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Taro Fukui
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Osaka, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Thermosetting resin composition, method of manufacturing the same a...
Patent number
8,697,237
Issue date
Apr 15, 2014
Panasonic Corporation
Hirohisa Hino
C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information
Patent Grant
Chip package structure and process for fabricating the same
Patent number
7,230,331
Issue date
Jun 12, 2007
Industrial Technology Research Institute
Kai-Chi Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip package structure
Patent number
7,061,103
Issue date
Jun 13, 2006
Industrial Technology Research Institute
Kai-Chi Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip package structure
Patent number
7,057,277
Issue date
Jun 6, 2006
Industrial Technology Research Institute
Kai-Chi Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Composition of cyanate ester, epoxy resin and acid anhydride
Patent number
6,469,074
Issue date
Oct 22, 2002
Matsushita Electric Works, Ltd.
Hirohisa Hino
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Grant
Seal coating mask for semiconductor element and method of use thereof
Patent number
6,224,674
Issue date
May 1, 2001
Matsushita Electric Works, Ltd.
Hirohisa Hino
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Epoxy resin sealing material for molding semiconductor chip and met...
Patent number
6,120,716
Issue date
Sep 19, 2000
Matsushita Electric Works, Ltd.
Takanori Kushida
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Grant
Thermosetting polyimide composition, thermoset product thereof and...
Patent number
5,401,812
Issue date
Mar 28, 1995
Matsushita Electric Works, Ltd.
Hiroshi Yamamoto
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Patents Applications
last 30 patents
Information
Patent Application
THERMOSETTING RESIN COMPOSITION, METHOD OF MANUFACTURING THE SAME A...
Publication number
20130237645
Publication date
Sep 12, 2013
Panasonic Corporation
Hirohisa Hino
C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information
Patent Application
Thermosetting Resin Composition, Method of Manufacturing the Same a...
Publication number
20100147567
Publication date
Jun 17, 2010
PANASONIC ELECTRIC WORKS CO., LTD.
Hirohisa Hino
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Application
PROCESS FOR FABRICATING CHIP PACKAGE STRUCTURE
Publication number
20070072339
Publication date
Mar 29, 2007
Kai-Chi Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE STRUCTURE
Publication number
20060261499
Publication date
Nov 23, 2006
Industrial Technology Research Institute
Kai-Chi Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Chip package structure and process for fabricating the same
Publication number
20050087852
Publication date
Apr 28, 2005
Kai-Chi Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
[CHIP PACKAGE STRUCTURE AND PROCESS FOR FABRICATING THE SAME]
Publication number
20040212080
Publication date
Oct 28, 2004
Kai-Chi Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
[CHIP PACKAGE STRUCTURE]
Publication number
20040212970
Publication date
Oct 28, 2004
Kai-Chi Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
[CHIP PACKAGE STRUCTURE]
Publication number
20040212056
Publication date
Oct 28, 2004
Kai-Chi Chen
H01 - BASIC ELECTRIC ELEMENTS