Te-Fang Chu

Person

Nantou County, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Drying block structure and storage device
- Patent number 11,651,982
- Issue date May 16, 2023
- Winbond Electronics Corp.
- Cheng-Gang Fu
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Collaborative robot control system and method
- Patent number 11,584,009
- Issue date Feb 21, 2023
- Winbond Electronics Corp.
- Te-Wei Chu
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Electronic package, supporting structure and fabrication method the...
- Patent number 11,527,472
- Issue date Dec 13, 2022
- Siliconware Precision Industries Co., Ltd.
- Cho-Hsin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating electronic package
- Patent number 10,566,320
- Issue date Feb 18, 2020
- Siliconware Precision Industries Co., Ltd.
- Chi-Liang Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and fabrication method thereof
- Patent number 10,181,458
- Issue date Jan 15, 2019
- Siliconware Precision Industries Co., Ltd.
- Chi-Liang Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and fabrication method thereof
- Patent number 9,526,171
- Issue date Dec 20, 2016
- Siliconware Precision Industries Co., Ltd.
- Chi-Liang Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with shielding member and method of manufactu...
- Patent number 9,490,219
- Issue date Nov 8, 2016
- Siliconware Precision Industries Co., Ltd.
- Cho-Hsin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and fabrication method thereof
- Patent number 9,343,401
- Issue date May 17, 2016
- Siliconware Precision Industries Co., Ltd.
- Chi-Liang Shih
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC PACKAGE, SUPPORTING STRUCTURE AND FABRICATION METHOD THE...
- Publication number 20210305148
- Publication date Sep 30, 2021
- Siliconware Precision Industries Co., Ltd.
- Cho-Hsin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRYING BLOCK STRUCTURE AND STORAGE DEVICE
- Publication number 20210111047
- Publication date Apr 15, 2021
- WINBOND ELECTRONICS CORP.
- Cheng-Gang FU
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
COLLABORATIVE ROBOT CONTROL SYSTEM AND METHOD
- Publication number 20200368910
- Publication date Nov 26, 2020
- WINBOND ELECTRONICS CORP.
- Te-Wei CHU
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
METHOD FOR FABRICATING ELECTRONIC PACKAGE
- Publication number 20190115330
- Publication date Apr 18, 2019
- Siliconware Precision Industries Co., Ltd.
- Chi-Liang Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20170040304
- Publication date Feb 9, 2017
- Siliconware Precision Industries Co., Ltd.
- Chi-Liang Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20150366085
- Publication date Dec 17, 2015
- Siliconware Precision Industries Co., Ltd.
- Chi-Liang Shih
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20150333017
- Publication date Nov 19, 2015
- Cho-Hsin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20150243574
- Publication date Aug 27, 2015
- Siliconware Precision Industries Co., Ltd.
- Chi-Liang Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, FABRICATION METHOD THEREOF AND MOLDING COMPOUND
- Publication number 20140264958
- Publication date Sep 18, 2014
- Siliconware Precision Industries Co., Ltd.
- Tsung-Hsien Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE, FABRICATION METHOD THEREOF AND ADHESIVE COMPOUND
- Publication number 20140203771
- Publication date Jul 24, 2014
- Siliconware Precision Industries Co., Ltd.
- Tsung-Hsien Hsu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Electronic Assembly and Method for Making Electronic Devices
- Publication number 20090251878
- Publication date Oct 8, 2009
- Tsung-Hsien Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Te-Fang Chu

Person

Patents Grantslast 30 patents

Drying block structure and storage device

Collaborative robot control system and method

Electronic package, supporting structure and fabrication method the...

Method for fabricating electronic package

Electronic package and fabrication method thereof

Package structure and fabrication method thereof

Semiconductor package with shielding member and method of manufactu...

Semiconductor package and fabrication method thereof

Patents Applicationslast 30 patents

ELECTRONIC PACKAGE, SUPPORTING STRUCTURE AND FABRICATION METHOD THE...

DRYING BLOCK STRUCTURE AND STORAGE DEVICE

COLLABORATIVE ROBOT CONTROL SYSTEM AND METHOD

METHOD FOR FABRICATING ELECTRONIC PACKAGE

ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF

PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR PACKAGE, FABRICATION METHOD THEREOF AND MOLDING COMPOUND

ELECTRONIC PACKAGE, FABRICATION METHOD THEREOF AND ADHESIVE COMPOUND

Electronic Assembly and Method for Making Electronic Devices