Taylor W. Gaines

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit package lids with polymer features
- Patent number 11,935,799
- Issue date Mar 19, 2024
- Intel Corporation
- Elah Bozorg-Grayeli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carbon based polymer thermal interface materials with polymer chain...
- Patent number 11,881,440
- Issue date Jan 23, 2024
- Intel Corporation
- Marely E. Tejeda Ferrari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC assemblies including die perimeter frames suitable for containin...
- Patent number 11,842,944
- Issue date Dec 12, 2023
- Intel Corporation
- Kyle Arrington
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic package with underfilled sealant
- Patent number 11,710,672
- Issue date Jul 25, 2023
- Intel Corporation
- Taylor William Gaines
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultraviolet (UV)-curable sealant in a microelectronic package
- Patent number 11,710,677
- Issue date Jul 25, 2023
- Intel Corporation
- Taylor William Gaines
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Semiconductor die package with warpage management and process for f...
- Patent number 11,676,876
- Issue date Jun 13, 2023
- Intel Corporation
- Ziyin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aliphatic polysulfones with improved mechanical integrity
- Patent number 11,370,887
- Issue date Jun 28, 2022
- University of Florida Research Foundation, Incorporated
- Kenneth B. Wagener
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Aliphatic polysulfones with improved mechanical integrity
- Patent number 11,001,673
- Issue date May 11, 2021
- University of Florida Research Foundation, Incorporated
- Kenneth B. Wagener
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Aliphatic polysulfones with improved mechanical integrity
- Patent number 10,894,864
- Issue date Jan 19, 2021
- University of Florida Research Foundation, Inc.
- Kenneth B. Wagener
- C02 - TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
Information Patent Grant
Sulfonated polyethylene
- Patent number 9,724,686
- Issue date Aug 8, 2017
- University of Florida Research Foundation, Inc.
- Taylor W. Gaines
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
STACKED DIE ARCHITECTURES WITH IMPROVED THERMAL MANAGEMENT
- Publication number 20210375719
- Publication date Dec 2, 2021
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDERFILL FLOW MANAGEMENT IN ELECTRONIC ASSEMBLIES
- Publication number 20210343677
- Publication date Nov 4, 2021
- Intel Corporation
- Frederick W. Atadana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMPROVING THE MECHANICAL INTEGRITY OF POLYSULFONIC ACIDS
- Publication number 20210269572
- Publication date Sep 2, 2021
- University of Florida Research Foundation, Incorporated
- Kenneth B. WAGENER
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CARBON BASED POLYMER THERMAL INTERFACE MATERIALS WITH POLYMER CHAIN...
- Publication number 20210265238
- Publication date Aug 26, 2021
- Intel Corporation
- Marely E. Tejeda Ferrari
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ALIPHATIC POLYSULFONES WITH IMPROVED MECHANICAL INTEGRITY
- Publication number 20210214505
- Publication date Jul 15, 2021
- University of Florida Research Foundation, Inc.
- Kenneth B. WAGENER
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
IC ASSEMBLIES INCLUDING DIE PERIMETER FRAMES SUITABLE FOR CONTAININ...
- Publication number 20210202348
- Publication date Jul 1, 2021
- Intel Corporation
- Kyle Arrington
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE WITH WARPAGE MANAGEMENT AND PROCESS FOR F...
- Publication number 20210066152
- Publication date Mar 4, 2021
- Intel Corporation
- Ziyin LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRAVIOLET (UV)-CURABLE SEALANT IN A MICROELECTRONIC PACKAGE
- Publication number 20210013123
- Publication date Jan 14, 2021
- Intel Corporation
- Taylor William Gaines
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
MICROELECTRONIC PACKAGE WITH UNDERFILLED SEALANT
- Publication number 20210013115
- Publication date Jan 14, 2021
- Intel Corporation
- Taylor William Gaines
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE LIDS WITH POLYMER FEATURES
- Publication number 20200411395
- Publication date Dec 31, 2020
- Intel Corporation
- Elah Bozorg-Grayeli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAYER FOR ETCHED IDENTIFICATION MARKS ON A PACKAGE
- Publication number 20200388576
- Publication date Dec 10, 2020
- Intel Corporation
- Taylor GAINES
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICRO-ELECTRONIC PACKAGE WITH BARRIER STRUCTURE
- Publication number 20200006169
- Publication date Jan 2, 2020
- Intel Corporation
- William WARREN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC ENCAPSULANT FOR PACKAGE MAGNETIC INDUCTORS
- Publication number 20200005983
- Publication date Jan 2, 2020
- Intel Corporation
- Malavarayan SANKARASUBRAMANIAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALIPHATIC POLYSULFONES WITH IMPROVED MECHANICAL INTEGRITY
- Publication number 20190382533
- Publication date Dec 19, 2019
- University of Florida Research Foundation, Inc.
- Kenneth B. WAGENER
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
STACKED DIE ARCHITECTURES WITH IMPROVED THERMAL MANAGEMENT
- Publication number 20190214328
- Publication date Jul 11, 2019
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BICONTINUOUS POROUS CERAMIC COMPOSITE FOR SEMICONDUCTOR PACKAGE APP...
- Publication number 20190206753
- Publication date Jul 4, 2019
- Intel Corporation
- Taylor GAINES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT COUPLING VIA PLURALITY OF ADHESIVE ELEMENTS
- Publication number 20190202136
- Publication date Jul 4, 2019
- Intel Corporation
- Taylor GAINES
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
ALIPHATIC POLYSULFONES WITH IMPROVED MECHANICAL INTEGRITY
- Publication number 20190144611
- Publication date May 16, 2019
- University of Florida Research Foundation, Inc.
- Kenneth B. WAGENER
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CONDUCTIVE ADHESIVE LAYER FOR SEMICONDUCTOR DEVICES AND PACKAGES
- Publication number 20180342463
- Publication date Nov 29, 2018
- Intel Corporation
- Taylor GAINES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELDING FOR SEMICONDUCTOR OPTOELECTRONIC DEVICES AND PACKAGES
- Publication number 20180235075
- Publication date Aug 16, 2018
- Intel Corporation
- Taylor Gaines
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE ADHESIVE LAYER FOR SEMICONDUCTOR DEVICES AND PACKAGES
- Publication number 20180190593
- Publication date Jul 5, 2018
- Intel Corporation
- Taylor GAINES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sulfonated Polyethylene
- Publication number 20160129436
- Publication date May 12, 2016
- University of Florida Research Foundation, Inc.
- Taylor W. Gaines
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL

Taylor W. Gaines

Person

Patents Grantslast 30 patents

Integrated circuit package lids with polymer features

Carbon based polymer thermal interface materials with polymer chain...

IC assemblies including die perimeter frames suitable for containin...

Microelectronic package with underfilled sealant

Ultraviolet (UV)-curable sealant in a microelectronic package

Semiconductor die package with warpage management and process for f...

Aliphatic polysulfones with improved mechanical integrity

Aliphatic polysulfones with improved mechanical integrity

Aliphatic polysulfones with improved mechanical integrity

Sulfonated polyethylene

Patents Applicationslast 30 patents

STACKED DIE ARCHITECTURES WITH IMPROVED THERMAL MANAGEMENT

UNDERFILL FLOW MANAGEMENT IN ELECTRONIC ASSEMBLIES

IMPROVING THE MECHANICAL INTEGRITY OF POLYSULFONIC ACIDS

CARBON BASED POLYMER THERMAL INTERFACE MATERIALS WITH POLYMER CHAIN...

ALIPHATIC POLYSULFONES WITH IMPROVED MECHANICAL INTEGRITY

IC ASSEMBLIES INCLUDING DIE PERIMETER FRAMES SUITABLE FOR CONTAININ...

SEMICONDUCTOR DIE PACKAGE WITH WARPAGE MANAGEMENT AND PROCESS FOR F...

ULTRAVIOLET (UV)-CURABLE SEALANT IN A MICROELECTRONIC PACKAGE

MICROELECTRONIC PACKAGE WITH UNDERFILLED SEALANT

INTEGRATED CIRCUIT PACKAGE LIDS WITH POLYMER FEATURES

LAYER FOR ETCHED IDENTIFICATION MARKS ON A PACKAGE

MICRO-ELECTRONIC PACKAGE WITH BARRIER STRUCTURE

MAGNETIC ENCAPSULANT FOR PACKAGE MAGNETIC INDUCTORS

ALIPHATIC POLYSULFONES WITH IMPROVED MECHANICAL INTEGRITY

STACKED DIE ARCHITECTURES WITH IMPROVED THERMAL MANAGEMENT

BICONTINUOUS POROUS CERAMIC COMPOSITE FOR SEMICONDUCTOR PACKAGE APP...

COMPONENT COUPLING VIA PLURALITY OF ADHESIVE ELEMENTS

ALIPHATIC POLYSULFONES WITH IMPROVED MECHANICAL INTEGRITY

CONDUCTIVE ADHESIVE LAYER FOR SEMICONDUCTOR DEVICES AND PACKAGES

SHIELDING FOR SEMICONDUCTOR OPTOELECTRONIC DEVICES AND PACKAGES

CONDUCTIVE ADHESIVE LAYER FOR SEMICONDUCTOR DEVICES AND PACKAGES

Sulfonated Polyethylene