Tatyana N. Andryushchenko

Person

Beaverton, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Stretchable electronics fabrication method with strain redistributi...
- Patent number 10,468,357
- Issue date Nov 5, 2019
- Intel Corporation
- Rajendra C. Dias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bendable and stretchable electronic devices and methods
- Patent number 10,204,855
- Issue date Feb 12, 2019
- Intel Corporation
- Alejandro Levander
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Gradient encapsulant protection of devices in stretchable electronics
- Patent number 10,206,277
- Issue date Feb 12, 2019
- Intel Corporation
- Rajendra C. Dias
- A41 - WEARING APPAREL
Information Patent Grant
Debond interconnect structures
- Patent number 9,461,010
- Issue date Oct 4, 2016
- Intel Corporation
- Qing Ma
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Scalable interconnect structures with selective via posts
- Patent number 9,391,019
- Issue date Jul 12, 2016
- Intel Corporation
- Mauro Kobrinsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Debond interconnect structures
- Patent number 8,637,778
- Issue date Jan 28, 2014
- Intel Corporation
- Qing Ma
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming planarizing copper in a low-k dielectric
- Patent number 7,585,760
- Issue date Sep 8, 2009
- Intel Corporation
- Tatyana N. Andryushchenko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical dissolution of barrier and adhesion layers
- Patent number 7,560,380
- Issue date Jul 14, 2009
- Intel Corporation
- Tatyana N. Andryushchenko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Damascene fabrication with electrochemical layer removal
- Patent number 7,223,685
- Issue date May 29, 2007
- Intel Corporation
- Tatyana N. Andryushchenko
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of fabricating damascene structures in mechanically weak int...
- Patent number 6,790,336
- Issue date Sep 14, 2004
- Intel Corporation
- Tatyana Andryushchenko
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STRETCHABLE ELECTRONICS FABRICATION METHOD WITH STRAIN REDISTRIBUTI...
- Publication number 20180019213
- Publication date Jan 18, 2018
- Intel Corporation
- Rajendra C. DIAS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRADIENT ENCAPSULANT PROTECTION OF DEVICES IN STRETCHABLE ELECTRONICS
- Publication number 20170181275
- Publication date Jun 22, 2017
- Intel Corporation
- Rajendra C. Dias
- A41 - WEARING APPAREL
Information Patent Application
BENDABLE AND STRETCHABLE ELECTRONIC DEVICES AND METHODS
- Publication number 20160284630
- Publication date Sep 29, 2016
- Intel Corporation
- Alejandro Levander
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEBOND INTERCONNECT STRUCTURES
- Publication number 20160133596
- Publication date May 12, 2016
- Intel Corporation
- Qing Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEBOND INTERCONNECT STRUCTURES
- Publication number 20110247872
- Publication date Oct 13, 2011
- Qing Ma
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Ultrasonic electropolishing of conductive material
- Publication number 20080213995
- Publication date Sep 4, 2008
- Tatyana N. Andryushchenko
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Chemical dissolution of barrier and adhesion layers
- Publication number 20080102631
- Publication date May 1, 2008
- Tatyana N. Andryushchenko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming planarizing copper in a low-k dielectric
- Publication number 20070298605
- Publication date Dec 27, 2007
- Tatyana N. Andryushchenko
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method for copper damascence fill for forming an interconnect
- Publication number 20070298607
- Publication date Dec 27, 2007
- Tatyana N. Andryushchenko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Novel chemical composition to reduce defects
- Publication number 20070228011
- Publication date Oct 4, 2007
- Mark F. Buehler
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Application
Reducing aluminum dissolution in high pH solutions
- Publication number 20070152252
- Publication date Jul 5, 2007
- Mark F. Buehler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Damascene fabrication with electrochemical layer removal
- Publication number 20050003637
- Publication date Jan 6, 2005
- Tatyana N. Andryushchenko
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Damascene fabrication with electrochemical layer removal
- Publication number 20040256224
- Publication date Dec 23, 2004
- Tatyana N. Andryushchenko
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method of fabricating damascene structures in mechanically weak int...
- Publication number 20030234182
- Publication date Dec 25, 2003
- Tatyana Andryushchenko
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Tatyana N. Andryushchenko

Person

Patents Grantslast 30 patents

Stretchable electronics fabrication method with strain redistributi...

Bendable and stretchable electronic devices and methods

Gradient encapsulant protection of devices in stretchable electronics

Debond interconnect structures

Scalable interconnect structures with selective via posts

Debond interconnect structures

Method for forming planarizing copper in a low-k dielectric

Chemical dissolution of barrier and adhesion layers

Damascene fabrication with electrochemical layer removal

Method of fabricating damascene structures in mechanically weak int...

Patents Applicationslast 30 patents

STRETCHABLE ELECTRONICS FABRICATION METHOD WITH STRAIN REDISTRIBUTI...

GRADIENT ENCAPSULANT PROTECTION OF DEVICES IN STRETCHABLE ELECTRONICS

BENDABLE AND STRETCHABLE ELECTRONIC DEVICES AND METHODS

DEBOND INTERCONNECT STRUCTURES

DEBOND INTERCONNECT STRUCTURES

Ultrasonic electropolishing of conductive material

Chemical dissolution of barrier and adhesion layers

Method for forming planarizing copper in a low-k dielectric

Method for copper damascence fill for forming an interconnect

Novel chemical composition to reduce defects

Reducing aluminum dissolution in high pH solutions

Damascene fabrication with electrochemical layer removal

Damascene fabrication with electrochemical layer removal

Method of fabricating damascene structures in mechanically weak int...