Terry Tsai

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Taichung Hsien, TW

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Patents Grantslast 30 patents

Information Patent Grant
Carrier-free semiconductor package and fabrication method thereof
- Patent number 7,314,820
- Issue date Jan 1, 2008
- Siliconware Precision Industries Co., Ltd.
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Lead-frame-based semiconductor package and lead frame thereof
- Publication number 20060151862
- Publication date Jul 13, 2006
- SILICONWARE PRECISON INDUSTRIES CO., LTD.
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Carrier-free semiconductor package and fabrication method thereof
- Publication number 20060121647
- Publication date Jun 8, 2006
- Siliconware Precision Industries Co., Ltd.
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadframe-based non-leaded semiconductor package and method of fabr...
- Publication number 20040217450
- Publication date Nov 4, 2004
- Siliconware Precision Industries Co., Ltd.
- Chun-Yuan Li
- H01 - BASIC ELECTRIC ELEMENTS