Tatsuya Funaki

Person

Omihachiman-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Composite component and method for manufacturing the same
- Patent number 12,002,760
- Issue date Jun 4, 2024
- Murata Manufacturing Co., Ltd.
- Tatsuya Funaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrode-equipped passive component and collective body of electro...
- Patent number 11,646,155
- Issue date May 9, 2023
- Murata Manufacturing Co., Ltd.
- Takehito Ishihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor composite device and package board used therein
- Patent number 11,552,020
- Issue date Jan 10, 2023
- Murata Manufacturing Co., Ltd.
- Koshi Himeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor
- Patent number 11,348,726
- Issue date May 31, 2022
- Murata Manufacturing Co., Ltd.
- Takehito Ishihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor composite device and package board used therein
- Patent number 11,121,123
- Issue date Sep 14, 2021
- Murata Manufacturing Co., Ltd.
- Koshi Himeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level package and capacitor
- Patent number 10,727,295
- Issue date Jul 28, 2020
- MURATA MANUFACTURING CO., LTD.
- Tatsuya Funaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic element that includes multilayered bonding interface bet...
- Patent number 7,960,834
- Issue date Jun 14, 2011
- Murata Manufacturing Co., Ltd.
- Tatsuya Funaki
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Connection method and connection structure of pad electrodes, and i...
- Patent number 6,768,062
- Issue date Jul 27, 2004
- Murata Manufacturing Co., Ltd.
- Ryoichi Morimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
COMPOSITE ELECTRONIC COMPONENT
- Publication number 20240234389
- Publication date Jul 11, 2024
- Murata Manufacturing Co., Ltd.
- Yukihiro FUJITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT MOUNTING APPARATUS, COMPONENT MOUNTING METHOD, AND COMPON...
- Publication number 20240155821
- Publication date May 9, 2024
- Murata Manufacturing Co., Ltd.
- Yoshiaki SATAKE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITE COMPONENT
- Publication number 20240136268
- Publication date Apr 25, 2024
- Murata Manufacturing Co., Ltd.
- Yoshiaki SATAKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE ELECTRONIC COMPONENT
- Publication number 20240136342
- Publication date Apr 25, 2024
- Murata Manufacturing Co., Ltd.
- Yukihiro FUJITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE COMPONENT AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230352388
- Publication date Nov 2, 2023
- Murata Manufacturing Co., Ltd.
- Yoshiaki SATAKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE COMPONENT AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220020692
- Publication date Jan 20, 2022
- Murata Manufacturing Co., Ltd.
- Tatsuya Funaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE-MOUNT PASSIVE COMPONENT
- Publication number 20210398730
- Publication date Dec 23, 2021
- Murata Manufacturing Co., Ltd.
- Yoshimasa YOSHIOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COMPOSITE DEVICE AND PACKAGE BOARD USED THEREIN
- Publication number 20210375841
- Publication date Dec 2, 2021
- Murata Manufacturing Co., Ltd.
- Koshi Himeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRODE-EQUIPPED PASSIVE COMPONENT AND COLLECTIVE BODY OF ELECTRO...
- Publication number 20210304963
- Publication date Sep 30, 2021
- Murata Manufacturing Co., Ltd.
- Takehito ISHIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COMPOSITE DEVICE AND PACKAGE BOARD USED THEREIN
- Publication number 20200321323
- Publication date Oct 8, 2020
- Murata Manufacturing Co., Ltd.
- Koshi Himeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR
- Publication number 20190355516
- Publication date Nov 21, 2019
- Murata Manufacturing Co., Ltd.
- Takehito Ishihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGE AND CAPACITOR
- Publication number 20190074347
- Publication date Mar 7, 2019
- Murata Manufacturing Co., Ltd.
- TATSUYA FUNAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING CAPACITOR BUILT-IN SUBSTRATE
- Publication number 20180132356
- Publication date May 10, 2018
- Murata Manufacturing Co., Ltd.
- TATSUYA FUNAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Element, Electronic Element Device Using the Same, and M...
- Publication number 20090039507
- Publication date Feb 12, 2009
- Murata Manufacturing Co., Ltd.
- Tatsuya Funaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Connection method and connection structure of pad electrodes, and i...
- Publication number 20020043396
- Publication date Apr 18, 2002
- Ryoichi Morimoto
- H01 - BASIC ELECTRIC ELEMENTS

Tatsuya Funaki

Person

Patents Grantslast 30 patents

Composite component and method for manufacturing the same

Electrode-equipped passive component and collective body of electro...

Semiconductor composite device and package board used therein

Capacitor

Semiconductor composite device and package board used therein

Wafer level package and capacitor

Electronic element that includes multilayered bonding interface bet...

Connection method and connection structure of pad electrodes, and i...

Patents Applicationslast 30 patents

COMPOSITE ELECTRONIC COMPONENT

COMPONENT MOUNTING APPARATUS, COMPONENT MOUNTING METHOD, AND COMPON...

COMPOSITE COMPONENT

COMPOSITE ELECTRONIC COMPONENT

COMPOSITE COMPONENT AND METHOD FOR MANUFACTURING THE SAME

COMPOSITE COMPONENT AND METHOD FOR MANUFACTURING THE SAME

SURFACE-MOUNT PASSIVE COMPONENT

SEMICONDUCTOR COMPOSITE DEVICE AND PACKAGE BOARD USED THEREIN

ELECTRODE-EQUIPPED PASSIVE COMPONENT AND COLLECTIVE BODY OF ELECTRO...

SEMICONDUCTOR COMPOSITE DEVICE AND PACKAGE BOARD USED THEREIN

CAPACITOR

WAFER LEVEL PACKAGE AND CAPACITOR

METHOD FOR MANUFACTURING CAPACITOR BUILT-IN SUBSTRATE

Electronic Element, Electronic Element Device Using the Same, and M...

Connection method and connection structure of pad electrodes, and i...