Tatsuya Hinoue

Person

Odawara, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Three dimensional memory device and method of making thereof by for...
- Patent number 12,101,936
- Issue date Sep 24, 2024
- SanDisk Technologies LLC
- Tatsuya Hinoue
Information Patent Grant
Three-dimensional memory device and method of making thereof using...
- Patent number 12,046,285
- Issue date Jul 23, 2024
- SanDisk Technologies LLC
- Naoki Takeguchi
- G11 - INFORMATION STORAGE
Information Patent Grant
Three-dimensional memory device with discrete charge storage elemen...
- Patent number 12,029,037
- Issue date Jul 2, 2024
- SanDisk Technologies LLC
- Masanori Tsutsumi
- G11 - INFORMATION STORAGE
Information Patent Grant
Three-dimensional memory device with replacement select gate electr...
- Patent number 11,968,827
- Issue date Apr 23, 2024
- SanDisk Technologies LLC
- Tatsuya Hinoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device and method of making thereof using...
- Patent number 11,942,429
- Issue date Mar 26, 2024
- SanDisk Technologies LLC
- Tatsuya Hinoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device including laterally-undulating memo...
- Patent number 11,877,452
- Issue date Jan 16, 2024
- SanDisk Technologies LLC
- Tatsuya Hinoue
Information Patent Grant
Three-dimensional memory device with backside support pillar struct...
- Patent number 11,844,222
- Issue date Dec 12, 2023
- SanDisk Technologies LLC
- Shunsuke Takuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device containing bridges for enhanced str...
- Patent number 11,532,570
- Issue date Dec 20, 2022
- SanDisk Technologies LLC
- Genta Mizuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device including laterally-undulating memo...
- Patent number 11,515,326
- Issue date Nov 29, 2022
- SanDisk Technologies LLC
- Zhixin Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spacerless source contact layer replacement process and three-dimen...
- Patent number 11,444,101
- Issue date Sep 13, 2022
- SanDisk Technologies LLC
- Jo Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device containing auxiliary support pillar...
- Patent number 11,398,497
- Issue date Jul 26, 2022
- SanDisk Technologies LLC
- Kengo Kajiwara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spacerless source contact layer replacement process and three-dimen...
- Patent number 11,342,347
- Issue date May 24, 2022
- SanDisk Technologies LLC
- Tatsuya Hinoue
- G11 - INFORMATION STORAGE
Information Patent Grant
Three-dimensional memory device containing compositionally graded w...
- Patent number 11,217,532
- Issue date Jan 4, 2022
- SanDisk Technologies LLC
- Rahul Sharangpani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device containing tubular blocking dielect...
- Patent number 11,049,807
- Issue date Jun 29, 2021
- SanDisk Technologies LLC
- Li Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for etching bottom punch-through opening in a memory film of...
- Patent number 11,018,152
- Issue date May 25, 2021
- SanDisk Technologies LLC
- Tatsuya Hinoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device including split memory cells and me...
- Patent number 10,950,627
- Issue date Mar 16, 2021
- SanDisk Technologies LLC
- Tatsuya Hinoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device having a slimmed aluminum oxide blo...
- Patent number 10,861,869
- Issue date Dec 8, 2020
- SanDisk Technologies LLC
- Ryo Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device containing compositionally graded w...
- Patent number 10,615,123
- Issue date Apr 7, 2020
- SanDisk Technologies LLC
- Tatsuya Hinoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device containing fluorine-free tungsten—w...
- Patent number 10,229,931
- Issue date Mar 12, 2019
- SanDisk Technologies LLC
- Tatsuya Hinoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor integrated circuit device
- Patent number 7,067,889
- Issue date Jun 27, 2006
- Renesas Technology Corp.
- Tatsuya Hinoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor integrated circuit device
- Patent number 6,734,114
- Issue date May 11, 2004
- Renesas Technology, Corp.
- Tatsuya Hinoue
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING COMPOSITE WORD LINES INC...
- Publication number 20240306386
- Publication date Sep 12, 2024
- SANDISK TECHNOLOGIES LLC
- Yusuke MUKAE
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING SILICON OXYCARBIDE LINER...
- Publication number 20240260266
- Publication date Aug 1, 2024
- SANDISK TECHNOLOGIES LLC
- Naohiro HOSODA
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH SELF-ALIGNED MEMORY BLOCK ISOL...
- Publication number 20240213147
- Publication date Jun 27, 2024
- SANDISK TECHNOLOGIES LLC
- Naohiro HOSODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE AND METHOD OF MAKING THEREOF USING...
- Publication number 20240098992
- Publication date Mar 21, 2024
- SANDISK TECHNOLOGIES LLC
- Tatsuya HINOUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH BACKSIDE SUPPORT PILLAR STRUCT...
- Publication number 20240099014
- Publication date Mar 21, 2024
- SANDISK TECHNOLOGIES LLC
- Shunsuke TAKUMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ASPECT RATIO VIA FILL PROCESS EMPLOYING SELECTIVE METAL DEPOSI...
- Publication number 20230130849
- Publication date Apr 27, 2023
- SANDISK TECHNOLOGIES LLC
- Takashi YAMAHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH DISCRETE CHARGE STORAGE ELEMEN...
- Publication number 20230128441
- Publication date Apr 27, 2023
- SANDISK TECHNOLOGIES LLC
- Masanori TSUTSUMI
- G11 - INFORMATION STORAGE
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH REPLACEMENT SELECT GATE ELECTR...
- Publication number 20230069170
- Publication date Mar 2, 2023
- SANDISK TECHNOLOGIES LLC
- Tatsuya HINOUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE AND METHOD OF MAKING THEREOF USING...
- Publication number 20220406720
- Publication date Dec 22, 2022
- SANDISK TECHNOLOGIES LLC
- Tatsuya HINOUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE AND METHOD OF MAKING THEREOF USING...
- Publication number 20220406793
- Publication date Dec 22, 2022
- SANDISK TECHNOLOGIES LLC
- Naoki TAKEGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE AND METHOD OF MAKING THEREOF USING...
- Publication number 20220406794
- Publication date Dec 22, 2022
- SANDISK TECHNOLOGIES LLC
- Tatsuya HINOUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE AND METHOD OF MAKING THEREOF USING...
- Publication number 20220406379
- Publication date Dec 22, 2022
- SANDISK TECHNOLOGIES LLC
- Naoki TAKEGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL MEMORY DEVICE AND METHOD OF MAKING THEREOF BY FOR...
- Publication number 20220352201
- Publication date Nov 3, 2022
- SANDISK TECHNOLOGIES LLC
- Tatsuya HINOUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL MEMORY DEVICE AND METHOD OF MAKING THEREOF BY FOR...
- Publication number 20220352200
- Publication date Nov 3, 2022
- SANDISK TECHNOLOGIES LLC
- Michiaki SANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL MEMORY DEVICE AND METHOD OF MAKING THEREOF BY FOR...
- Publication number 20220352199
- Publication date Nov 3, 2022
- SANDISK TECHNOLOGIES LLC
- Yusuke MUKAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING LATERALLY-UNDULATING MEMO...
- Publication number 20220285387
- Publication date Sep 8, 2022
- SANDISK TECHNOLOGIES LLC
- Tatsuya HINOUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING LATERALLY-UNDULATING MEMO...
- Publication number 20220285388
- Publication date Sep 8, 2022
- SANDISK TECHNOLOGIES LLC
- Zhixin CUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING BRIDGES FOR ENHANCED STR...
- Publication number 20220254733
- Publication date Aug 11, 2022
- SANDISK TECHNOLOGIES LLC
- Genta MIZUNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH BACKSIDE SUPPORT PILLAR STRUCT...
- Publication number 20220223614
- Publication date Jul 14, 2022
- SANDISK TECHNOLOGIES LLC
- Shunsuke TAKUMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPACERLESS SOURCE CONTACT LAYER REPLACEMENT PROCESS AND THREE-DIMEN...
- Publication number 20210408025
- Publication date Dec 30, 2021
- SANDISK TECHNOLOGIES LLC
- Tatsuya HINOUE
- G11 - INFORMATION STORAGE
Information Patent Application
SPACERLESS SOURCE CONTACT LAYER REPLACEMENT PROCESS AND THREE-DIMEN...
- Publication number 20210408035
- Publication date Dec 30, 2021
- SANDISK TECHNOLOGIES LLC
- Jo SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING AUXILLIARY SUPPORT PILLA...
- Publication number 20210358941
- Publication date Nov 18, 2021
- SANDISK TECHNOLOGIES LLC
- Kengo KAJIWARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING TUBULAR BLOCKING DIELECT...
- Publication number 20210090992
- Publication date Mar 25, 2021
- SANDISK TECHNOLOGIES LLC
- Li LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ETCHING BOTTOM PUNCH-THROUGH OPENING IN A MEMORY FILM OF...
- Publication number 20210005627
- Publication date Jan 7, 2021
- SANDISK TECHNOLOGIES LLC
- Tatsuya HINOUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE HAVING A SLIMMED ALUMINUM OXIDE BLO...
- Publication number 20200020715
- Publication date Jan 16, 2020
- SANDISK TECHNOLOGIES LLC
- Ryo NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING COMPOSITIONALLY GRADED W...
- Publication number 20190287916
- Publication date Sep 19, 2019
- SANDISK TECHNOLOGIES LLC
- Rahul SHARANGPANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING COMPOSITIONALLY GRADED W...
- Publication number 20190287982
- Publication date Sep 19, 2019
- SANDISK TECHNOLOGIES LLC
- Tatsuya HINOUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing a semiconductor integrated circuit device
- Publication number 20030224575
- Publication date Dec 4, 2003
- Tatsuya Hinoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing semiconductor integrated circuit device
- Publication number 20030141557
- Publication date Jul 31, 2003
- Tatsuya Hinoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing semiconductor integrated circuit device
- Publication number 20030092285
- Publication date May 15, 2003
- Tatsuya Hinoue
- H01 - BASIC ELECTRIC ELEMENTS

Tatsuya Hinoue

Person

Patents Grantslast 30 patents

Three dimensional memory device and method of making thereof by for...

Three-dimensional memory device and method of making thereof using...

Three-dimensional memory device with discrete charge storage elemen...

Three-dimensional memory device with replacement select gate electr...

Three-dimensional memory device and method of making thereof using...

Three-dimensional memory device including laterally-undulating memo...

Three-dimensional memory device with backside support pillar struct...

Three-dimensional memory device containing bridges for enhanced str...

Three-dimensional memory device including laterally-undulating memo...

Spacerless source contact layer replacement process and three-dimen...

Three-dimensional memory device containing auxiliary support pillar...

Spacerless source contact layer replacement process and three-dimen...

Three-dimensional memory device containing compositionally graded w...

Three-dimensional memory device containing tubular blocking dielect...

Method for etching bottom punch-through opening in a memory film of...

Three-dimensional memory device including split memory cells and me...

Three-dimensional memory device having a slimmed aluminum oxide blo...

Three-dimensional memory device containing compositionally graded w...

Three-dimensional memory device containing fluorine-free tungsten—w...

Method for manufacturing semiconductor integrated circuit device

Method for manufacturing semiconductor integrated circuit device

Patents Applicationslast 30 patents

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING COMPOSITE WORD LINES INC...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING SILICON OXYCARBIDE LINER...

THREE-DIMENSIONAL MEMORY DEVICE WITH SELF-ALIGNED MEMORY BLOCK ISOL...

THREE-DIMENSIONAL MEMORY DEVICE AND METHOD OF MAKING THEREOF USING...

THREE-DIMENSIONAL MEMORY DEVICE WITH BACKSIDE SUPPORT PILLAR STRUCT...

HIGH ASPECT RATIO VIA FILL PROCESS EMPLOYING SELECTIVE METAL DEPOSI...

THREE-DIMENSIONAL MEMORY DEVICE WITH DISCRETE CHARGE STORAGE ELEMEN...

THREE-DIMENSIONAL MEMORY DEVICE WITH REPLACEMENT SELECT GATE ELECTR...

THREE-DIMENSIONAL MEMORY DEVICE AND METHOD OF MAKING THEREOF USING...

THREE-DIMENSIONAL MEMORY DEVICE AND METHOD OF MAKING THEREOF USING...

THREE-DIMENSIONAL MEMORY DEVICE AND METHOD OF MAKING THEREOF USING...

THREE-DIMENSIONAL MEMORY DEVICE AND METHOD OF MAKING THEREOF USING...

THREE DIMENSIONAL MEMORY DEVICE AND METHOD OF MAKING THEREOF BY FOR...

THREE DIMENSIONAL MEMORY DEVICE AND METHOD OF MAKING THEREOF BY FOR...

THREE DIMENSIONAL MEMORY DEVICE AND METHOD OF MAKING THEREOF BY FOR...

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING LATERALLY-UNDULATING MEMO...

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING LATERALLY-UNDULATING MEMO...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING BRIDGES FOR ENHANCED STR...

THREE-DIMENSIONAL MEMORY DEVICE WITH BACKSIDE SUPPORT PILLAR STRUCT...

SPACERLESS SOURCE CONTACT LAYER REPLACEMENT PROCESS AND THREE-DIMEN...

SPACERLESS SOURCE CONTACT LAYER REPLACEMENT PROCESS AND THREE-DIMEN...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING AUXILLIARY SUPPORT PILLA...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING TUBULAR BLOCKING DIELECT...

METHOD FOR ETCHING BOTTOM PUNCH-THROUGH OPENING IN A MEMORY FILM OF...

THREE-DIMENSIONAL MEMORY DEVICE HAVING A SLIMMED ALUMINUM OXIDE BLO...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING COMPOSITIONALLY GRADED W...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING COMPOSITIONALLY GRADED W...

Method of manufacturing a semiconductor integrated circuit device

Method for manufacturing semiconductor integrated circuit device

Method for manufacturing semiconductor integrated circuit device