Tatsuo Ohtani

Person

Fukushima, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method and apparatus for wafer chamfer polishing
- Patent number 6,234,879
- Issue date May 22, 2001
- Shin-Etsu Handotai Co., Ltd.
- Fumihiko Hasegawa
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus for polishing the notch of a wafer
- Patent number 5,733,181
- Issue date Mar 31, 1998
- Shin-Etsu Handotai Co., Ltd.
- Fumihiko Hasegawa
- B24 - GRINDING POLISHING
Information Patent Grant
Method for mirror-polishing chamfered portion of wafer and mirror-p...
- Patent number 5,727,990
- Issue date Mar 17, 1998
- Shin-Etsu Handotai Co., Ltd.
- Fumihiko Hasegawa
- B24 - GRINDING POLISHING
Information Patent Grant
Method and apparatus for wafer chamfer polishing
- Patent number 5,547,415
- Issue date Aug 20, 1996
- Shin-Etsu Handotai Co., Ltd.
- Fumihiko Hasegawa
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus for bevelling wafer-edge
- Patent number 5,538,463
- Issue date Jul 23, 1996
- Shin-Etsu Handotai Co., Ltd.
- Fumihiko Hasegawa
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus for polishing the periphery portion of a wafer
- Patent number 5,476,413
- Issue date Dec 19, 1995
- Shin-Etsu Handotai Co., Ltd.
- Fumihiko Hasegawa
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus for polishing notch portion of wafer
- Patent number 5,458,529
- Issue date Oct 17, 1995
- Shin-Etsu Handotai Co., Ltd.
- Fumihiko Hasegawa
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing apparatus for notch portion of wafer
- Patent number 5,429,544
- Issue date Jul 4, 1995
- Shin-Etsu Handotal Co., Ltd.
- Fumihiko Hasegawa
- B24 - GRINDING POLISHING
Information Patent Grant
Wafer chamfer polishing apparatus with rotary circular dividing table
- Patent number 5,404,678
- Issue date Apr 11, 1995
- Fumihiko Hasegawa
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus for polishing chamfers of a wafer
- Patent number 5,317,836
- Issue date Jun 7, 1994
- Shin-Etsu Handotai Co., Ltd.
- Fumihiko Hasegawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and an apparatus for polishing wafer chamfers
- Patent number 5,316,620
- Issue date May 31, 1994
- Shin-Etsu Handotai Co., Ltd.
- Fumihiko Hasegawa
- B24 - GRINDING POLISHING

Tatsuo Ohtani

Person

Patents Grantslast 30 patents

Method and apparatus for wafer chamfer polishing

Apparatus for polishing the notch of a wafer

Method for mirror-polishing chamfered portion of wafer and mirror-p...

Method and apparatus for wafer chamfer polishing

Apparatus for bevelling wafer-edge

Apparatus for polishing the periphery portion of a wafer

Apparatus for polishing notch portion of wafer

Polishing apparatus for notch portion of wafer

Wafer chamfer polishing apparatus with rotary circular dividing table

Apparatus for polishing chamfers of a wafer

Method and an apparatus for polishing wafer chamfers