Tchefor Ndukum

Person

Chandler, AZ, US

People

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE SUBSTRATE DICING AND EDGE PASSIVATION
- Publication number 20250210586
- Publication date Jun 26, 2025
- Intel Corporation
- Praveen SREERAMAGIRI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEEP CAVITY ARRANGEMENTS ON INTEGRATED CIRCUIT PACKAGING
- Publication number 20250112124
- Publication date Apr 3, 2025
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEEP CAVITY METALLIZATION AND FIDUCIAL ARRANGEMENTS FOR EMBEDDED DI...
- Publication number 20250112162
- Publication date Apr 3, 2025
- Intel Corporation
- Zheng Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS MITIGATION ARCHITECTURES FOR GLASS CORE SUBSTRATES
- Publication number 20250112140
- Publication date Apr 3, 2025
- Intel Corporation
- Rahul BHURE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRY SEED REMOVAL BY LASER FOR LINE-SPACE AND VIA FORMATION
- Publication number 20240332153
- Publication date Oct 3, 2024
- Intel Corporation
- Tchefor NDUKUM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRY METHOD FOR METAL-DEFINED PAD FORMATION
- Publication number 20240181572
- Publication date Jun 6, 2024
- Intel Corporation
- Tchefor NDUKUM
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICROELECTRONIC ASSEMBLIES HAVING POWER DELIVERY ROUTED THROUGH A B...
- Publication number 20240079337
- Publication date Mar 7, 2024
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING ARCHITECTURE WITH CAVITIES FOR EMBEDDED INTERCONNECT BRIDGES
- Publication number 20230420378
- Publication date Dec 28, 2023
- Intel Corporation
- Sameer Paital
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO EMBED HOST DIES IN A SUBSTRATE
- Publication number 20230092903
- Publication date Mar 23, 2023
- Intel Corporation
- Sameer Paital
- H01 - BASIC ELECTRIC ELEMENTS

Tchefor Ndukum

Person

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE SUBSTRATE DICING AND EDGE PASSIVATION

DEEP CAVITY ARRANGEMENTS ON INTEGRATED CIRCUIT PACKAGING

DEEP CAVITY METALLIZATION AND FIDUCIAL ARRANGEMENTS FOR EMBEDDED DI...

STRESS MITIGATION ARCHITECTURES FOR GLASS CORE SUBSTRATES

DRY SEED REMOVAL BY LASER FOR LINE-SPACE AND VIA FORMATION

DRY METHOD FOR METAL-DEFINED PAD FORMATION

MICROELECTRONIC ASSEMBLIES HAVING POWER DELIVERY ROUTED THROUGH A B...

PACKAGING ARCHITECTURE WITH CAVITIES FOR EMBEDDED INTERCONNECT BRIDGES

METHODS AND APPARATUS TO EMBED HOST DIES IN A SUBSTRATE