Tatsuhiko Aoki

Person

Niigata, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Protective-film forming method for semiconductor substrate
- Patent number 10,840,089
- Issue date Nov 17, 2020
- Globalwafers Japan Co., Ltd
- Shin Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon wafer and method for manufacturing the same
- Patent number 10,141,180
- Issue date Nov 27, 2018
- Globalwafers Japan Co., Ltd
- Koji Araki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon wafer and method for heat-treating silicon wafer
- Patent number 8,999,864
- Issue date Apr 7, 2015
- Global Wafers Japan Co., Ltd.
- Takeshi Senda
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of manufacturing single crystal silicon wafer from ingot gro...
- Patent number 8,476,149
- Issue date Jul 2, 2013
- Global Wafers Japan Co., Ltd.
- Hiromichi Isogai
- C30 - CRYSTAL GROWTH
Information Patent Grant
Method for heat treating a silicon wafer
- Patent number 8,399,341
- Issue date Mar 19, 2013
- Covalent Materials Corporation
- Takeshi Senda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of heat treating silicon wafer
- Patent number 8,252,700
- Issue date Aug 28, 2012
- Covalent Materials Corporation
- Takeshi Senda
- C30 - CRYSTAL GROWTH

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MANUFACTURING SILICON WAFER AND SILICON WAFER
- Publication number 20240304458
- Publication date Sep 12, 2024
- GLOBAL WAFERS JAPAN CO., LTD.
- Susumu MAEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON WAFER AND METHOD FOR PRODUCING SILICON WAFER
- Publication number 20230243062
- Publication date Aug 3, 2023
- GLOBALWAFERS JAPAN CO., LTD.
- Haruo SUDO
- C30 - CRYSTAL GROWTH
Information Patent Application
LAMINATION WAFERS AND METHOD OF PRODUCING BONDED WAFERS USING THE SAME
- Publication number 20220319835
- Publication date Oct 6, 2022
- GlobalWafers Japan Co., Ltd.
- Tatsuhiko AOKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR HEAT-TREATING SILICON WAFER
- Publication number 20210348302
- Publication date Nov 11, 2021
- GlobalWafers Japan Co., Ltd.
- Aya USHIODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTIVE-FILM FORMING METHOD FOR SEMICONDUCTOR SUBSTRATE
- Publication number 20200203159
- Publication date Jun 25, 2020
- GLOBALWAFERS JAPAN CO., LTD.
- Shin SAKAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A SILICON WAFER
- Publication number 20160293446
- Publication date Oct 6, 2016
- GlobalWafers Japan Co., Ltd.
- Haruo SUDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON WAFER AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20150044422
- Publication date Feb 12, 2015
- GLOBALWAFERS JAPAN CO., LTD.
- Koji ARAKI
- C30 - CRYSTAL GROWTH
Information Patent Application
METHOD FOR HEAT-TREATING SILICON WAFER
- Publication number 20130078588
- Publication date Mar 28, 2013
- Covalent Silicon Corporation
- Takeshi Senda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR HEAT TREATING A SILICON WAFER
- Publication number 20120184091
- Publication date Jul 19, 2012
- Covalent Materials Corporation
- Takeshi Senda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON WAFER AND METHOD FOR HEAT-TREATING SILICON WAFER
- Publication number 20120139088
- Publication date Jun 7, 2012
- Covalent Materials Corporation
- Takeshi Senda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of heat treating silicon wafer
- Publication number 20100197146
- Publication date Aug 5, 2010
- COVALENT MATERIALS CORPORATION
- Takeshi Senda
- C30 - CRYSTAL GROWTH
Information Patent Application
SILICON WAFER, METHOD FOR MANUFACTURING THE SAME AND METHOD FOR HEA...
- Publication number 20100038757
- Publication date Feb 18, 2010
- COVALENT MATERIALS CORPORATION
- Hiromichi Isogai
- C30 - CRYSTAL GROWTH
Information Patent Application
SURFACE CLEANING METHOD OF SEMICONDUCTOR WAFER HEAT TREATMENT BOAT
- Publication number 20080237190
- Publication date Oct 2, 2008
- Covalent Materials Corporation
- Tatsuhiko Aoki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
HEAT TREATMENT METHOD FOR SILICON WAFER
- Publication number 20080166891
- Publication date Jul 10, 2008
- COVALENT MATERIALS CORPORATION
- Manabu Hirasawa
- H01 - BASIC ELECTRIC ELEMENTS

Tatsuhiko Aoki

Person

Patents Grantslast 30 patents

Protective-film forming method for semiconductor substrate

Silicon wafer and method for manufacturing the same

Silicon wafer and method for heat-treating silicon wafer

Method of manufacturing single crystal silicon wafer from ingot gro...

Method for heat treating a silicon wafer

Method of heat treating silicon wafer

Patents Applicationslast 30 patents

METHOD FOR MANUFACTURING SILICON WAFER AND SILICON WAFER

SILICON WAFER AND METHOD FOR PRODUCING SILICON WAFER

LAMINATION WAFERS AND METHOD OF PRODUCING BONDED WAFERS USING THE SAME

METHOD FOR HEAT-TREATING SILICON WAFER

PROTECTIVE-FILM FORMING METHOD FOR SEMICONDUCTOR SUBSTRATE

METHOD FOR MANUFACTURING A SILICON WAFER

SILICON WAFER AND METHOD FOR MANUFACTURING THE SAME

METHOD FOR HEAT-TREATING SILICON WAFER

METHOD FOR HEAT TREATING A SILICON WAFER

SILICON WAFER AND METHOD FOR HEAT-TREATING SILICON WAFER

Method of heat treating silicon wafer

SILICON WAFER, METHOD FOR MANUFACTURING THE SAME AND METHOD FOR HEA...

SURFACE CLEANING METHOD OF SEMICONDUCTOR WAFER HEAT TREATMENT BOAT

HEAT TREATMENT METHOD FOR SILICON WAFER