Teppei Iwase

Person

Neyagawa-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Mold, imprint device, and imprint method
- Patent number 10,866,509
- Issue date Dec 15, 2020
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Akihiro Ishikawa
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Film structural member
- Patent number 10,578,775
- Issue date Mar 3, 2020
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Keitaro Fujii
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Imprinting method and imprinting device
- Patent number 10,105,874
- Issue date Oct 23, 2018
- Panasonic Intellectial Property Management Co., Ltd.
- Teppei Iwase
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Imprinting device
- Patent number 9,950,463
- Issue date Apr 24, 2018
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Akihiro Ishikawa
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Expanded semiconductor chip and semiconductor device
- Patent number 9,136,219
- Issue date Sep 15, 2015
- Panasonic Corporation
- Teppei Iwase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,766,418
- Issue date Jul 1, 2014
- Panasonic Corporation
- Teppei Iwase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device mounted structure and its manufacturing method...
- Patent number 8,426,965
- Issue date Apr 23, 2013
- Panasonic Corporation
- Teppei Iwase
- B30 - PRESSES
Information Patent Grant
Semiconductor assembly and multilayer wiring board
- Patent number 8,283,570
- Issue date Oct 9, 2012
- Panasonic Corporation
- Yoshihiro Tomura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device mounted structure and its manufacturing method...
- Patent number 8,264,079
- Issue date Sep 11, 2012
- Panasonic Corporation
- Teppei Iwase
- B30 - PRESSES
Information Patent Grant
Semiconductor device mounted structure with an underfill sealing-bo...
- Patent number 8,106,521
- Issue date Jan 31, 2012
- Panasonic Corporation
- Teppei Iwase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,050,049
- Issue date Nov 1, 2011
- Panasonic Corporation
- Teppei Iwase
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor chip and semiconductor device
- Patent number 7,994,638
- Issue date Aug 9, 2011
- Panasonic Corporation
- Yoshihiro Tomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting process simulation system and method thereof
- Patent number 7,904,281
- Issue date Mar 8, 2011
- Panasonic Corporation
- Masaki Okamoto
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for analyzing component mounting board
- Patent number 7,873,932
- Issue date Jan 18, 2011
- Panasonic Corporation
- Manabu Kakino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
MOLD, IMPRINT DEVICE, AND IMPRINT METHOD
- Publication number 20180321584
- Publication date Nov 8, 2018
- AKIHIRO ISHIKAWA
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
FILM STRUCTURAL MEMBER
- Publication number 20180267209
- Publication date Sep 20, 2018
- Panasonic Intellectual Property Management Co., Ltd.
- KEITARO FUJII
- G02 - OPTICS
Information Patent Application
IMPRINTING METHOD AND IMPRINTING DEVICE
- Publication number 20160332341
- Publication date Nov 17, 2016
- Panasonic Intellectual Property Management Co., Ltd.
- TEPPEI IWASE
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
IMPRINTING DEVICE
- Publication number 20160257062
- Publication date Sep 8, 2016
- Panasonic Intellectual Property Management Co., Ltd.
- AKIHIRO ISHIKAWA
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
OPTICAL MEMBER AND OPTICAL APPARATUS
- Publication number 20150362634
- Publication date Dec 17, 2015
- Panasonic Intellectual Property Management Co., Ltd.
- Teppei IWASE
- G02 - OPTICS
Information Patent Application
EXPANDED SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE
- Publication number 20140124957
- Publication date May 8, 2014
- PANASONIC CORPORATION
- TEPPEI IWASE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140124911
- Publication date May 8, 2014
- PANASONIC CORPORATION
- TEPPEI IWASE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MOUNTED STRUCTURE AND ITS MANUFACTURING METHOD...
- Publication number 20120298310
- Publication date Nov 29, 2012
- Teppei Iwase
- B30 - PRESSES
Information Patent Application
SEMICONDUCTOR ASSEMBLY AND MULTILAYER WIRING BOARD
- Publication number 20110279996
- Publication date Nov 17, 2011
- Yoshihiro Tomura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE MOUNTED STRUCTURE AND SEMICONDUCTOR DEVICE MOU...
- Publication number 20110001233
- Publication date Jan 6, 2011
- Teppei Iwase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20100265683
- Publication date Oct 21, 2010
- Panasonic Corporation
- Teppei IWASE
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SEMICONDUCTOR DEVICE MOUNTED STRUCTURE AND ITS MANUFACTURING METHOD...
- Publication number 20100181667
- Publication date Jul 22, 2010
- Teppei Iwase
- B30 - PRESSES
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20100127382
- Publication date May 27, 2010
- Toshitaka AKAHOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE
- Publication number 20100032832
- Publication date Feb 11, 2010
- PANASONIC CORPORATION
- Yoshihiro Tomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Analyzing Component Mounting Board
- Publication number 20080168413
- Publication date Jul 10, 2008
- Matsushita Electric Industrial Co., Ltd.
- Manabu Kakino
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Mounting process simulation system and method thereof
- Publication number 20050038641
- Publication date Feb 17, 2005
- Matsushita Electric Industrial Co., Ltd.
- Masaki Okamoto
- G06 - COMPUTING CALCULATING COUNTING

Teppei Iwase

Person

Patents Grantslast 30 patents

Mold, imprint device, and imprint method

Film structural member

Imprinting method and imprinting device

Imprinting device

Expanded semiconductor chip and semiconductor device

Semiconductor device

Semiconductor device mounted structure and its manufacturing method...

Semiconductor assembly and multilayer wiring board

Semiconductor device mounted structure and its manufacturing method...

Semiconductor device mounted structure with an underfill sealing-bo...

Semiconductor device

Semiconductor chip and semiconductor device

Mounting process simulation system and method thereof

Method for analyzing component mounting board

Patents Applicationslast 30 patents

MOLD, IMPRINT DEVICE, AND IMPRINT METHOD

FILM STRUCTURAL MEMBER

IMPRINTING METHOD AND IMPRINTING DEVICE

IMPRINTING DEVICE

OPTICAL MEMBER AND OPTICAL APPARATUS

EXPANDED SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE MOUNTED STRUCTURE AND ITS MANUFACTURING METHOD...

SEMICONDUCTOR ASSEMBLY AND MULTILAYER WIRING BOARD

SEMICONDUCTOR DEVICE MOUNTED STRUCTURE AND SEMICONDUCTOR DEVICE MOU...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE MOUNTED STRUCTURE AND ITS MANUFACTURING METHOD...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE

Method for Analyzing Component Mounting Board

Mounting process simulation system and method thereof