Tejaswi K Indukuri

Person

Hillsboro, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Interconnect wires including relatively low resistivity cores
- Patent number 12,266,568
- Issue date Apr 1, 2025
- Intel Corporation
- Hui Jae Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect wires including relatively low resistivity cores
- Patent number 11,881,432
- Issue date Jan 23, 2024
- Hui Jae Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cobalt based interconnects and methods of fabrication thereof
- Patent number 11,862,563
- Issue date Jan 2, 2024
- Tahoe Research, LTD.
- Christopher J. Jezewski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect wires including relatively low resistivity cores
- Patent number 11,569,126
- Issue date Jan 31, 2023
- Intel Corporation
- Hui Jae Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cobalt based interconnects and methods of fabrication thereof
- Patent number 11,328,993
- Issue date May 10, 2022
- Intel Corporation
- Christopher J. Jezewski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Use of noble metals in the formation of conductive connectors
- Patent number 11,094,587
- Issue date Aug 17, 2021
- Intel Corporation
- Christopher J. Jezewski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Decoupled via fill
- Patent number 10,903,114
- Issue date Jan 26, 2021
- Intel Corporation
- Yuriy V. Shusterman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect wires including relatively low resistivity cores
- Patent number 10,832,951
- Issue date Nov 10, 2020
- Intel Corporation
- Hui Jae Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cobalt based interconnects and methods of fabrication thereof
- Patent number 10,700,007
- Issue date Jun 30, 2020
- Intel Corporation
- Christopher J. Jezewski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RRAM devices and their methods of fabrication
- Patent number 10,658,586
- Issue date May 19, 2020
- Intel Corporation
- James S. Clarke
- G11 - INFORMATION STORAGE
Information Patent Grant
Seam healing of metal interconnects
- Patent number 10,629,525
- Issue date Apr 21, 2020
- Intel Corporation
- Ramanan V. Chebiam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spin transfer torque memory (STTM), methods of forming the same usi...
- Patent number 10,580,975
- Issue date Mar 3, 2020
- Intel Corporation
- Mark L. Doczy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Decoupled via fill
- Patent number 10,468,298
- Issue date Nov 5, 2019
- Intel Corporation
- Yuriy V. Shusterman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spin transfer torque memory (STTM), methods of forming the same usi...
- Patent number 10,381,556
- Issue date Aug 13, 2019
- Intel Corporation
- Mark L. Doczy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Decoupled via fill
- Patent number 10,211,098
- Issue date Feb 19, 2019
- Intel Corporation
- Yuriy V. Shusterman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seam healing of metal interconnects
- Patent number 10,068,845
- Issue date Sep 4, 2018
- Intel Corporation
- Ramanan V. Chebiam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Decoupled via fill
- Patent number 10,026,649
- Issue date Jul 17, 2018
- Intel Corporation
- Yuriy V. Shusterman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cobalt based interconnects and methods of fabrication thereof
- Patent number 9,997,457
- Issue date Jun 12, 2018
- Intel Corporation
- Christopher J. Jezewski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect wires including relatively low resistivity cores
- Patent number 9,691,657
- Issue date Jun 27, 2017
- Intel Corporation
- Hui Jae Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming barrier walls, capping, or alloys /compounds within metal l...
- Patent number 9,659,869
- Issue date May 23, 2017
- Intel Corporation
- Christopher J Jezewski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cobalt based interconnects and methods of fabrication thereof
- Patent number 9,514,983
- Issue date Dec 6, 2016
- Intel Corporation
- Christopher J. Jezewski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect wires including relatively low resistivity cores
- Patent number 9,349,636
- Issue date May 24, 2016
- Intel Corporation
- Hui Jae Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual metal interconnects for improved gap-fill, reliability, and re...
- Patent number 7,867,891
- Issue date Jan 11, 2011
- Intel Corporation
- Kevin O'brien
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
COBALT BASED INTERCONNECTS AND METHODS OF FABRICATION THEREOF
- Publication number 20240145391
- Publication date May 2, 2024
- Tahoe Research, Ltd.
- Christopher J. JEZEWSKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES
- Publication number 20240112952
- Publication date Apr 4, 2024
- Intel Corporation
- HUI JAE YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEST STRUCTURES FOR A WAFER, AND ASSOCIATED DEVICES, SYSTEMS, AND M...
- Publication number 20230298951
- Publication date Sep 21, 2023
- Micron Technology, Inc.
- Chase M. Hunter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES
- Publication number 20230130273
- Publication date Apr 27, 2023
- Intel Corporation
- HUI JAE YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COBALT BASED INTERCONNECTS AND METHODS OF FABRICATION THEREOF
- Publication number 20220238451
- Publication date Jul 28, 2022
- Intel Corporation
- Christopher J. JEZEWSKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES
- Publication number 20210020502
- Publication date Jan 21, 2021
- Intel Corporation
- HUI JAE YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COBALT BASED INTERCONNECTS AND METHODS OF FABRICATION THEREOF
- Publication number 20200286836
- Publication date Sep 10, 2020
- Intel Corporation
- Christopher J. JEZEWSKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DECOUPLED VIA FILL
- Publication number 20200090992
- Publication date Mar 19, 2020
- Intel Corporation
- YURIY V. SHUSTERMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DAMASCENE-BASED APPROACHES FOR FABRICATING A PEDESTAL FOR A MAGNETI...
- Publication number 20200066967
- Publication date Feb 27, 2020
- Intel Corporation
- Satyarth SURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DECOUPLED VIA FILL
- Publication number 20190221478
- Publication date Jul 18, 2019
- Intel Corporation
- YURIY V. SHUSTERMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RRAM DEVICES AND THEIR METHODS OF FABRICATION
- Publication number 20190214559
- Publication date Jul 11, 2019
- Intel Corporation
- James S. CLARKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAYER TRANSFERRED FERROELECTRIC MEMORY DEVICES
- Publication number 20190115353
- Publication date Apr 18, 2019
- Intel Corporation
- Kevin P. O'Brien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEAM HEALING OF METAL INTERCONNECTS
- Publication number 20190088593
- Publication date Mar 21, 2019
- Intel Corporation
- Ramanan V. CHEBIAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DECOUPLED VIA FILL
- Publication number 20180350672
- Publication date Dec 6, 2018
- Intel Corporation
- YURIY V. SHUSTERMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPIN TRANSFER TORQUE MEMORY (STTM), METHODS OF FORMING THE SAME USI...
- Publication number 20180248116
- Publication date Aug 30, 2018
- Intel Corporation
- Mark L. DOCZY
- G11 - INFORMATION STORAGE
Information Patent Application
SPIN TRANSFER TORQUE MEMORY (STTM), METHODS OF FORMING THE SAME USI...
- Publication number 20180240969
- Publication date Aug 23, 2018
- Intel Corporation
- MARK L. DOCZY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COBALT BASED INTERCONNECTS AND METHODS OF FABRICATION THEREOF
- Publication number 20180211918
- Publication date Jul 26, 2018
- Intel Corporation
- Christopher J. JEZEWSKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THE USE OF NOBLE METALS IN THE FORMATION OF CONDUCTIVE CONNECTORS
- Publication number 20180151423
- Publication date May 31, 2018
- Christopher J. Jezewski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES
- Publication number 20170372950
- Publication date Dec 28, 2017
- Intel Corporation
- HUI JAE YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DECOUPLED VIA FILL
- Publication number 20170338148
- Publication date Nov 23, 2017
- Intel Corporation
- YURIY V. SHUSTERMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEAM HEALING OF METAL INTERCONNECTS
- Publication number 20170084487
- Publication date Mar 23, 2017
- Intel Corporation
- Ramanan V. CHEBIAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES
- Publication number 20160225665
- Publication date Aug 4, 2016
- Intel Corporation
- HUI JAE YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COBALT BASED INTERCONNECTS AND METHODS OF FABRICATION THEREOF
- Publication number 20150179579
- Publication date Jun 25, 2015
- Christopher J. Jezewski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES
- Publication number 20150084198
- Publication date Mar 26, 2015
- HUI JAE YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COBALT BASED INTERCONNECTS AND METHODS OF FABRICATION THEREOF
- Publication number 20140183738
- Publication date Jul 3, 2014
- Christopher J. Jezewski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL METAL INTERCONNECTS FOR IMPROVED GAP-FILL, RELIABILITY, AND RE...
- Publication number 20110079910
- Publication date Apr 7, 2011
- Kevin O'brien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dopant Enhanced Interconnect
- Publication number 20100200991
- Publication date Aug 12, 2010
- Rohan Akolkar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Dual metal interconnects for improved gap-fill, reliability, and re...
- Publication number 20100140804
- Publication date Jun 10, 2010
- Kevin O'brien
- H01 - BASIC ELECTRIC ELEMENTS

Tejaswi K Indukuri

Person

Patents Grantslast 30 patents

Interconnect wires including relatively low resistivity cores

Interconnect wires including relatively low resistivity cores

Cobalt based interconnects and methods of fabrication thereof

Interconnect wires including relatively low resistivity cores

Cobalt based interconnects and methods of fabrication thereof

Use of noble metals in the formation of conductive connectors

Decoupled via fill

Interconnect wires including relatively low resistivity cores

Cobalt based interconnects and methods of fabrication thereof

RRAM devices and their methods of fabrication

Seam healing of metal interconnects

Spin transfer torque memory (STTM), methods of forming the same usi...

Decoupled via fill

Spin transfer torque memory (STTM), methods of forming the same usi...

Decoupled via fill

Seam healing of metal interconnects

Decoupled via fill

Cobalt based interconnects and methods of fabrication thereof

Interconnect wires including relatively low resistivity cores

Forming barrier walls, capping, or alloys /compounds within metal l...

Cobalt based interconnects and methods of fabrication thereof

Interconnect wires including relatively low resistivity cores

Dual metal interconnects for improved gap-fill, reliability, and re...

Patents Applicationslast 30 patents

COBALT BASED INTERCONNECTS AND METHODS OF FABRICATION THEREOF

INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES

TEST STRUCTURES FOR A WAFER, AND ASSOCIATED DEVICES, SYSTEMS, AND M...

INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES

COBALT BASED INTERCONNECTS AND METHODS OF FABRICATION THEREOF

INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES

COBALT BASED INTERCONNECTS AND METHODS OF FABRICATION THEREOF

DECOUPLED VIA FILL

DAMASCENE-BASED APPROACHES FOR FABRICATING A PEDESTAL FOR A MAGNETI...

DECOUPLED VIA FILL

RRAM DEVICES AND THEIR METHODS OF FABRICATION

LAYER TRANSFERRED FERROELECTRIC MEMORY DEVICES

SEAM HEALING OF METAL INTERCONNECTS

DECOUPLED VIA FILL

SPIN TRANSFER TORQUE MEMORY (STTM), METHODS OF FORMING THE SAME USI...

SPIN TRANSFER TORQUE MEMORY (STTM), METHODS OF FORMING THE SAME USI...

COBALT BASED INTERCONNECTS AND METHODS OF FABRICATION THEREOF

THE USE OF NOBLE METALS IN THE FORMATION OF CONDUCTIVE CONNECTORS

INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES

DECOUPLED VIA FILL

SEAM HEALING OF METAL INTERCONNECTS

INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES

COBALT BASED INTERCONNECTS AND METHODS OF FABRICATION THEREOF

INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES

COBALT BASED INTERCONNECTS AND METHODS OF FABRICATION THEREOF

DUAL METAL INTERCONNECTS FOR IMPROVED GAP-FILL, RELIABILITY, AND RE...

Dopant Enhanced Interconnect

Dual metal interconnects for improved gap-fill, reliability, and re...