Teng H Kuah

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Encapsulation process for double-sided cooled packages
- Patent number 11,955,347
- Issue date Apr 9, 2024
- ASMPT SINGAPORE PTE. LTD.
- Teng Hock Kuah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-sided molding for encapsulating electronic devices
- Patent number 11,621,181
- Issue date Apr 4, 2023
- ASMPT SINGAPORE PTE. LTD.
- Teng Hock Kuah
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Apparatus and method for removing a film from a surface
- Patent number 11,548,273
- Issue date Jan 10, 2023
- ASMPT SINGAPORE PTE. LTD.
- Ji Yuan Hao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for processing a semiconductor device
- Patent number 11,227,779
- Issue date Jan 18, 2022
- ASM Technology Singapore Pte. Ltd.
- Jiapei Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molding system for applying a uniform clamping pressure onto a subs...
- Patent number 10,960,583
- Issue date Mar 30, 2021
- ASM Technology Singapore Pte. Ltd.
- Shu Chuen Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing wafer-level semiconductor packages
- Patent number 10,115,579
- Issue date Oct 30, 2018
- ASM Technology Singapore Pte. Ltd.
- Chun Ho Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor encapsulation system comprising a vacuum pump and a r...
- Patent number 9,947,561
- Issue date Apr 17, 2018
- ASM Technology Singapore Pte. Ltd.
- Teng Hock Kuah
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Molding press and a platen for a molding press
- Patent number 9,427,893
- Issue date Aug 30, 2016
- ASM Technology Singapore Pte. Ltd.
- Jian Xiong Su
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Optical device molding system
- Patent number 9,346,205
- Issue date May 24, 2016
- ASM Technology Singapore Pte. Ltd.
- Shu Chuen Ho
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Feed-through apparatus for a chemical vapour deposition device
- Patent number 9,279,185
- Issue date Mar 8, 2016
- ASM Technology Singapore Pte. Ltd.
- Zilan Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate carrier for molding electronic devices
- Patent number 9,199,396
- Issue date Dec 1, 2015
- ASM Technology Singapore Pte. Ltd.
- Teng Hock Kuah
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Apparatus for thin-film deposition
- Patent number 8,840,726
- Issue date Sep 23, 2014
- ASM Technology Singapore Pte. Ltd.
- Zilan Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Compression molding of an electronic device
- Patent number 8,011,917
- Issue date Sep 6, 2011
- ASM Technology Singapore Pte. Ltd.
- Ji Yuan Hao
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method and apparatus for molding a semiconductor device
- Patent number 7,241,414
- Issue date Jul 10, 2007
- ASM Technology Singapore Pte. Ltd.
- Shu C Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for reducing substrate warpage
- Patent number 6,988,879
- Issue date Jan 24, 2006
- ASM Technology Singapore Pte. Ltd.
- Shu Chuen Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an IC package
- Patent number 6,986,197
- Issue date Jan 17, 2006
- ASM Technology Singapore PTE LTD
- Jian Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pellet feeding system for a molding machine
- Patent number 6,877,933
- Issue date Apr 12, 2005
- ASM Technology Singapore Pte. Ltd.
- Shu Chuen Ho
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Molding system for semiconductor packages
- Patent number 6,869,556
- Issue date Mar 22, 2005
- ASM Technology Singapore PTE LTD
- Shu Chuen Ho
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Mold for encapsulating a semiconductor chip
- Patent number 6,860,731
- Issue date Mar 1, 2005
- ASM Technology Singapore Pte. Ltd.
- Shu Chuen Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for encapsulating leadframe-mounted integrated circuits
- Patent number 6,808,661
- Issue date Oct 26, 2004
- ASM Technology Singapore Pte. Ltd.
- See Yap Ong
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Mold and method for encapsulation of electronic device
- Patent number 6,770,163
- Issue date Aug 3, 2004
- ASM Technology Singapore Pte. Ltd.
- Teng Hock Kuah
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method of detaching a film of material from a substrate
- Patent number 6,752,896
- Issue date Jun 22, 2004
- ASM Technology Singapore PTE LTD
- See Yap Ong
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Mold cleaning apparatus
- Patent number 6,736,627
- Issue date May 18, 2004
- ASM Technology Singapore Pte. Ltd.
- Jie Liu
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Molding apparatus
- Patent number 6,709,252
- Issue date Mar 23, 2004
- ASM Technology Singapore PTE LTD
- Jie Liu
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Mold for a semiconductor chip
- Patent number 6,674,165
- Issue date Jan 6, 2004
- ASM Technology Singapore Pte. Ltd.
- Shu Chuen Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Removal of masking tape from lead frames
- Patent number 6,656,320
- Issue date Dec 2, 2003
- ASM Technology Singapore Pte. Ltd.
- See Yap Ong
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MOLDING APPARATUS HAVING WEDGE DRIVER
- Publication number 20240262019
- Publication date Aug 8, 2024
- ASMPT SINGAPORE PTE. LTD
- Teng Hock KUAH
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
APPARATUS FOR APPLYING A SINTERING FORCE VIA A COMPRESSIBLE FILM
- Publication number 20240030181
- Publication date Jan 25, 2024
- ASMPT SINGAPORE PTE. LTD
- Jiapei DING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATION PROCESS FOR DOUBLE-SIDED COOLED PACKAGES
- Publication number 20230178382
- Publication date Jun 8, 2023
- ASMPT SINGAPORE PTE. LTD
- Teng Hock KUAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE SINTER TOOL FOR BONDING SEMICONDUCTOR DEVICES
- Publication number 20220359459
- Publication date Nov 10, 2022
- ASM Technology Singapore Pte Ltd
- Jiapei DING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL-SIDED MOLDING FOR ENCAPSULATING ELECTRONIC DEVICES
- Publication number 20210351049
- Publication date Nov 11, 2021
- ASM Technology Singapore Pte Ltd
- Teng Hock KUAH
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
APPARATUS AND METHOD FOR REMOVING A FILM FROM A SURFACE
- Publication number 20210237422
- Publication date Aug 5, 2021
- ASM Technology Singapore Pte Ltd
- Ji Yuan HAO
- B32 - LAYERED PRODUCTS
Information Patent Application
APPARATUS AND METHOD FOR PROCESSING A SEMICONDUCTOR DEVICE
- Publication number 20190080939
- Publication date Mar 14, 2019
- ASM Technology Singapore Pte Ltd
- Jiapei DING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL INTEGRATED FAN-OUT WAFER LEVEL PACKAGE
- Publication number 20190006339
- Publication date Jan 3, 2019
- ASM Technology Singapore Pte Ltd
- Hon Shing, John LAU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING WAFER-LEVEL SEMICONDUCTOR PACKAGES
- Publication number 20180151342
- Publication date May 31, 2018
- ASM Technology Singapore Pte Ltd
- Chun Ho FAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDING APPARATUS INCLUDING A COMPRESSIBLE STRUCTURE
- Publication number 20180117813
- Publication date May 3, 2018
- ASM Technology Singapore Pte Ltd
- Shu Chuen HO
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
MOLDING SYSTEM FOR APPLYING A UNIFORM CLAMPING PRESSURE ONTO A SUBS...
- Publication number 20180021993
- Publication date Jan 25, 2018
- ASM Technology Singapore Pte Ltd
- Shu Chuen HO
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
SEMICONDUCTOR ENCAPSULATION SYSTEM COMPRISING A VACUUM PUMP AND A R...
- Publication number 20170252954
- Publication date Sep 7, 2017
- ASM Technology Singapore Pte Ltd
- Teng Hock KUAH
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
MOLDING PRESS AND A PLATEN FOR A MOLDING PRESS
- Publication number 20160082624
- Publication date Mar 24, 2016
- Jian Xiong SU
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
CHEMICAL VAPOUR DEPOSITION INJECTOR
- Publication number 20140284404
- Publication date Sep 25, 2014
- ASM Technology Singapore Pte Ltd
- Teng Hock KUAH
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FEED-THROUGH APPARATUS FOR A CHEMICAL VAPOUR DEPOSITION DEVICE
- Publication number 20130333620
- Publication date Dec 19, 2013
- Zilan LI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
APPARATUS FOR THIN-FILM DEPOSITION
- Publication number 20120312231
- Publication date Dec 13, 2012
- Zilan LI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE CARRIER FOR MOLDING ELECTRONIC DEVICES
- Publication number 20120013040
- Publication date Jan 19, 2012
- Teng Hock KUAH
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
COMPRESSION MOLDING OF AN ELECTRONIC DEVICE
- Publication number 20080277829
- Publication date Nov 13, 2008
- Ji Yuan HAO
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Method and apparatus for molding with reduced cull formation
- Publication number 20060175734
- Publication date Aug 10, 2006
- Xiang Chen
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Electronic device with high lead density
- Publication number 20060105501
- Publication date May 18, 2006
- ASM Technology Singapore Pte Ltd
- Teng Hock Kuah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for molding a semiconductor device
- Publication number 20050287236
- Publication date Dec 29, 2005
- ASM Technology Singapore Pte Ltd
- Shu Chuen Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic device with high lead density
- Publication number 20050248041
- Publication date Nov 10, 2005
- ATM Technology Singapore Pte Ltd
- Teng Hock Kuah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cleaning of an electronic device
- Publication number 20040194803
- Publication date Oct 7, 2004
- ASM Technology Singapore Pte Ltd
- Shu Chuen Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method for reducing substrate warpage
- Publication number 20040077130
- Publication date Apr 22, 2004
- ASM Technology Singapore Pte Ltd
- Shu Chuen Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Molding system for semiconductor packages
- Publication number 20040012119
- Publication date Jan 22, 2004
- ASM Technology Singapore Pte Ltd
- Shu Chuen Ho
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Method of manufacturing an IC package
- Publication number 20040003497
- Publication date Jan 8, 2004
- ASM Technology Singapore Pte Ltd
- Jian Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and apparatus for cleaning an IC encapsulation system
- Publication number 20030107142
- Publication date Jun 12, 2003
- ASM Technology Singapore Pte Ltd
- See Yap Ong
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Pellet feeding system for a moulding machine
- Publication number 20030054067
- Publication date Mar 20, 2003
- ASM Technology Singapore Pte Ltd
- Shu Chuen Ho
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Mold
- Publication number 20030034555
- Publication date Feb 20, 2003
- ASM Technology Singapore Pte Ltd
- Shu Chuen Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of detaching a film of material from a substrate
- Publication number 20030010430
- Publication date Jan 16, 2003
- See Yap Ong
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Teng H Kuah

Person

Patents Grantslast 30 patents

Encapsulation process for double-sided cooled packages

Dual-sided molding for encapsulating electronic devices

Apparatus and method for removing a film from a surface

Apparatus and method for processing a semiconductor device

Molding system for applying a uniform clamping pressure onto a subs...

Method for manufacturing wafer-level semiconductor packages

Semiconductor encapsulation system comprising a vacuum pump and a r...

Molding press and a platen for a molding press

Optical device molding system

Feed-through apparatus for a chemical vapour deposition device

Substrate carrier for molding electronic devices

Apparatus for thin-film deposition

Compression molding of an electronic device

Method and apparatus for molding a semiconductor device

Apparatus and method for reducing substrate warpage

Method of manufacturing an IC package

Pellet feeding system for a molding machine

Molding system for semiconductor packages

Mold for encapsulating a semiconductor chip

Method for encapsulating leadframe-mounted integrated circuits

Mold and method for encapsulation of electronic device

Method of detaching a film of material from a substrate

Mold cleaning apparatus

Molding apparatus

Mold for a semiconductor chip

Removal of masking tape from lead frames

Patents Applicationslast 30 patents

MOLDING APPARATUS HAVING WEDGE DRIVER

APPARATUS FOR APPLYING A SINTERING FORCE VIA A COMPRESSIBLE FILM

ENCAPSULATION PROCESS FOR DOUBLE-SIDED COOLED PACKAGES

FLEXIBLE SINTER TOOL FOR BONDING SEMICONDUCTOR DEVICES

DUAL-SIDED MOLDING FOR ENCAPSULATING ELECTRONIC DEVICES

APPARATUS AND METHOD FOR REMOVING A FILM FROM A SURFACE

APPARATUS AND METHOD FOR PROCESSING A SEMICONDUCTOR DEVICE

THREE-DIMENSIONAL INTEGRATED FAN-OUT WAFER LEVEL PACKAGE

METHOD FOR MANUFACTURING WAFER-LEVEL SEMICONDUCTOR PACKAGES

MOLDING APPARATUS INCLUDING A COMPRESSIBLE STRUCTURE

MOLDING SYSTEM FOR APPLYING A UNIFORM CLAMPING PRESSURE ONTO A SUBS...

SEMICONDUCTOR ENCAPSULATION SYSTEM COMPRISING A VACUUM PUMP AND A R...

MOLDING PRESS AND A PLATEN FOR A MOLDING PRESS

CHEMICAL VAPOUR DEPOSITION INJECTOR

FEED-THROUGH APPARATUS FOR A CHEMICAL VAPOUR DEPOSITION DEVICE

APPARATUS FOR THIN-FILM DEPOSITION

SUBSTRATE CARRIER FOR MOLDING ELECTRONIC DEVICES

COMPRESSION MOLDING OF AN ELECTRONIC DEVICE

Method and apparatus for molding with reduced cull formation

Electronic device with high lead density

Method and apparatus for molding a semiconductor device

Electronic device with high lead density

Cleaning of an electronic device

Apparatus and method for reducing substrate warpage

Molding system for semiconductor packages

Method of manufacturing an IC package

Methods and apparatus for cleaning an IC encapsulation system

Pellet feeding system for a moulding machine

Mold

Method of detaching a film of material from a substrate