Tatsuo Wada

Person

Kanagawa, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Circuit board, manufacturing method therefor, and bump-type contact...
- Patent number 6,350,957
- Issue date Feb 26, 2002
- Meiko Electronics, Co., Ltd.
- Noboru Shingai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board, manufacturing method therefor, and bump-type contact...
- Patent number 6,239,983
- Issue date May 29, 2001
- Meiko Electronics Co., Ltd.
- Noboru Shingai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board, manufacturing method therefor, and bump-type contact...
- Patent number 5,886,877
- Issue date Mar 23, 1999
- Meiko Electronics Co., Ltd.
- Noboru Shingai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for producing copper-clad laminate
- Patent number 5,096,522
- Issue date Mar 17, 1992
- Meiko Electronics Co., Ltd.
- Norio Kawachi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for producing a copper-clad laminate
- Patent number 5,049,221
- Issue date Sep 17, 1991
- Meiko Electronics Co., Ltd.
- Tatsuo Wada
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method of producing conductor circuit boards
- Patent number 4,889,584
- Issue date Dec 26, 1989
- Meiko Electronics Co., Ltd.
- Tatsuo Wada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing conductor circuit boards
- Patent number 4,790,902
- Issue date Dec 13, 1988
- Meiko Electronics Co., Ltd.
- Tatsuo Wada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for electroplating strip material without current leakage
- Patent number 4,323,441
- Issue date Apr 6, 1982
- Koito Seisakusho Co. Ltd.
- Glenn R. Schaer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Tatsuo Wada

Person

Patents Grantslast 30 patents

Circuit board, manufacturing method therefor, and bump-type contact...

Circuit board, manufacturing method therefor, and bump-type contact...

Circuit board, manufacturing method therefor, and bump-type contact...

Process for producing copper-clad laminate

Process for producing a copper-clad laminate

Method of producing conductor circuit boards

Method of producing conductor circuit boards

Apparatus for electroplating strip material without current leakage