Tatsuo Enomoto

Person

Gunma, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method for conditioning polishing pad and polishing apparatus
- Patent number 10,730,161
- Issue date Aug 4, 2020
- Shin-Etsu Handotai Co., Ltd.
- Taichi Yasuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Workpiece processing apparatus and workpiece processing method
- Patent number 10,434,621
- Issue date Oct 8, 2019
- Shin-Etsu Handotai Co., Ltd.
- Taichi Yasuda
- B24 - GRINDING POLISHING
Information Patent Grant
Wafer drying apparatus and method for drying a wafer
- Patent number 10,236,191
- Issue date Mar 19, 2019
- Shin-Etsu Handotai Co., Ltd.
- Taichi Yasuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Machining apparatus for workpiece
- Patent number 10,166,649
- Issue date Jan 1, 2019
- Shin-Etsu Handotai Co., Ltd.
- Taichi Yasuda
- B24 - GRINDING POLISHING
Information Patent Grant
Automatic handling apparatus with positioning pins
- Patent number 9,931,730
- Issue date Apr 3, 2018
- Shin-Etsu Handotai Co., Ltd.
- Taichi Yasuda
- B24 - GRINDING POLISHING
Information Patent Grant
Workpiece holding apparatus
- Patent number 9,728,442
- Issue date Aug 8, 2017
- Shin-Etsu Handotai Co., Ltd.
- Taichi Yasuda
- B24 - GRINDING POLISHING
Information Patent Grant
Manufacturing method of carrier for double-side polishing apparatus...
- Patent number 9,050,698
- Issue date Jun 9, 2015
- Shin-Etsu Handotai Co., Ltd.
- Taichi Yasuda
- B24 - GRINDING POLISHING
Information Patent Grant
Method of manufacturing SOI wafer and thus-manufactured SOI wafer
- Patent number 7,902,042
- Issue date Mar 8, 2011
- Shin-Etsu Handotai Co., Ltd.
- Hiroji Aga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer etching apparatus
- Patent number 5,211,794
- Issue date May 18, 1993
- Shin-Etsu Handotai Co., Ltd.
- Tatsuo Enomoto
- C30 - CRYSTAL GROWTH

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR CONDITIONING POLISHING PAD AND POLISHING APPARATUS
- Publication number 20180264618
- Publication date Sep 20, 2018
- Shin-Etsu Handotai Co., Ltd.
- Taichi YASUDA
- B24 - GRINDING POLISHING
Information Patent Application
MACHINING APPARATUS FOR WORKPIECE
- Publication number 20170312878
- Publication date Nov 2, 2017
- Shin-Etsu Handotai Co., Ltd.
- Taichi YASUDA
- B24 - GRINDING POLISHING
Information Patent Application
AUTOMATIC HANDLING APPARATUS
- Publication number 20170190019
- Publication date Jul 6, 2017
- Shin-Etsu Handotai Co., Ltd.
- Taichi YASUDA
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
WORKPIECE HOLDING APPARATUS
- Publication number 20170069523
- Publication date Mar 9, 2017
- Shin-Etsu Handotai Co., Ltd.
- Taichi YASUDA
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
WORKPIECE PROCESSING APPARATUS AND WORKPIECE PROCESSING METHOD
- Publication number 20160332279
- Publication date Nov 17, 2016
- Shin-Etsu Handotai Co., Ltd.
- Taichi YASUDA
- B24 - GRINDING POLISHING
Information Patent Application
WAFER DRYING APPARATUS AND METHOD FOR DRYING A WAFER
- Publication number 20160276180
- Publication date Sep 22, 2016
- Shin-Etsu Handotai Co., Ltd.
- Taichi YASUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF CARRIER FOR DOUBLE-SIDE POLISHING APPARATUS...
- Publication number 20120100788
- Publication date Apr 26, 2012
- Shin-Etsu Handotai Co., Ltd.
- Taichi Yasuda
- B24 - GRINDING POLISHING
Information Patent Application
Method Of Manufacturing Soi Wafer And Thus-Manufactured Soi Wafer
- Publication number 20080128851
- Publication date Jun 5, 2008
- Shin-Etsu Handotai Co., Ltd.
- Hiroji Aga
- H01 - BASIC ELECTRIC ELEMENTS

Tatsuo Enomoto

Person

Patents Grantslast 30 patents

Method for conditioning polishing pad and polishing apparatus

Workpiece processing apparatus and workpiece processing method

Wafer drying apparatus and method for drying a wafer

Machining apparatus for workpiece

Automatic handling apparatus with positioning pins

Workpiece holding apparatus

Manufacturing method of carrier for double-side polishing apparatus...

Method of manufacturing SOI wafer and thus-manufactured SOI wafer

Wafer etching apparatus

Patents Applicationslast 30 patents

METHOD FOR CONDITIONING POLISHING PAD AND POLISHING APPARATUS

MACHINING APPARATUS FOR WORKPIECE

AUTOMATIC HANDLING APPARATUS

WORKPIECE HOLDING APPARATUS

WORKPIECE PROCESSING APPARATUS AND WORKPIECE PROCESSING METHOD

WAFER DRYING APPARATUS AND METHOD FOR DRYING A WAFER

MANUFACTURING METHOD OF CARRIER FOR DOUBLE-SIDE POLISHING APPARATUS...

Method Of Manufacturing Soi Wafer And Thus-Manufactured Soi Wafer