Tatsuya Harada

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Learning method, learning program, learning device, and learning sy...
- Patent number 11,488,060
- Issue date Nov 1, 2022
- The University of Tokyo
- Tatsuya Harada
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Authentication system and method
- Patent number 10,402,548
- Issue date Sep 3, 2019
- The University of Tokyo
- Rie Yamaguchi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Through wiring substrate
- Patent number 9,930,779
- Issue date Mar 27, 2018
- TDK Corporation
- Kenichi Yoshida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing layered chip package
- Patent number 8,513,034
- Issue date Aug 20, 2013
- Headway Technologies, Inc.
- Yoshitaka Sasaki
- G11 - INFORMATION STORAGE
Information Patent Grant
Layered chip package and method of manufacturing same
- Patent number 8,455,349
- Issue date Jun 4, 2013
- Headway Technologies, Inc.
- Yoshitaka Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Correspondence learning apparatus and method and correspondence lea...
- Patent number 8,423,485
- Issue date Apr 16, 2013
- The University of Tokyo
- Tatsuya Harada
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Magnetic head including a pole layer and an antireflection film san...
- Patent number 8,325,440
- Issue date Dec 4, 2012
- TDK Corporation
- Tatsuya Harada
- G11 - INFORMATION STORAGE
Information Patent Grant
Layered chip package with wiring on the side surfaces
- Patent number 8,324,741
- Issue date Dec 4, 2012
- Headway Technologies, Inc.
- Yoshitaka Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming magnetic layer pattern, and method of manufacturi...
- Patent number 8,201,321
- Issue date Jun 19, 2012
- TDK Corporation
- Naoto Matono
- G11 - INFORMATION STORAGE
Information Patent Grant
Layered chip package with heat sink
- Patent number 8,154,116
- Issue date Apr 10, 2012
- HeadwayTechnologies, Inc.
- Yoshitaka Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Layered chip package
- Patent number 8,134,229
- Issue date Mar 13, 2012
- Headway Technologies, Inc.
- Yoshitaka Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic head for perpendicular magnetic recording and method of ma...
- Patent number 7,995,308
- Issue date Aug 9, 2011
- TDK Corporation
- Koichi Otani
- G11 - INFORMATION STORAGE
Information Patent Grant
Layered chip package with wiring on the side surfaces
- Patent number 7,968,374
- Issue date Jun 28, 2011
- Headway Technologies, Inc.
- Yoshitaka Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Layered chip package and method of manufacturing same
- Patent number 7,964,976
- Issue date Jun 21, 2011
- Headway Technologies, Inc.
- Yoshitaka Sasaki
- G11 - INFORMATION STORAGE
Information Patent Grant
Magnetic head for perpendicular magnetic recording with a shield an...
- Patent number 7,948,716
- Issue date May 24, 2011
- Sae Magnetics (H.K.) Ltd.
- Naoto Matono
- G11 - INFORMATION STORAGE
Information Patent Grant
Magnetic device, perpendicular magnetic recording head, magnetic re...
- Patent number 7,885,036
- Issue date Feb 8, 2011
- TDK Corporation
- Naoto Matono
- G11 - INFORMATION STORAGE
Information Patent Grant
Thin film magnetic head integrated structure
- Patent number 7,874,063
- Issue date Jan 25, 2011
- TDK Corporation
- Naoto Matono
- G11 - INFORMATION STORAGE
Information Patent Grant
Layered chip package and method of manufacturing same
- Patent number 7,868,442
- Issue date Jan 11, 2011
- Headway Technologies, Inc.
- Yoshitaka Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing layered chip package
- Patent number 7,863,095
- Issue date Jan 4, 2011
- Headway Technologies, Inc.
- Yoshitaka Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Layered chip package and method of manufacturing same
- Patent number 7,846,772
- Issue date Dec 7, 2010
- Headway Technologies, Inc.
- Yoshitaka Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin-film magnetic head including two magnetic layers and flat spir...
- Patent number 7,826,175
- Issue date Nov 2, 2010
- TDK Corporation
- Kenji Yokoyama
- G11 - INFORMATION STORAGE
Information Patent Grant
Method of manufacturing layered chip package
- Patent number 7,767,494
- Issue date Aug 3, 2010
- Headway Technologies, Inc.
- Yoshitaka Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Layered chip package and method of manufacturing same
- Patent number 7,745,259
- Issue date Jun 29, 2010
- Headway Technologies, Inc.
- Yoshitaka Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Layered chip package that implements memory device
- Patent number 7,557,439
- Issue date Jul 7, 2009
- TDK Corporation
- Yoshitaka Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin-film magnetic head for perpendicular magnetic recording and ma...
- Patent number 7,443,633
- Issue date Oct 28, 2008
- TDK Corporation
- Katsumichi Tagami
- G11 - INFORMATION STORAGE
Information Patent Grant
Method of manufacturing a thin film magnetic recording head
- Patent number 7,293,345
- Issue date Nov 13, 2007
- TDK Corporation
- Naoto Matono
- G11 - INFORMATION STORAGE
Information Patent Grant
Apparatus for manufacturing sliders
- Patent number 6,757,964
- Issue date Jul 6, 2004
- TDK Corporation
- Yoshitaka Sasaki
- G11 - INFORMATION STORAGE
Information Patent Grant
Method and apparatus for manufacturing slider
- Patent number 6,374,479
- Issue date Apr 23, 2002
- TDK Corporation
- Yoshitaka Sasaki
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
INFORMATION PROCESSING DEVICE, MOBILE BODY, AND LEARNING DEVICE
- Publication number 20210201533
- Publication date Jul 1, 2021
- OLYMPUS CORPORATION
- Atsuro Okazawa
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Learning Method, Learning Program, Learning Device, and Learning Sy...
- Publication number 20200210893
- Publication date Jul 2, 2020
- THE UNIVERSITY OF TOKYO
- Tatsuya HARADA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
THROUGH WIRING SUBSTRATE
- Publication number 20170318675
- Publication date Nov 2, 2017
- TDK Corporation
- Kenichi YOSHIDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
AUTHENTICATION SYSTEM AND METHOD
- Publication number 20170286648
- Publication date Oct 5, 2017
- The University of Tokyo
- Rie YAMAGUCHI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
LAYERED CHIP PACKAGE AND METHOD OF MANUFACTURING SAME
- Publication number 20110266692
- Publication date Nov 3, 2011
- HEADWAY TECHNOLOGIES, INC.
- Yoshitaka SASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Layered chip package with wiring on the side surfaces
- Publication number 20110221073
- Publication date Sep 15, 2011
- HEADWAY TECHNOLOGIES, INC.
- Yoshitaka Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing layered chip package
- Publication number 20110201137
- Publication date Aug 18, 2011
- HEADWAY TECHNOLOGIES, INC.
- Yoshitaka Sasaki
- G11 - INFORMATION STORAGE
Information Patent Application
Magnetic device, perpendicular magnetic recording head, magnetic re...
- Publication number 20110086182
- Publication date Apr 14, 2011
- TDK Corporation
- Naoto Matono
- G11 - INFORMATION STORAGE
Information Patent Application
CORRESPONDENCE LEARNING APPARATUS AND METHOD AND CORRESPONDENCE LEA...
- Publication number 20110010319
- Publication date Jan 13, 2011
- THE UNIVERSITY OF TOKYO
- Tatsuya Harada
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Layered chip package
- Publication number 20100327464
- Publication date Dec 30, 2010
- HEADWAY TECHNOLOGIES, INC.
- Yoshitaka Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing layered chip package
- Publication number 20100304531
- Publication date Dec 2, 2010
- HEADWAY TECHNOLOGIES, INC.
- Yoshitaka Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Layered chip package and method of manufacturing same
- Publication number 20100200977
- Publication date Aug 12, 2010
- HEADWAY TECHNOLOGIES, INC.
- Yoshitaka Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Layered chip package with heat sink
- Publication number 20100109137
- Publication date May 6, 2010
- HEADWAY TECHNOLOGIES, INC.
- Yoshitaka Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Layered chip package and method of manufacturing same
- Publication number 20100044879
- Publication date Feb 25, 2010
- HEADWAY TECHNOLOGIES, INC.
- Yoshitaka Sasaki
- G11 - INFORMATION STORAGE
Information Patent Application
Method of manufacturing layered chip package
- Publication number 20090325345
- Publication date Dec 31, 2009
- HEADWAY TECHNOLOGIES, INC.
- Yoshitaka Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Layered chip package and method of manufacturing same
- Publication number 20090321956
- Publication date Dec 31, 2009
- TDK Corporation
- Yoshitaka Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Layered chip package and method of manufacturing same
- Publication number 20090321957
- Publication date Dec 31, 2009
- HEADWAY TECHNOLOGIES, INC.
- Yoshitaka Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Layered chip package and method of manufacturing same
- Publication number 20090315189
- Publication date Dec 24, 2009
- HEADWAY TECHNOLOGIES, INC.
- Yoshitaka Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Magnetic head for perpendicular magnetic recording with a shield an...
- Publication number 20080297953
- Publication date Dec 4, 2008
- SAE MAGNETICS (H.K.) LTD.
- Naoto Matono
- G11 - INFORMATION STORAGE
Information Patent Application
Thin-film magnetic head including two magnetic layers and flat spir...
- Publication number 20080273273
- Publication date Nov 6, 2008
- TDK Corporation
- Kenji Yokoyama
- G11 - INFORMATION STORAGE
Information Patent Application
Magnetic head for perpendicular magnetic recording and method of ma...
- Publication number 20080247087
- Publication date Oct 9, 2008
- TDK Corporation
- Koichi Otani
- G11 - INFORMATION STORAGE
Information Patent Application
Magnetic head for perpendicular magnetic recording and method of ma...
- Publication number 20080239580
- Publication date Oct 2, 2008
- TDK Corporation
- Tatsuya Harada
- G11 - INFORMATION STORAGE
Information Patent Application
Magnetic device, perpendicular magnetic recording head, magnetic re...
- Publication number 20070195457
- Publication date Aug 23, 2007
- TDK Corporation
- Naoto Matono
- G11 - INFORMATION STORAGE
Information Patent Application
Thin film magnetic head integrated structure, method of manufacturi...
- Publication number 20070044297
- Publication date Mar 1, 2007
- TDK Corporation
- Naoto Matono
- G11 - INFORMATION STORAGE
Information Patent Application
Thin-film magnetic head for perpendicular magnetic recording and ma...
- Publication number 20060132972
- Publication date Jun 22, 2006
- TDK Corporation
- Katsumichi Tagami
- G11 - INFORMATION STORAGE
Information Patent Application
Thin film magnetic head, method of manufacturing the same, and magn...
- Publication number 20050117251
- Publication date Jun 2, 2005
- TDK Corporation
- Naoto Matono
- G11 - INFORMATION STORAGE
Information Patent Application
Method and apparatus for manufacturing slider
- Publication number 20020053137
- Publication date May 9, 2002
- TDK Corporation
- Yoshitaka Sasaki
- G11 - INFORMATION STORAGE

Tatsuya Harada

Person

Patents Grantslast 30 patents

Learning method, learning program, learning device, and learning sy...

Authentication system and method

Through wiring substrate

Method of manufacturing layered chip package

Layered chip package and method of manufacturing same

Correspondence learning apparatus and method and correspondence lea...

Magnetic head including a pole layer and an antireflection film san...

Layered chip package with wiring on the side surfaces

Method of forming magnetic layer pattern, and method of manufacturi...

Layered chip package with heat sink

Layered chip package

Magnetic head for perpendicular magnetic recording and method of ma...

Layered chip package with wiring on the side surfaces

Layered chip package and method of manufacturing same

Magnetic head for perpendicular magnetic recording with a shield an...

Magnetic device, perpendicular magnetic recording head, magnetic re...

Thin film magnetic head integrated structure

Layered chip package and method of manufacturing same

Method of manufacturing layered chip package

Layered chip package and method of manufacturing same

Thin-film magnetic head including two magnetic layers and flat spir...

Method of manufacturing layered chip package

Layered chip package and method of manufacturing same

Layered chip package that implements memory device

Thin-film magnetic head for perpendicular magnetic recording and ma...

Method of manufacturing a thin film magnetic recording head

Apparatus for manufacturing sliders

Method and apparatus for manufacturing slider

Patents Applicationslast 30 patents

INFORMATION PROCESSING DEVICE, MOBILE BODY, AND LEARNING DEVICE

Learning Method, Learning Program, Learning Device, and Learning Sy...

THROUGH WIRING SUBSTRATE

AUTHENTICATION SYSTEM AND METHOD

LAYERED CHIP PACKAGE AND METHOD OF MANUFACTURING SAME

Layered chip package with wiring on the side surfaces

Method of manufacturing layered chip package

Magnetic device, perpendicular magnetic recording head, magnetic re...

CORRESPONDENCE LEARNING APPARATUS AND METHOD AND CORRESPONDENCE LEA...

Layered chip package

Method of manufacturing layered chip package

Layered chip package and method of manufacturing same

Layered chip package with heat sink

Layered chip package and method of manufacturing same

Method of manufacturing layered chip package

Layered chip package and method of manufacturing same

Layered chip package and method of manufacturing same

Layered chip package and method of manufacturing same

Magnetic head for perpendicular magnetic recording with a shield an...

Thin-film magnetic head including two magnetic layers and flat spir...

Magnetic head for perpendicular magnetic recording and method of ma...

Magnetic head for perpendicular magnetic recording and method of ma...

Magnetic device, perpendicular magnetic recording head, magnetic re...

Thin film magnetic head integrated structure, method of manufacturi...

Thin-film magnetic head for perpendicular magnetic recording and ma...

Thin film magnetic head, method of manufacturing the same, and magn...

Method and apparatus for manufacturing slider