- BITMAINTECH PTE. LTD.
- Tao WU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD AND SYSTEM FOR CRYPTOCURRENCY MINING CENTER
- Publication number 20210192499
- Publication date Jun 24, 2021
- BITMAINTECH PTE. LTD.
- Tao WU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SOLDER RESIST LAYERS FOR CORELESS PACKAGES AND METHODS OF FABRICATION
- Publication number 20200194300
- Publication date Jun 18, 2020
- Intel Corporation
- Manohar S. KONCHADY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCED CAPACITANCE LAND PAD
- Publication number 20190394876
- Publication date Dec 26, 2019
- Intel Corporation
- Zhichao ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM AND METHODS FOR SYSTEM OPERATION FOR NARROWBAND-LTE FOR CELL...
- Publication number 20180213468
- Publication date Jul 26, 2018
- Intel IP Corporation
- Debdeep Chatterjee
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
NARROWBAND-PHYSICAL RANDOM ACCESS CHANNEL TECHNIQUES
- Publication number 20180206271
- Publication date Jul 19, 2018
- Intel IP Corporation
- Depdeep Chatterjee
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SYNCHRONIZATION SIGNALS AND CHANNEL STRUCTURE FOR NARROWBAND LTE DE...
- Publication number 20180184390
- Publication date Jun 28, 2018
- Intel Corporation
- Tao Wu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
APPARATUS AND METHODS TO ACHIEVE UNIFORM PACKAGE THICKNESS
- Publication number 20180166294
- Publication date Jun 14, 2018
- Intel Corporation
- Zheng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSMITTING SYSTEM INFORMATION CHANGE NOTIFICATIONS TO MTC DEVICES
- Publication number 20180124685
- Publication date May 3, 2018
- Intel Corporation
- Satish Jha
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
DUAL SIDE SOLDER RESIST LAYERS FOR CORELESS PACKAGES AND PACKAGES W...
- Publication number 20170250150
- Publication date Aug 31, 2017
- Intel Corporation
- Manohar S. KONCHADY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-UNIFORM SUBSTRATE STACKUP
- Publication number 20170221727
- Publication date Aug 3, 2017
- Intel Corporation
- Zhichao Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EVOLVED NODE-B, USER EQUIPMENT, AND METHODS FOR PAGING USING A BITM...
- Publication number 20170064671
- Publication date Mar 2, 2017
- Intel Corporation
- Mohammad Mamunur Rashid
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
CROSSTALK POLARITY REVERSAL AND CANCELLATION THROUGH SUBSTRATE MATE...
- Publication number 20160300803
- Publication date Oct 13, 2016
- Intel Corporation
- Zhichao Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-UNIFORM SUBSTRATE STACKUP
- Publication number 20160104632
- Publication date Apr 14, 2016
- Intel Corporation
- Zhichao Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL SIDE SOLDER RESIST LAYERS FOR CORELESS PACKAGES AND PACKAGES W...
- Publication number 20160056102
- Publication date Feb 25, 2016
- Manohar S. Konchady
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE PACKAGING WITH SUBSTRATES HAVING EMBEDDED LINES AND METAL DE...
- Publication number 20150318238
- Publication date Nov 5, 2015
- Intel Corporation
- Mark S. Hlad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE INCORPORATING INTERFACIAL ADHESION THROUGH CONDUCTOR S...
- Publication number 20150021778
- Publication date Jan 22, 2015
- Tao Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE PACKAGING WITH SUBSTRATES HAVING EMBEDDED LINES AND METAL DE...
- Publication number 20150008578
- Publication date Jan 8, 2015
- Intel Corporation
- Mark S. Hlad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCED CAPACITANCE LAND PAD
- Publication number 20140174808
- Publication date Jun 26, 2014
- Zhichao Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
NON-UNIFORM SUBSTRATE STACKUP
- Publication number 20140160707
- Publication date Jun 12, 2014
- Zhichao Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CROSSTALK POLARITY REVERSAL AND CANCELLATION THROUGH SUBSTRATE MATE...
- Publication number 20140151875
- Publication date Jun 5, 2014
- Zhichao ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE INCORPORATING INTERFACIAL ADHESION THROUGH CONDUCTOR S...
- Publication number 20140061927
- Publication date Mar 6, 2014
- Tao Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE CORES FOR LASER THROUGH HOLE FORMATION
- Publication number 20140004361
- Publication date Jan 2, 2014
- Nikhil Sharma
- B32 - LAYERED PRODUCTS
Information Patent Application
ENABLING PACKAGE-ON-PACKAGE (POP) PAD SURFACE FINISHES ON BUMPLESS...
- Publication number 20130320547
- Publication date Dec 5, 2013
- Qinglei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIN GRID INTERPOSER
- Publication number 20130285242
- Publication date Oct 31, 2013
- Nicholas R. Watts
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE PACKAGING WITH SUBSTRATES HAVING EMBEDDED LINES AND METAL DE...
- Publication number 20120161330
- Publication date Jun 28, 2012
- Intel Corporation
- Mark S. Hlad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTROLYTIC DEPOSITON AND VIA FILLING IN CORELESS SUBSTRATE PROCES...
- Publication number 20120074209
- Publication date Mar 29, 2012
- Tao WU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ELECTROLYTIC GOLD OR GOLD PALLADIUM SURFACE FINISH APPLICATION IN C...
- Publication number 20120077054
- Publication date Mar 29, 2012
- Tao WU
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MULTIPLE SURFACE FINISHES FOR MICROELECTRONIC PACKAGE SUBSTRATES
- Publication number 20110147933
- Publication date Jun 23, 2011
- Tao Wu
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Coreless substrate package with symmetric external dielectric layers
- Publication number 20090321932
- Publication date Dec 31, 2009
- Javier Soto Gonzalez
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Person

Patents Grantslast 30 patents

Method and system for cryptocurrency mining center

System and methods for system operation for narrowband-LTE for cell...

Reduced capacitance land pad

Methods of forming a package substrate

Vehicle density over the air update scheduling

Synchronization signals and channel structure for narrowband LTE de...

Transmitting system information change notifications to MTC devices

Solder resist layers for coreless packages and methods of fabrication

Vehicle platooning management and power control with LTE/5G V2X com...

Reduced capacitance land pad

Narrowband-physical random access channel techniques

Evolved Node-B, user equipment, and methods for paging using a bitm...

Non-uniform substrate stackup

Dual side solder resist layers for coreless packages and packages w...

Pin grid interposer

Crosstalk polarity reversal and cancellation through substrate mate...

Crosstalk polarity reversal and cancellation through substrate mate...

Device packaging with substrates having embedded lines and metal de...

Chip package incorporating interfacial adhesion through conductor s...

Enabling package-on-package (PoP) pad surface finishes on bumpless...

Non-uniform substrate stackup

Enabling package-on-package (PoP) pad surface finishes on bumpless...

Device packaging with substrates having embedded lines and metal de...

Chip package incorporating interfacial adhesion through conductor s...

Device packaging with substrates having embedded lines and metal de...

Crosstalk polarity reversal and cancellation through substrate mate...

Multiple surface finishes for microelectronic package substrates

Electrolytic depositon and via filling in coreless substrate proces...

Patents Applicationslast 30 patents

METHOD AND SYSTEM FOR CRYPTOCURRENCY MINING CENTER

METHOD AND SYSTEM FOR CRYPTOCURRENCY MINING CENTER

SOLDER RESIST LAYERS FOR CORELESS PACKAGES AND METHODS OF FABRICATION

REDUCED CAPACITANCE LAND PAD

SYSTEM AND METHODS FOR SYSTEM OPERATION FOR NARROWBAND-LTE FOR CELL...

NARROWBAND-PHYSICAL RANDOM ACCESS CHANNEL TECHNIQUES

SYNCHRONIZATION SIGNALS AND CHANNEL STRUCTURE FOR NARROWBAND LTE DE...

APPARATUS AND METHODS TO ACHIEVE UNIFORM PACKAGE THICKNESS

TRANSMITTING SYSTEM INFORMATION CHANGE NOTIFICATIONS TO MTC DEVICES

DUAL SIDE SOLDER RESIST LAYERS FOR CORELESS PACKAGES AND PACKAGES W...

NON-UNIFORM SUBSTRATE STACKUP

EVOLVED NODE-B, USER EQUIPMENT, AND METHODS FOR PAGING USING A BITM...

CROSSTALK POLARITY REVERSAL AND CANCELLATION THROUGH SUBSTRATE MATE...

NON-UNIFORM SUBSTRATE STACKUP

DUAL SIDE SOLDER RESIST LAYERS FOR CORELESS PACKAGES AND PACKAGES W...

DEVICE PACKAGING WITH SUBSTRATES HAVING EMBEDDED LINES AND METAL DE...

CHIP PACKAGE INCORPORATING INTERFACIAL ADHESION THROUGH CONDUCTOR S...

DEVICE PACKAGING WITH SUBSTRATES HAVING EMBEDDED LINES AND METAL DE...

REDUCED CAPACITANCE LAND PAD

NON-UNIFORM SUBSTRATE STACKUP

CROSSTALK POLARITY REVERSAL AND CANCELLATION THROUGH SUBSTRATE MATE...

CHIP PACKAGE INCORPORATING INTERFACIAL ADHESION THROUGH CONDUCTOR S...

SUBSTRATE CORES FOR LASER THROUGH HOLE FORMATION

ENABLING PACKAGE-ON-PACKAGE (POP) PAD SURFACE FINISHES ON BUMPLESS...

PIN GRID INTERPOSER

DEVICE PACKAGING WITH SUBSTRATES HAVING EMBEDDED LINES AND METAL DE...

ELECTROLYTIC DEPOSITON AND VIA FILLING IN CORELESS SUBSTRATE PROCES...

ELECTROLYTIC GOLD OR GOLD PALLADIUM SURFACE FINISH APPLICATION IN C...

MULTIPLE SURFACE FINISHES FOR MICROELECTRONIC PACKAGE SUBSTRATES

Coreless substrate package with symmetric external dielectric layers