Te-Chi Wong

Person

Yijhu Township, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Manufacturing method of semiconductor package including forming cav...
- Patent number 12,205,861
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Meng-Liang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including a circuit substrate having a cavity...
- Patent number 11,908,764
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Meng-Liang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film solar cell module of see-through type
- Patent number 8,344,245
- Issue date Jan 1, 2013
- Industrial Technology Research Institute
- Jian-Shu Wu
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Structure of thermal resistive layer and the method of forming the...
- Patent number 8,029,890
- Issue date Oct 4, 2011
- Industrial Technology Research Institute
- Jung-Fang Chang
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for fabricating clamping device for flexible substrate
- Patent number 8,011,085
- Issue date Sep 6, 2011
- Industrial Technology Research Institute
- Chin-Jyi Wu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Thin film solar cell module of see-through type
- Patent number 7,982,127
- Issue date Jul 19, 2011
- Industrial Technology Research Institute
- Jian-Shu Wu
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Method for fabricating a clamping device for flexible substrate
- Patent number 7,926,170
- Issue date Apr 19, 2011
- Industrial Technology Research Institute
- Chin-Jyi Wu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Bifacial thin film solar cell and method for making the same
- Patent number 7,804,023
- Issue date Sep 28, 2010
- Industrial Technology Research Institute
- Te-Chi Wong
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Clamping device for flexible substrate
- Patent number 7,591,066
- Issue date Sep 22, 2009
- Industrial Technology Research Institute
- Chin-Jyi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabricating method for flexible thin film transistor array substrate
- Patent number 7,279,401
- Issue date Oct 9, 2007
- Industrial Technology Research Institute
- Te-chi Wong
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FLIP CHIP PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20250112166
- Publication date Apr 3, 2025
- MEDIATEK INC.
- Pei-Haw Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20250105080
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Liang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20240243098
- Publication date Jul 18, 2024
- MEDIATEK INC.
- Pei-Haw Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240194556
- Publication date Jun 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Liang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORELESS SUBSTRATE PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20240178159
- Publication date May 30, 2024
- MEDIATEK INC.
- Pei-Haw Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20230386956
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Liang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230067914
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Liang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING THE STRUCTURE OF THERMAL RESISTIVE LAYER
- Publication number 20110297550
- Publication date Dec 8, 2011
- Industrial Technology Research Institute
- Jung-Fang Chang
- B32 - LAYERED PRODUCTS
Information Patent Application
THIN FILM SOLAR CELL MODULE OF SEE-THROUGH TYPE
- Publication number 20110240092
- Publication date Oct 6, 2011
- Industrial Technology Research Institute
- Jian-Shu Wu
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
STRUCTURE OF THERMAL RESISTIVE LAYER AND THE METHOD OF FORMING THE...
- Publication number 20100080977
- Publication date Apr 1, 2010
- Industrial Technology Research Institute
- Jung-Fang Chang
- B32 - LAYERED PRODUCTS
Information Patent Application
CLAMPING DEVICE FOR FLEXIBLE SUBSTRATE AND METHOD FOR FABRICATING T...
- Publication number 20090300898
- Publication date Dec 10, 2009
- Industrial Technology Research Institute
- CHIN-JYI WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLAMPING DEVICE FOR FLEXIBLE SUBSTRATE AND METHOD FOR FABRICATING T...
- Publication number 20090300897
- Publication date Dec 10, 2009
- Industrial Technology Research Institute
- CHIN-JYI WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSPARENT SOLAR CELL MODULE
- Publication number 20090277500
- Publication date Nov 12, 2009
- Industrial Technology Research Institute
- Te-Chi Wong
- G02 - OPTICS
Information Patent Application
ELEMENT OF LOW TEMPERATURE POLY-SILICON THIN FILM AND METHOD OF MAK...
- Publication number 20090155988
- Publication date Jun 18, 2009
- INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- I-Hsuan Peng
- C30 - CRYSTAL GROWTH
Information Patent Application
BIFACIAL THIN FILM SOLAR CELL AND METHOD FOR MAKING THE SAME
- Publication number 20080257399
- Publication date Oct 23, 2008
- Industrial Technology Research Institute
- Te-Chi Wong
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
THIN FILM SOLAR CELL MODULE OF SEE-THROUGH TYPE AND METHOD FOR FABR...
- Publication number 20080178925
- Publication date Jul 31, 2008
- Industrial Technology Research Institute
- Jian-Shu Wu
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
LOW TEMPERATURE DIRECT DEPOSITED POLYCRYSTALLINE SILICON THIN FILM...
- Publication number 20070254399
- Publication date Nov 1, 2007
- Industrial Technology Research Institute
- Min Chuan WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Clamping device for flexible substrate and method for fabricating t...
- Publication number 20070119044
- Publication date May 31, 2007
- Chin-Jyi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Element of low temperature poly-silicon thin film and method of mak...
- Publication number 20070077735
- Publication date Apr 5, 2007
- INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- I-Hsuan Peng
- C30 - CRYSTAL GROWTH
Information Patent Application
FABRICATING METHOD FOR FLEXIBLE THIN FILM TRANSISTOR ARRAY SUBSTRATE
- Publication number 20070065993
- Publication date Mar 22, 2007
- Te-chi Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming polycrystalline silicon thin film
- Publication number 20070026647
- Publication date Feb 1, 2007
- INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Chi-Ming Chang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Structure of thermal resistive layer and the method of forming the...
- Publication number 20060093807
- Publication date May 4, 2006
- INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Jung-Fang Chang
- B32 - LAYERED PRODUCTS

Te-Chi Wong

Person

Patents Grantslast 30 patents

Manufacturing method of semiconductor package including forming cav...

Semiconductor package including a circuit substrate having a cavity...

Thin film solar cell module of see-through type

Structure of thermal resistive layer and the method of forming the...

Method for fabricating clamping device for flexible substrate

Thin film solar cell module of see-through type

Method for fabricating a clamping device for flexible substrate

Bifacial thin film solar cell and method for making the same

Clamping device for flexible substrate

Fabricating method for flexible thin film transistor array substrate

Patents Applicationslast 30 patents

FLIP CHIP PACKAGE AND FABRICATION METHOD THEREOF

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

CORELESS SUBSTRATE PACKAGE AND FABRICATION METHOD THEREOF

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

METHOD OF FORMING THE STRUCTURE OF THERMAL RESISTIVE LAYER

THIN FILM SOLAR CELL MODULE OF SEE-THROUGH TYPE

STRUCTURE OF THERMAL RESISTIVE LAYER AND THE METHOD OF FORMING THE...

CLAMPING DEVICE FOR FLEXIBLE SUBSTRATE AND METHOD FOR FABRICATING T...

CLAMPING DEVICE FOR FLEXIBLE SUBSTRATE AND METHOD FOR FABRICATING T...

TRANSPARENT SOLAR CELL MODULE

ELEMENT OF LOW TEMPERATURE POLY-SILICON THIN FILM AND METHOD OF MAK...

BIFACIAL THIN FILM SOLAR CELL AND METHOD FOR MAKING THE SAME

THIN FILM SOLAR CELL MODULE OF SEE-THROUGH TYPE AND METHOD FOR FABR...

LOW TEMPERATURE DIRECT DEPOSITED POLYCRYSTALLINE SILICON THIN FILM...

Clamping device for flexible substrate and method for fabricating t...

Element of low temperature poly-silicon thin film and method of mak...

FABRICATING METHOD FOR FLEXIBLE THIN FILM TRANSISTOR ARRAY SUBSTRATE

Method for forming polycrystalline silicon thin film

Structure of thermal resistive layer and the method of forming the...