Terrence Caskey

Person

Santa Cruz, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method and structures for heat dissipating interposers
- Patent number 10,475,733
- Issue date Nov 12, 2019
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating low CTE interposer without TSV structure
- Patent number 10,396,114
- Issue date Aug 27, 2019
- Invensas Corporation
- Charles G. Woychik
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
BVA interposer
- Patent number 10,297,582
- Issue date May 21, 2019
- Invensas Corporation
- Terrence Caskey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a carrier-less silicon interposer
- Patent number 10,181,411
- Issue date Jan 15, 2019
- Invensas Corporation
- Michael Newman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and structures for heat dissipating interposers
- Patent number 10,103,094
- Issue date Oct 16, 2018
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliable device assembly
- Patent number 9,893,030
- Issue date Feb 13, 2018
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic package with stacked microelectronic units and meth...
- Patent number 9,876,002
- Issue date Jan 23, 2018
- Invensas Corporation
- Terrence Caskey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures for heat dissipating interposers
- Patent number 9,685,401
- Issue date Jun 20, 2017
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assembly for microelectronic packaging with bond el...
- Patent number 9,615,456
- Issue date Apr 4, 2017
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin wafer handling and known good die test method
- Patent number 9,601,398
- Issue date Mar 21, 2017
- Invensas Corporation
- Charles G. Woychik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic package with stacked microelectronic units and meth...
- Patent number 9,583,475
- Issue date Feb 28, 2017
- Invensas Corporation
- Terrence Caskey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating low CTE interposer without TSV structure
- Patent number 9,558,964
- Issue date Jan 31, 2017
- Invensas Corporation
- Charles G. Woychik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
BVA interposer
- Patent number 9,502,390
- Issue date Nov 22, 2016
- Invensas Corporation
- Terrence Caskey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-stress TSV design using conductive particles
- Patent number 9,433,100
- Issue date Aug 30, 2016
- Tessera, Inc.
- Charles G. Woychik
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming a reliable microelectronic assembly
- Patent number 9,398,700
- Issue date Jul 19, 2016
- Invensas Corporation
- Cyprian Emeka Uzoh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal PVD-free conducting structures
- Patent number 9,379,008
- Issue date Jun 28, 2016
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and structure for carrier-less thin wafer handling
- Patent number 9,355,905
- Issue date May 31, 2016
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduced stress TSV and interposer structures
- Patent number 9,349,669
- Issue date May 24, 2016
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier-less silicon interposer
- Patent number 9,237,648
- Issue date Jan 12, 2016
- Invensas Corporation
- Michael Newman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microelectronic package with stacked microelectronic units and meth...
- Patent number 9,165,911
- Issue date Oct 20, 2015
- Invensas Corporation
- Terrence Caskey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structures for heat dissipating interposers
- Patent number 9,123,780
- Issue date Sep 1, 2015
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure for microelectronic packaging with bond elements to encap...
- Patent number 9,095,074
- Issue date Jul 28, 2015
- Invensas Corporation
- Belgacem Haba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods and structure for carrier-less thin wafer handling
- Patent number 9,064,933
- Issue date Jun 23, 2015
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduced stress TSV and interposer structures
- Patent number 9,000,600
- Issue date Apr 7, 2015
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal PVD-free conducting structures
- Patent number 8,981,564
- Issue date Mar 17, 2015
- Invensas Corporation
- Charles G. Woychik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low CTE interposer without TSV structure
- Patent number 8,884,427
- Issue date Nov 11, 2014
- Invensas Corporation
- Charles G. Woychik
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure for microelectronic packaging with bond elements to encap...
- Patent number 8,878,353
- Issue date Nov 4, 2014
- Invensas Corporation
- Belgacem Haba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thin wafer handling and known good die test method
- Patent number 8,846,447
- Issue date Sep 30, 2014
- Invensas Corporation
- Charles G. Woychik
- G01 - MEASURING TESTING
Information Patent Grant
High strength through-substrate vias
- Patent number 8,785,790
- Issue date Jul 22, 2014
- Invensas Corporation
- Cyprian Emeka Uzoh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reduced stress TSV and interposer structures
- Patent number 8,772,946
- Issue date Jul 8, 2014
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND STRUCTURES FOR HEAT DISSIPATING INTERPOSERS
- Publication number 20190139878
- Publication date May 9, 2019
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURES FOR HEAT DISSIPATING INTERPOSERS
- Publication number 20170365546
- Publication date Dec 21, 2017
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING LOW CTE INTERPOSER WITHOUT TSV STRUCTURE
- Publication number 20170194373
- Publication date Jul 6, 2017
- Invensas Corporation
- Charles G. Woychik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGE WITH STACKED MICROELECTRONIC UNITS AND METH...
- Publication number 20170141094
- Publication date May 18, 2017
- Invensas Corporation
- Terrence Caskey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reliable Device Assembly
- Publication number 20160329290
- Publication date Nov 10, 2016
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BVA INTERPOSER
- Publication number 20160079214
- Publication date Mar 17, 2016
- Invensas Corporation
- Terrence Caskey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER-LESS SILICON INTERPOSER
- Publication number 20160079090
- Publication date Mar 17, 2016
- Invensas Corporation
- Michael Newman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGE WITH STACKED MICROELECTRONIC UNITS AND METH...
- Publication number 20160035712
- Publication date Feb 4, 2016
- Invensas Corporation
- Terrence Caskey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURES FOR HEAT DISSIPATING INTERPOSERS
- Publication number 20150340310
- Publication date Nov 26, 2015
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE FOR MICROELECTRONIC PACKAGING WITH BOND ELEMENTS TO ENCAP...
- Publication number 20150334831
- Publication date Nov 19, 2015
- Invensas Corporation
- Belgacem Haba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS AND STRUCTURE FOR CARRIER-LESS THIN WAFER HANDLING
- Publication number 20150255345
- Publication date Sep 10, 2015
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCED STRESS TSV AND INTERPOSER STRUCTURES
- Publication number 20150187673
- Publication date Jul 2, 2015
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL PVD-FREE CONDUCTING STRUCTURES
- Publication number 20150162241
- Publication date Jun 11, 2015
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH STRENGTH THROUGH-SUBSTRATE VIAS
- Publication number 20150146393
- Publication date May 28, 2015
- Invensas Corporation
- CYPRIAN EMEKA UZOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING LOW CTE INTERPOSER WITHOUT TSV STRUCTURE
- Publication number 20150044820
- Publication date Feb 12, 2015
- Invensas Corporation
- Charles G. Woychik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE FOR MICROELECTRONIC PACKAGING WITH BOND ELEMENTS TO ENCAP...
- Publication number 20150034371
- Publication date Feb 5, 2015
- Invensas Corporation
- Belgacem Haba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thin Wafer Handling and Known Good Die Test Method
- Publication number 20150014688
- Publication date Jan 15, 2015
- Invensas Corporation
- Charles G. Woychik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABLE DEVICE ASSEMBLY
- Publication number 20140376200
- Publication date Dec 25, 2014
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL PVD-FREE CONDUCTING STRUCTURES
- Publication number 20140339702
- Publication date Nov 20, 2014
- Invensas Corporation
- Charles G. Woychik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW CTE INTERPOSER WITHOUT TSV STRUCTURE
- Publication number 20140264794
- Publication date Sep 18, 2014
- Invensas Corporation
- Charles G. Woychik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER-LESS SILICON INTERPOSER
- Publication number 20140240938
- Publication date Aug 28, 2014
- Invensas Corporation
- Michael Newman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCED STRESS TSV AND INTERPOSER STRUCTURES
- Publication number 20140217607
- Publication date Aug 7, 2014
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGE WITH STACKED MICROELECTRONIC UNITS AND METH...
- Publication number 20140212996
- Publication date Jul 31, 2014
- Invensas Corporation
- Terrence Caskey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-STRESS TSV DESIGN USING CONDUCTIVE PARTICLES
- Publication number 20140201994
- Publication date Jul 24, 2014
- Tessera, Inc.
- Charles G. Woychik
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRUCTURE FOR MICROELECTRONIC PACKAGING WITH BOND ELEMENTS TO ENCAP...
- Publication number 20140175671
- Publication date Jun 26, 2014
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND STRUCTURE FOR CARRIER-LESS THIN WAFER HANDLING
- Publication number 20140179099
- Publication date Jun 26, 2014
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURES FOR HEAT DISSIPATING INTERPOSERS
- Publication number 20140167267
- Publication date Jun 19, 2014
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN WAFER HANDLING AND KNOWN GOOD DIE TEST METHOD
- Publication number 20140054763
- Publication date Feb 27, 2014
- Invensas Corporation
- Charles G. Woychik
- G01 - MEASURING TESTING
Information Patent Application
BVA INTERPOSER
- Publication number 20140036454
- Publication date Feb 6, 2014
- Invensas Corporation
- Terrence Caskey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCED STRESS TSV AND INTERPOSER STRUCTURES
- Publication number 20130328186
- Publication date Dec 12, 2013
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS

Terrence Caskey

Person

Patents Grantslast 30 patents

Method and structures for heat dissipating interposers

Method of fabricating low CTE interposer without TSV structure

BVA interposer

Method for fabricating a carrier-less silicon interposer

Method and structures for heat dissipating interposers

Reliable device assembly

Microelectronic package with stacked microelectronic units and meth...

Structures for heat dissipating interposers

Microelectronic assembly for microelectronic packaging with bond el...

Thin wafer handling and known good die test method

Microelectronic package with stacked microelectronic units and meth...

Method of fabricating low CTE interposer without TSV structure

BVA interposer

Low-stress TSV design using conductive particles

Method of forming a reliable microelectronic assembly

Metal PVD-free conducting structures

Methods and structure for carrier-less thin wafer handling

Reduced stress TSV and interposer structures

Carrier-less silicon interposer

Microelectronic package with stacked microelectronic units and meth...

Method and structures for heat dissipating interposers

Structure for microelectronic packaging with bond elements to encap...

Methods and structure for carrier-less thin wafer handling

Reduced stress TSV and interposer structures

Metal PVD-free conducting structures

Low CTE interposer without TSV structure

Structure for microelectronic packaging with bond elements to encap...

Thin wafer handling and known good die test method

High strength through-substrate vias

Reduced stress TSV and interposer structures

Patents Applicationslast 30 patents

METHOD AND STRUCTURES FOR HEAT DISSIPATING INTERPOSERS

METHOD AND STRUCTURES FOR HEAT DISSIPATING INTERPOSERS

METHOD OF FABRICATING LOW CTE INTERPOSER WITHOUT TSV STRUCTURE

MICROELECTRONIC PACKAGE WITH STACKED MICROELECTRONIC UNITS AND METH...

Reliable Device Assembly

BVA INTERPOSER

CARRIER-LESS SILICON INTERPOSER

MICROELECTRONIC PACKAGE WITH STACKED MICROELECTRONIC UNITS AND METH...

METHOD AND STRUCTURES FOR HEAT DISSIPATING INTERPOSERS

STRUCTURE FOR MICROELECTRONIC PACKAGING WITH BOND ELEMENTS TO ENCAP...

METHODS AND STRUCTURE FOR CARRIER-LESS THIN WAFER HANDLING

REDUCED STRESS TSV AND INTERPOSER STRUCTURES

METAL PVD-FREE CONDUCTING STRUCTURES

HIGH STRENGTH THROUGH-SUBSTRATE VIAS

METHOD OF FABRICATING LOW CTE INTERPOSER WITHOUT TSV STRUCTURE

STRUCTURE FOR MICROELECTRONIC PACKAGING WITH BOND ELEMENTS TO ENCAP...

Thin Wafer Handling and Known Good Die Test Method

RELIABLE DEVICE ASSEMBLY

METAL PVD-FREE CONDUCTING STRUCTURES

LOW CTE INTERPOSER WITHOUT TSV STRUCTURE

CARRIER-LESS SILICON INTERPOSER

REDUCED STRESS TSV AND INTERPOSER STRUCTURES

MICROELECTRONIC PACKAGE WITH STACKED MICROELECTRONIC UNITS AND METH...

LOW-STRESS TSV DESIGN USING CONDUCTIVE PARTICLES

STRUCTURE FOR MICROELECTRONIC PACKAGING WITH BOND ELEMENTS TO ENCAP...

METHODS AND STRUCTURE FOR CARRIER-LESS THIN WAFER HANDLING

METHOD AND STRUCTURES FOR HEAT DISSIPATING INTERPOSERS

THIN WAFER HANDLING AND KNOWN GOOD DIE TEST METHOD

BVA INTERPOSER

REDUCED STRESS TSV AND INTERPOSER STRUCTURES