Tarak A. Railkar

Person

Plano, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method for packaging an integrated circuit (IC) package with embedd...
- Patent number 11,929,300
- Issue date Mar 12, 2024
- Qorvo US, Inc.
- Kevin J. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for making laminate substrate with sintered components
- Patent number 11,783,998
- Issue date Oct 10, 2023
- Qorvo US, Inc.
- Tarak A. Railkar
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Integrated circuit (IC) package with embedded heat spreader in a re...
- Patent number 11,626,340
- Issue date Apr 11, 2023
- Qorvo US, Inc.
- Kevin J. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate with embedded active thermoelectric cooler
- Patent number 11,551,995
- Issue date Jan 10, 2023
- Qorvo US, Inc.
- Mark C. Woods
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminate substrate with sintered components
- Patent number 10,906,274
- Issue date Feb 2, 2021
- Qorvo US, Inc.
- Tarak A. Railkar
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Multi-layer substrate with integrated resonator
- Patent number 10,587,029
- Issue date Mar 10, 2020
- Qorvo US, Inc.
- Jeffrey Dekosky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminate-based package with internal overmold
- Patent number 10,390,434
- Issue date Aug 20, 2019
- Qorvo US, Inc.
- Kevin J. Anderson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Air-cavity package with enhanced package integration level and ther...
- Patent number 10,217,686
- Issue date Feb 26, 2019
- Qorvo US, Inc.
- Walid M. Meliane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air cavity package
- Patent number 10,177,064
- Issue date Jan 8, 2019
- Qorvo US, Inc.
- Kevin J. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-power acoustic device with improved performance
- Patent number 10,141,245
- Issue date Nov 27, 2018
- Qorvo US, Inc.
- Tarak A. Railkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Graphene heat dissipating structure
- Patent number 10,096,536
- Issue date Oct 9, 2018
- National Technology & Engineering Solutions of Sandia, LLC
- Cody M. Washburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air-cavity package with enhanced package integration level and ther...
- Patent number 9,991,181
- Issue date Jun 5, 2018
- Qorvo US, Inc.
- Walid M. Meliane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air-cavity package with two heat dissipation interfaces
- Patent number 9,974,158
- Issue date May 15, 2018
- Qorvo US, Inc.
- Tarak A. Railkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with lid having lid conductive structure
- Patent number 9,799,637
- Issue date Oct 24, 2017
- Qorvo US, Inc.
- Brian P. Balut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hollow-cavity flip-chip package with reinforced interconnects and p...
- Patent number 9,793,237
- Issue date Oct 17, 2017
- Qorvo US, Inc.
- Tarak A. Railkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Graphene heat dissipating structure
- Patent number 9,721,867
- Issue date Aug 1, 2017
- National Technology & Engineering Solutions of Sandia, LLC
- Cody M. Washburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses, systems, and methods for die attach coatings for semic...
- Patent number 9,659,898
- Issue date May 23, 2017
- Qorvo US, Inc.
- Tarak A. Railkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate with embedded sintered heat spreader and process for maki...
- Patent number 9,589,864
- Issue date Mar 7, 2017
- Qorvo US, Inc.
- Tarak A. Railkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced grounding scheme
- Patent number 9,585,240
- Issue date Feb 28, 2017
- Qorvo US, Inc.
- Thomas R. Landon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package for high-power semiconductor devices
- Patent number 9,559,034
- Issue date Jan 31, 2017
- Qorvo US, Inc.
- Tarak A. Railkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate vias for heat removal from semiconductor die
- Patent number 8,946,904
- Issue date Feb 3, 2015
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Tarak A. Railkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package for high-power semiconductor devices
- Patent number 8,946,894
- Issue date Feb 3, 2015
- TriQuint Semiconductor, Inc.
- Tarak A. Railkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package including a three-dimensional fan-out/fa...
- Patent number 8,921,995
- Issue date Dec 30, 2014
- Maxim Intergrated Products, Inc.
- Tarak A. Railkar
- G02 - OPTICS
Information Patent Grant
Thermal via structures with surface features
- Patent number 8,908,383
- Issue date Dec 9, 2014
- TriQuint Semiconductor, Inc.
- Tarak A. Railkar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor structure comprising pillar
- Patent number 8,314,472
- Issue date Nov 20, 2012
- Avago Technologies Wireless IP (Singapore) Pte. Ltd.
- Ray Parkhurst
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally enhanced semiconductor package
- Patent number 8,304,293
- Issue date Nov 6, 2012
- Maxim Integrated, Inc.
- Tarak A. Railkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically conductive matrix for z-axis interconnect
- Patent number 8,097,963
- Issue date Jan 17, 2012
- Maxim Integrated Products, Inc.
- Steven D. Cate
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally enhanced semiconductor package
- Patent number 8,018,051
- Issue date Sep 13, 2011
- Maxim Integrated Products, Inc.
- Tarak A. Railkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package including a three-dimensional fan-out /...
- Patent number 7,982,305
- Issue date Jul 19, 2011
- Maxim Integrated Products, Inc.
- Tarak A. Railkar
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
BARE FLIP-CHIP DIE STACK AND THE FABRICATION METHOD AND TOOLING THE...
- Publication number 20250015053
- Publication date Jan 9, 2025
- Qorvo US, Inc.
- Tarak A. Railkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR MAKING LAMINATE SUBSTRATE WITH SINTERED COMPONENTS
- Publication number 20230395321
- Publication date Dec 7, 2023
- Qorvo US, Inc.
- Tarak A. Railkar
- B22 - CASTING POWDER METALLURGY
Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGE WITH EMBEDDED HEAT SPREADER IN A RE...
- Publication number 20230207415
- Publication date Jun 29, 2023
- Qorvo US, Inc.
- Kevin J. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE METALLIZATION FOR SEMICONDUCTOR ASSEMBLY
- Publication number 20230178486
- Publication date Jun 8, 2023
- Qorvo US, Inc.
- Tarak A. Railkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGE WITH EMBEDDED HEAT SPREADER IN A RE...
- Publication number 20210183722
- Publication date Jun 17, 2021
- Qorvo US, Inc.
- Kevin J. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATE SUBSTRATE WITH SINTERED COMPONENTS
- Publication number 20200147938
- Publication date May 14, 2020
- Qorvo US, Inc.
- Tarak A. Railkar
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
PROCESS FOR MAKING LAMINATE SUBSTRATE WITH SINTERED COMPONENTS
- Publication number 20200147695
- Publication date May 14, 2020
- Qorvo US, Inc.
- Tarak A. Railkar
- B22 - CASTING POWDER METALLURGY
Information Patent Application
SUBSTRATE WITH EMBEDDED ACTIVE THERMOELECTRIC COOLER
- Publication number 20190131209
- Publication date May 2, 2019
- Qorvo US, Inc.
- Mark C. Woods
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATE-BASED PACKAGE WITH INTERNAL OVERMOLD
- Publication number 20190116670
- Publication date Apr 18, 2019
- Qorvo US, Inc.
- Kevin J. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER SUBSTRATE WITH INTEGRATED RESONATOR
- Publication number 20190074571
- Publication date Mar 7, 2019
- Qorvo US, Inc.
- Jeffrey Dekosky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIR-CAVITY PACKAGE WITH ENHANCED PACKAGE INTEGRATION LEVEL AND THER...
- Publication number 20180218955
- Publication date Aug 2, 2018
- Qorvo US, Inc.
- Walid M. Meliane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-POWER ACOUSTIC DEVICE WITH IMPROVED PERFORMANCE
- Publication number 20180061744
- Publication date Mar 1, 2018
- Qorvo US, Inc.
- Tarak A. Railkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIR-CAVITY PACKAGE WITH TWO HEAT DISSIPATION INTERFACES
- Publication number 20180063940
- Publication date Mar 1, 2018
- Qorvo US, Inc.
- Tarak A. Railkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIR-CAVITY PACKAGE WITH ENHANCED PACKAGE INTEGRATION LEVEL AND THER...
- Publication number 20180061725
- Publication date Mar 1, 2018
- Qorvo US, Inc.
- Walid M. Meliane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIR CAVITY PACKAGE
- Publication number 20180061730
- Publication date Mar 1, 2018
- Qorvo US, Inc.
- Kevin J. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH LID HAVING LID CONDUCTIVE STRUCTURE
- Publication number 20170236808
- Publication date Aug 17, 2017
- Qorvo US, Inc.
- Brian P. Balut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HOLLOW-CAVITY FLIP-CHIP PACKAGE WITH REINFORCED INTERCONNECTS AND P...
- Publication number 20170110434
- Publication date Apr 20, 2017
- TriQuint Semiconductor, Inc.
- Tarak A. Railkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE WITH EMBEDDED SINTERED HEAT SPREADER AND PROCESS FOR MAKI...
- Publication number 20160336254
- Publication date Nov 17, 2016
- RF Micro Devices, Inc.
- Tarak A. Railkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE FOR HIGH-POWER SEMICONDUCTOR DEVICES
- Publication number 20160155681
- Publication date Jun 2, 2016
- TriQuint Semiconductor, Inc.
- Tarak A. Railkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED GROUNDING SCHEME
- Publication number 20150116947
- Publication date Apr 30, 2015
- TriQuint Semiconductor, Inc.
- Thomas R. Landon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE FOR HIGH-POWER SEMICONDUCTOR DEVICES
- Publication number 20150104906
- Publication date Apr 16, 2015
- TriQuint Semiconductor, Inc.
- Tarak A. Railkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE FOR HIGH-POWER SEMICONDUCTOR DEVICES
- Publication number 20140231815
- Publication date Aug 21, 2014
- TriQuint Semiconductor, Inc.
- Tarak A. Railkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE VIAS FOR HEAT REMOVAL FROM SEMICONDUCTOR DIE
- Publication number 20120049345
- Publication date Mar 1, 2012
- Avago Technologies Wireless IP (Singapore) Pte. Ltd.
- Tarak A. Railkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE COMPRISING PILLAR
- Publication number 20120025269
- Publication date Feb 2, 2012
- Avago Technologies Wireless IP (Singapore) Pte. Ltd.
- Ray Parkhurst
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermally Enhanced Semiconductor Package
- Publication number 20120003794
- Publication date Jan 5, 2012
- Tarak A. Railkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermally Enhanced Semiconductor Package
- Publication number 20100193942
- Publication date Aug 5, 2010
- Tarak A. Railkar
- H01 - BASIC ELECTRIC ELEMENTS

Tarak A. Railkar

Person

Patents Grantslast 30 patents

Method for packaging an integrated circuit (IC) package with embedd...

Process for making laminate substrate with sintered components

Integrated circuit (IC) package with embedded heat spreader in a re...

Substrate with embedded active thermoelectric cooler

Laminate substrate with sintered components

Multi-layer substrate with integrated resonator

Laminate-based package with internal overmold

Air-cavity package with enhanced package integration level and ther...

Air cavity package

High-power acoustic device with improved performance

Graphene heat dissipating structure

Air-cavity package with enhanced package integration level and ther...

Air-cavity package with two heat dissipation interfaces

Semiconductor package with lid having lid conductive structure

Hollow-cavity flip-chip package with reinforced interconnects and p...

Graphene heat dissipating structure

Apparatuses, systems, and methods for die attach coatings for semic...

Substrate with embedded sintered heat spreader and process for maki...

Advanced grounding scheme

Package for high-power semiconductor devices

Substrate vias for heat removal from semiconductor die

Package for high-power semiconductor devices

Integrated circuit package including a three-dimensional fan-out/fa...

Thermal via structures with surface features

Semiconductor structure comprising pillar

Thermally enhanced semiconductor package

Electrically conductive matrix for z-axis interconnect

Thermally enhanced semiconductor package

Integrated circuit package including a three-dimensional fan-out /...

Patents Applicationslast 30 patents

BARE FLIP-CHIP DIE STACK AND THE FABRICATION METHOD AND TOOLING THE...

PROCESS FOR MAKING LAMINATE SUBSTRATE WITH SINTERED COMPONENTS

INTEGRATED CIRCUIT (IC) PACKAGE WITH EMBEDDED HEAT SPREADER IN A RE...

BACKSIDE METALLIZATION FOR SEMICONDUCTOR ASSEMBLY

INTEGRATED CIRCUIT (IC) PACKAGE WITH EMBEDDED HEAT SPREADER IN A RE...

LAMINATE SUBSTRATE WITH SINTERED COMPONENTS

PROCESS FOR MAKING LAMINATE SUBSTRATE WITH SINTERED COMPONENTS

SUBSTRATE WITH EMBEDDED ACTIVE THERMOELECTRIC COOLER

LAMINATE-BASED PACKAGE WITH INTERNAL OVERMOLD

MULTI-LAYER SUBSTRATE WITH INTEGRATED RESONATOR

AIR-CAVITY PACKAGE WITH ENHANCED PACKAGE INTEGRATION LEVEL AND THER...

HIGH-POWER ACOUSTIC DEVICE WITH IMPROVED PERFORMANCE

AIR-CAVITY PACKAGE WITH TWO HEAT DISSIPATION INTERFACES

AIR-CAVITY PACKAGE WITH ENHANCED PACKAGE INTEGRATION LEVEL AND THER...

AIR CAVITY PACKAGE

SEMICONDUCTOR PACKAGE WITH LID HAVING LID CONDUCTIVE STRUCTURE

HOLLOW-CAVITY FLIP-CHIP PACKAGE WITH REINFORCED INTERCONNECTS AND P...

SUBSTRATE WITH EMBEDDED SINTERED HEAT SPREADER AND PROCESS FOR MAKI...

PACKAGE FOR HIGH-POWER SEMICONDUCTOR DEVICES

ADVANCED GROUNDING SCHEME

PACKAGE FOR HIGH-POWER SEMICONDUCTOR DEVICES

PACKAGE FOR HIGH-POWER SEMICONDUCTOR DEVICES

SUBSTRATE VIAS FOR HEAT REMOVAL FROM SEMICONDUCTOR DIE

SEMICONDUCTOR STRUCTURE COMPRISING PILLAR

Thermally Enhanced Semiconductor Package

Thermally Enhanced Semiconductor Package