Tariq Majid

Person

Wilsonville, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Gap fill process stability monitoring of an electroplating process...
- Patent number 10,358,738
- Issue date Jul 23, 2019
- Lam Research Corporation
- Quan Ma
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Apparatus and method for edge bevel removal of copper from silicon...
- Patent number 9,685,353
- Issue date Jun 20, 2017
- Novellus Systems, Inc.
- Kousik Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Membrane design for reducing defects in electroplating systems
- Patent number 9,677,190
- Issue date Jun 13, 2017
- Lam Research Corporation
- Doyeon Kim
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Apparatus and method for edge bevel removal of copper from silicon...
- Patent number 8,419,964
- Issue date Apr 16, 2013
- Novellus Systems, Inc.
- Kousik Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rapidly cleanable electroplating cup seal
- Patent number 8,398,831
- Issue date Mar 19, 2013
- Novellus Systems, Inc.
- Shantinath Ghongadi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroplating cup assembly
- Patent number 8,377,268
- Issue date Feb 19, 2013
- Novellus Systems, Inc.
- Robert Rash
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Closed contact electroplating cup assembly
- Patent number 7,985,325
- Issue date Jul 26, 2011
- Novellus Systems, Inc.
- Robert Rash
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Rapidly cleanable electroplating cup assembly
- Patent number 7,935,231
- Issue date May 3, 2011
- Novellus Systems, Inc.
- Shantinath Ghongadi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroplating using DC current interruption and variable rotation...
- Patent number 6,884,335
- Issue date Apr 26, 2005
- Novellus Systems, Inc.
- Eric G. Webb
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PROTECTION OF SEED LAYERS DURING ELECTRODEPOSITION OF METALS IN SEM...
- Publication number 20220208604
- Publication date Jun 30, 2022
- LAM RESEARCH CORPORATION
- Huanfeng Zhu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
GAP FILL PROCESS STABILITY MONITORING OF AN ELECTROPLATING PROCESS...
- Publication number 20180080140
- Publication date Mar 22, 2018
- LAM RESEARCH CORPORATION
- Quan Ma
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MEMBRANE DESIGN FOR REDUCING DEFECTS IN ELECTROPLATING SYSTEMS
- Publication number 20150122658
- Publication date May 7, 2015
- LAM RESEARCH CORPORATION
- Doyeon Kim
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
APPARATUS AND METHOD FOR EDGE BEVEL REMOVAL OF COPPER FROM SILICON...
- Publication number 20140190529
- Publication date Jul 10, 2014
- Kousik Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROPLATING CUP ASSEMBLY
- Publication number 20110233056
- Publication date Sep 29, 2011
- Novellus Systems, Inc.
- Robert Rash
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
RAPIDLY CLEANABLE ELECTROPLATING CUP SEAL
- Publication number 20110181000
- Publication date Jul 28, 2011
- Novellus Systems, Inc.
- Shantinath Ghongadi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
APPARATUS AND METHOD FOR EDGE BEVEL REMOVAL OF COPPER FROM SILICON...
- Publication number 20100055924
- Publication date Mar 4, 2010
- Novellus Systems, Inc.
- Kousik Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Rapidly Cleanable Electroplating Cup Assembly
- Publication number 20090107835
- Publication date Apr 30, 2009
- Novellus Systems, Inc.
- Shantinath Ghongadi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Closed Contact Electroplating Cup Assembly
- Publication number 20090107836
- Publication date Apr 30, 2009
- Novellus Systems, Inc.
- Robert Rash
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electroplating using DC current interruption and variable rotation...
- Publication number 20040231996
- Publication date Nov 25, 2004
- Novellus Systems, Inc.
- Eric G. Webb
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Tariq Majid

Person

Patents Grantslast 30 patents

Gap fill process stability monitoring of an electroplating process...

Apparatus and method for edge bevel removal of copper from silicon...

Membrane design for reducing defects in electroplating systems

Apparatus and method for edge bevel removal of copper from silicon...

Rapidly cleanable electroplating cup seal

Electroplating cup assembly

Closed contact electroplating cup assembly

Rapidly cleanable electroplating cup assembly

Electroplating using DC current interruption and variable rotation...

Patents Applicationslast 30 patents

PROTECTION OF SEED LAYERS DURING ELECTRODEPOSITION OF METALS IN SEM...

GAP FILL PROCESS STABILITY MONITORING OF AN ELECTROPLATING PROCESS...

MEMBRANE DESIGN FOR REDUCING DEFECTS IN ELECTROPLATING SYSTEMS

APPARATUS AND METHOD FOR EDGE BEVEL REMOVAL OF COPPER FROM SILICON...

ELECTROPLATING CUP ASSEMBLY

RAPIDLY CLEANABLE ELECTROPLATING CUP SEAL

APPARATUS AND METHOD FOR EDGE BEVEL REMOVAL OF COPPER FROM SILICON...

Rapidly Cleanable Electroplating Cup Assembly

Closed Contact Electroplating Cup Assembly

Electroplating using DC current interruption and variable rotation...