Terry Alcorn

Person

Cary, NC, US

People

Patents Grantslast 30 patents

Information Patent Grant
Methods for pillar connection on frontside and passive device integ...
- Patent number 11,842,997
- Issue date Dec 12, 2023
- Wolfspeed, Inc.
- Terry Alcorn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for pillar connection on frontside and passive device integ...
- Patent number 11,769,768
- Issue date Sep 26, 2023
- Wolfspeed, Inc.
- Terry Alcorn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Field effect transistor with enhanced reliability
- Patent number 11,658,234
- Issue date May 23, 2023
- Wolfspeed, Inc.
- Kyle Bothe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for pillar connection on frontside and passive device integ...
- Patent number 11,646,310
- Issue date May 9, 2023
- Wolfspeed, Inc.
- Terry Alcorn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High electron mobility transistors and power amplifiers including s...
- Patent number 11,616,136
- Issue date Mar 28, 2023
- Wolfspeed, Inc.
- Kyle Bothe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Field effect transistor with at least partially recessed field plate
- Patent number 11,502,178
- Issue date Nov 15, 2022
- Wolfspeed, Inc.
- Kyle Bothe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stepped field plates with proximity to conduction channel and relat...
- Patent number 11,075,271
- Issue date Jul 27, 2021
- Cree, Inc.
- Evan Jones
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High electron mobility transistors and power amplifiers including s...
- Patent number 10,971,612
- Issue date Apr 6, 2021
- Cree, Inc.
- Kyle Bothe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Recessed field plate transistor structures
- Patent number 9,847,411
- Issue date Dec 19, 2017
- Cree, Inc.
- Saptharishi Sriram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cascode structures for GaN HEMTs
- Patent number 9,679,981
- Issue date Jun 13, 2017
- Cree, Inc.
- Saptharishi Sriram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level die attach metallization
- Patent number 9,536,783
- Issue date Jan 3, 2017
- Cree, Inc.
- Fabian Radulescu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level die attach metallization
- Patent number 8,970,010
- Issue date Mar 3, 2015
- Cree, Inc.
- Fabian Radulescu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS FOR PILLAR CONNECTION ON FRONTSIDE AND PASSIVE DEVICE INTEG...
- Publication number 20220208758
- Publication date Jun 30, 2022
- Wolfspeed, Inc.
- Terry Alcorn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIELD EFFECT TRANSISTOR WITH AT LEAST PARTIALLY RECESSED FIELD PLATE
- Publication number 20220130966
- Publication date Apr 28, 2022
- Wolfspeed, Inc.
- Kyle Bothe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIELD EFFECT TRANSISTOR WITH ENHANCED RELIABILITY
- Publication number 20220130985
- Publication date Apr 28, 2022
- Cree, Inc.
- Kyle Bothe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR PILLAR CONNECTION ON FRONTSIDE AND PASSIVE DEVICE INTEG...
- Publication number 20210375856
- Publication date Dec 2, 2021
- Cree, Inc.
- Terry Alcorn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Group III-Nitride High-Electron Mobility Transistors Configured wit...
- Publication number 20210359118
- Publication date Nov 18, 2021
- Cree, Inc.
- Fabian Radulescu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ELECTRON MOBILITY TRANSISTORS AND POWER AMPLIFIERS INCLUDING S...
- Publication number 20210175351
- Publication date Jun 10, 2021
- Cree, Inc.
- Kyle Bothe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STEPPED FIELD PLATES WITH PROXIMITY TO CONDUCTION CHANNEL AND RELAT...
- Publication number 20210111254
- Publication date Apr 15, 2021
- Cree, Inc.
- Evan Jones
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ELECTRON MOBILITY TRANSISTORS AND POWER AMPLIFIERS INCLUDING S...
- Publication number 20200395475
- Publication date Dec 17, 2020
- Cree, Inc.
- Kyle Bothe
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
WAFER-LEVEL DIE ATTACH METALLIZATION
- Publication number 20150140806
- Publication date May 21, 2015
- Cree, Inc.
- Fabian Radulescu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECESSED FIELD PLATE TRANSISTOR STRUCTURES
- Publication number 20140361342
- Publication date Dec 11, 2014
- Saptharishi Sriram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CASCODE STRUCTURES FOR GaN HEMTs
- Publication number 20140361341
- Publication date Dec 11, 2014
- Saptharishi Sriram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL DIE ATTACH METALLIZATION
- Publication number 20140264868
- Publication date Sep 18, 2014
- Cree, Inc.
- Fabian Radulescu
- H01 - BASIC ELECTRIC ELEMENTS

Terry Alcorn

Person

Patents Grantslast 30 patents

Methods for pillar connection on frontside and passive device integ...

Methods for pillar connection on frontside and passive device integ...

Field effect transistor with enhanced reliability

Methods for pillar connection on frontside and passive device integ...

High electron mobility transistors and power amplifiers including s...

Field effect transistor with at least partially recessed field plate

Stepped field plates with proximity to conduction channel and relat...

High electron mobility transistors and power amplifiers including s...

Recessed field plate transistor structures

Cascode structures for GaN HEMTs

Wafer-level die attach metallization

Wafer-level die attach metallization

Patents Applicationslast 30 patents

METHODS FOR PILLAR CONNECTION ON FRONTSIDE AND PASSIVE DEVICE INTEG...

FIELD EFFECT TRANSISTOR WITH AT LEAST PARTIALLY RECESSED FIELD PLATE

FIELD EFFECT TRANSISTOR WITH ENHANCED RELIABILITY

METHODS FOR PILLAR CONNECTION ON FRONTSIDE AND PASSIVE DEVICE INTEG...

Group III-Nitride High-Electron Mobility Transistors Configured wit...

HIGH ELECTRON MOBILITY TRANSISTORS AND POWER AMPLIFIERS INCLUDING S...

STEPPED FIELD PLATES WITH PROXIMITY TO CONDUCTION CHANNEL AND RELAT...

HIGH ELECTRON MOBILITY TRANSISTORS AND POWER AMPLIFIERS INCLUDING S...

WAFER-LEVEL DIE ATTACH METALLIZATION

RECESSED FIELD PLATE TRANSISTOR STRUCTURES

CASCODE STRUCTURES FOR GaN HEMTs

WAFER-LEVEL DIE ATTACH METALLIZATION